JP7103225B2 - 封止用フィルム及びその硬化物、並びに、電子装置 - Google Patents
封止用フィルム及びその硬化物、並びに、電子装置 Download PDFInfo
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- JP7103225B2 JP7103225B2 JP2018551572A JP2018551572A JP7103225B2 JP 7103225 B2 JP7103225 B2 JP 7103225B2 JP 2018551572 A JP2018551572 A JP 2018551572A JP 2018551572 A JP2018551572 A JP 2018551572A JP 7103225 B2 JP7103225 B2 JP 7103225B2
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- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- MABAWBWRUSBLKQ-UHFFFAOYSA-N ethenyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)C=C MABAWBWRUSBLKQ-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- YSEZLNANHYQLGP-UHFFFAOYSA-N hexane phenol Chemical compound C1(=CC=CC=C1)O.C1(=CC=CC=C1)O.CCCCCC YSEZLNANHYQLGP-UHFFFAOYSA-N 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- DRXHEPWCWBIQFJ-UHFFFAOYSA-N methyl(triphenoxy)silane Chemical compound C=1C=CC=CC=1O[Si](OC=1C=CC=CC=1)(C)OC1=CC=CC=C1 DRXHEPWCWBIQFJ-UHFFFAOYSA-N 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- GLTDLAUASUFHNK-UHFFFAOYSA-N n-silylaniline Chemical compound [SiH3]NC1=CC=CC=C1 GLTDLAUASUFHNK-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920006122 polyamide resin Chemical class 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- ALVYUZIFSCKIFP-UHFFFAOYSA-N triethoxy(2-methylpropyl)silane Chemical compound CCO[Si](CC(C)C)(OCC)OCC ALVYUZIFSCKIFP-UHFFFAOYSA-N 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- FBBATURSCRIBHN-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyldisulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSCCC[Si](OCC)(OCC)OCC FBBATURSCRIBHN-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- NLSXASIDNWDYMI-UHFFFAOYSA-N triphenylsilanol Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(O)C1=CC=CC=C1 NLSXASIDNWDYMI-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
(A)エポキシ樹脂としては、1分子中に2個以上のグリシジル基を有するものであれば特に制限なく用いることができる。(A)成分としては、例えば、ビスフェノールA型エポキシ樹脂、ビスフェノールAP型エポキシ樹脂、ビスフェノールAF型エポキシ樹脂、ビスフェノールB型エポキシ樹脂、ビスフェノールBP型エポキシ樹脂、ビスフェノールC型エポキシ樹脂、ビスフェノールE型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールG型エポキシ樹脂、ビスフェノールM型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、ビスフェノールP型エポキシ樹脂、ビスフェノールPH型エポキシ樹脂、ビスフェノールTMC型エポキシ樹脂、ビスフェノールZ型エポキシ樹脂、ヘキサンジオールビスフェノールSジグリシジルエーテル等のビスフェノールS型エポキシ樹脂、ノボラックフェノール型エポキシ樹脂、ビフェニル型エポキシ樹脂、ナフタレン型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、ビキシレノールジグリシジルエーテル等のビキシレノール型エポキシ樹脂、水添ビスフェノールAグリシジルエーテル等の水添ビスフェノールA型エポキシ樹脂、及びそれらの二塩基酸変性ジグリシジルエーテル型エポキシ樹脂、並びに、脂肪族エポキシ樹脂などが挙げられる。(A)成分は、1種を単独で用いてもよく、2種以上を併用してもよい。
(B)硬化剤としては、1分子中に2個以上のグリシジル基と反応する官能基を有するものであれば特に制限なく用いることができる。グリシジル基と反応する官能基としては、例えば、フェノール性水酸基、アミン、酸無水物(無水フタル酸等)が挙げられる。(B)成分としては、例えば、フェノール樹脂、酸無水物、イミダゾール化合物、脂肪族アミン、脂環族アミンが挙げられる。(B)成分は、1種を単独で用いてもよく、2種以上を併用してもよい。
(C)硬化促進剤としては、特に制限無く用いることができるが、アミン系又はリン系の硬化促進剤であってもよい。アミン系の硬化促進剤としては、例えば、イミダゾール化合物、脂肪族アミン、芳香族アミン、変性アミン、ポリアミド樹脂等が挙げられる。リン系の硬化促進剤としては、例えば、ホスフィンオキサイド、ホスホニウム塩、ダイホスフィン等の有機リン化合物が挙げられる。これらの硬化促進剤の中でも、誘導体が豊富であり、所望の活性温度を得やすい点から、(C)成分はイミダゾール化合物であってもよい。
本実施形態の封止用フィルムは、(A)~(C)成分のうちの25℃で液状である液状成分を、(A)~(D)成分の総質量を基準として20~30質量%含有する。液状成分の含有量が20質量%以上であると、(A)~(D)成分の混練物の塑性加工により封止用フィルムを得ることができ、封止用フィルムに含まれる溶剤起因の硬化成形時のふくれを抑制することができる。また、液状成分の含有量が20質量%以上であると、良好な可とう性及び良好な流動性を有する封止用フィルムを得ることができる。一方、液状成分の含有量が30質量%以下であると、厚み300μm以上の封止用フィルムを得ることができる。また、液状成分の含有量が上記範囲内であることで、封止用フィルムに良好な取り扱い性を付与することができる。上記効果をより高水準で得る観点から、液状成分の含有量は、20~28質量%であってもよく、20~25質量%であってもよい。
(D)無機充填材としては、従来公知の無機充填材が使用でき、特定のものに限定されない。(D)成分としては、例えば、硫酸バリウム、チタン酸バリウム、無定形シリカ、結晶性シリカ、溶融シリカ、球状シリカ、タルク、クレー、炭酸マグネシウム、炭酸カルシウム、酸化アルミニウム、水酸化アルミニウム、窒化ケイ素、窒化アルミニウムが挙げられる。(D)成分としては、表面改質等により、樹脂中への分散性の向上がしやすいこと、また比較的小さい熱膨張率を有することから所望の硬化膜特性が得られやすいことから、シリカ類であってもよい。
((A)成分:エポキシ樹脂)
エポキシ樹脂a:ビスフェノールF型エポキシ樹脂(三菱化学株式会社製の商品名:グレード806、エポキシ当量:160、25℃において液状)
エポキシ樹脂b:ビスフェノールA型エポキシ樹脂(三菱化学株式会社製の商品名:グレード828、エポキシ当量:185、25℃において液状)
エポキシ樹脂c:ナフタレン骨格含有多官能固形エポキシ樹脂(DIC株式会社製の商品名:EXA-4750、エポキシ当量:182、25℃において固形)
((B)成分:硬化剤)
硬化剤a:フェノールノボラック(旭有機材工業株式会社製の商品名:PAPS-PN2、フェノール性水酸基当量:104、25℃において固形)
硬化剤b:フェノールノボラック(明和化成株式会社製の商品名:MEH8000H、フェノール性水酸基当量:140、25℃において液状)
((C)成分:硬化促進剤)
硬化促進剤:イミダゾール(四国化成工業株式会社製の商品名:2PHZ-PW、25℃において固形)
((D)成分:無機充填材)
無機充填材:シリカ(株式会社アドマテックス製の商品名:SX-E2、フェニルアミノシラン処理、平均粒径5.8μm)
表1に示す処方(単位:質量%)で、各成分を配合し、ロール混練機により60~100℃、10分間溶融混練し、混練物を調製した。
表1及び表2に示す処方(単位:質量%)で、各成分を配合し、ロール混練機により60~100℃、10分間溶融混練し、混練物を調製した。
表2に示す処方(単位:質量%)で、各成分を配合した。得られた配合物に溶剤としてメチルエチルケトンを、溶剤添加後の組成物全質量の15質量%となる量で添加して、塗工用ワニス状エポキシ樹脂組成物を調製した。このワニス状エポキシ樹脂組成物を、塗工機を使用して支持体(38μm厚のポリエチレンテレフタレートフィルム)上に、以下の条件で塗布し、フィルムの厚みが250μm(支持体の厚みは含まない)の封止用フィルムを作製した。
・塗布ヘッド方式:コンマ
・塗布及び乾燥速度:1m/分
・乾燥条件(温度/炉長):110℃/3.3m、130℃/3.3m、140℃/3.3m
・ラミネーター装置:真空加圧ラミネーター(株式会社名機製作所製の商品名MVLP-500)
・ラミネート温度:90℃
・ラミネート圧力:0.5MPa
・真空引き時間:30秒
・ラミネート時間:40秒
(可とう性評価)
封止用フィルムの可とう性は、屈曲試験機を用いて次の手順で評価した。試験機として、ヨシミツ精機株式会社製の屈曲試験機(JIS型タイプ1、円筒形マンドレル法)を準備した。各実施例及び各比較例の封止用フィルムを縦50mm、横50mmに切り出して試験片を準備した。直径2mmの円筒形マンドレルに試験片の一方の面(比較例1においては支持体の面)を接触させ、試験片を135°曲げ、下記の基準で可とう性を評価した。評価結果を表1及び表2に示す。
A:135°折り曲げても割れず、ヒビも入らなかった。
B:135°折り曲げても割れなかったが、ヒビが入った。
C:135°折り曲げると割れた。
封止用フィルムの流動性は、次の手順で評価した。試験機として、TA Instruments社製のレオメータ(ARES G2)を準備した。各実施例及び各比較例の封止用フィルム0.6gを直径20mmの円形に成形し、2枚のAl平行板ではさみ、溶融粘度を測定(測定温度40~220℃、昇温速度5℃/分)した。比較例1の封止用フィルムについては、支持体を剥離してから測定した。流動性は下記の基準で評価した。評価結果を表1及び表2に示す。
A:最低溶融粘度が100Pa・s以下。
B:最低溶融粘度が100Pa・sより大きく、300Pa・s以下。
C:最低溶融粘度が300Pa・sより大きい。
封止用フィルムのふくれは次の手順で評価した。各実施例及び各比較例の封止用フィルムを縦70mm、横100mmに切り出して試験片を準備した。比較例1の封止用フィルムについては、支持体を剥離した状態とした。試験片をガラス板に貼り付け、140℃のオーブンで10分間加熱した。封止用フィルム上部及びガラス面からふくれの有無を目視で確認した。評価結果を表1及び表2に示す。
封止用フィルムにおける溶剤含有量は次の手順で算出した。各実施例及び各比較例の封止用フィルムを5cm角の試料に切り出した。比較例1の封止用フィルムについては、支持体を剥離した状態とした。この試料を予め質量を測定したアルミカップに入れて、試料が入ったアルミカップの質量を測定した。次いで、試料をアルミカップに入れたまま、180℃のオーブンで10分間加熱し、室温にて10分間放置した後、試料が入ったアルミカップの質量を再度測定した。次いで、加熱前及び加熱後の試料が入ったアルミカップの質量の測定値から、アルミカップの質量を差し引いて、加熱前及び加熱後の封止用フィルムの質量をそれぞれ求めた。そして、加熱前の封止用フィルムの質量から加熱後の封止用フィルムの質量を差し引いた重量減少の値を、溶剤の配合の有無にかかわらず、封止用フィルムに含まれる溶剤の質量とした。そして、加熱前の封止用フィルムの質量に対する溶剤の質量の割合を溶剤の含有量(溶剤量)とした。結果を表1及び表2に示す。
Claims (4)
- (A)エポキシ樹脂、(B)硬化剤、(C)硬化促進剤、及び、(D)無機充填材を含有する封止用フィルムであって、
前記(A)~(C)成分のうち25℃で液状である液状成分の含有量が、前記(A)~(D)成分の総質量を基準として20~30質量%であり、
前記(D)成分の含有量が、前記(A)~(D)成分の総質量を基準として70~80質量%であり、
溶剤の含有量が、封止用フィルムの全質量を基準として0.05質量%以下である、封止用フィルム。 - 前記(D)成分の含有量が、前記(A)~(D)成分の総質量を基準として70~78質量%である、請求項1に記載の封止用フィルム。
- 前記(D)成分の平均粒径が0.01~50μmである、請求項1又は2に記載の封止用フィルム。
- 厚みが300μm以上である、請求項1~3のいずれか一項に記載の封止用フィルム。
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Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000007891A (ja) | 1998-04-22 | 2000-01-11 | Asahi Chiba Kk | 新規液状エポキシ樹脂組成物、その硬化物並びに半導体封止装置 |
JP2001270976A (ja) | 1999-04-13 | 2001-10-02 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂組成物及び電子部品装置 |
JP2003002951A (ja) | 2001-06-25 | 2003-01-08 | New Japan Chem Co Ltd | 液状エポキシ樹脂組成物の薄膜硬化物 |
JP2003034747A (ja) | 2001-05-14 | 2003-02-07 | Hitachi Chem Co Ltd | 液状エポキシ樹脂組成物及び電子部品装置 |
JP2007182562A (ja) | 2005-12-08 | 2007-07-19 | Hitachi Chem Co Ltd | 電子部品用液状樹脂組成物及び電子部品装置 |
WO2010061980A1 (ja) | 2008-11-28 | 2010-06-03 | 味の素株式会社 | 樹脂組成物 |
JP2014080455A (ja) | 2012-10-12 | 2014-05-08 | Nippon Shokubai Co Ltd | 液状硬化性樹脂組成物及びその用途 |
JP2015134928A (ja) | 2010-02-18 | 2015-07-27 | 日立化成株式会社 | 電子部品用液状樹脂組成物及び電子部品装置 |
WO2016072463A1 (ja) | 2014-11-07 | 2016-05-12 | 日立化成株式会社 | 封止フィルム用樹脂組成物、封止フィルム、支持体付き封止フィルム、及び電子装置 |
WO2016117237A1 (ja) | 2015-01-21 | 2016-07-28 | 太陽インキ製造株式会社 | 熱硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
JP2016141757A (ja) | 2015-02-03 | 2016-08-08 | 日立化成株式会社 | エポキシ樹脂組成物、フィルム状エポキシ樹脂組成物及び電子部品装置 |
JP2016216708A (ja) | 2015-05-20 | 2016-12-22 | 信越化学工業株式会社 | 液状樹脂組成物 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11106474A (ja) * | 1997-10-03 | 1999-04-20 | Hitachi Chem Co Ltd | 半導体封止用液状エポキシ樹脂組成物 |
JP4433368B2 (ja) * | 2003-04-08 | 2010-03-17 | ジャパンエポキシレジン株式会社 | エポキシ樹脂粒状化物及びその製造方法 |
US7982322B2 (en) * | 2006-10-06 | 2011-07-19 | Hitachi Chemical Co., Ltd. | Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same |
WO2010047411A1 (ja) * | 2008-10-21 | 2010-04-29 | 味の素株式会社 | 熱硬化性樹脂組成物 |
JP5308409B2 (ja) | 2010-07-27 | 2013-10-09 | パナソニック株式会社 | 電子部品封止用シート状エポキシ樹脂組成物材料の製造方法と電子部品 |
WO2014204256A2 (ko) * | 2013-06-19 | 2014-12-24 | 주식회사 엘지화학 | 봉지재 필름의 신뢰 수명을 평가하는 방법 및 상기 필름의 신뢰도 평가 장치 |
JP2015180760A (ja) * | 2015-07-22 | 2015-10-15 | 日立化成株式会社 | 液状エポキシ樹脂組成物及び電子部品装置 |
-
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Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000007891A (ja) | 1998-04-22 | 2000-01-11 | Asahi Chiba Kk | 新規液状エポキシ樹脂組成物、その硬化物並びに半導体封止装置 |
JP2001270976A (ja) | 1999-04-13 | 2001-10-02 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂組成物及び電子部品装置 |
JP2003034747A (ja) | 2001-05-14 | 2003-02-07 | Hitachi Chem Co Ltd | 液状エポキシ樹脂組成物及び電子部品装置 |
JP2003002951A (ja) | 2001-06-25 | 2003-01-08 | New Japan Chem Co Ltd | 液状エポキシ樹脂組成物の薄膜硬化物 |
JP2007182562A (ja) | 2005-12-08 | 2007-07-19 | Hitachi Chem Co Ltd | 電子部品用液状樹脂組成物及び電子部品装置 |
WO2010061980A1 (ja) | 2008-11-28 | 2010-06-03 | 味の素株式会社 | 樹脂組成物 |
JP2015134928A (ja) | 2010-02-18 | 2015-07-27 | 日立化成株式会社 | 電子部品用液状樹脂組成物及び電子部品装置 |
JP2014080455A (ja) | 2012-10-12 | 2014-05-08 | Nippon Shokubai Co Ltd | 液状硬化性樹脂組成物及びその用途 |
WO2016072463A1 (ja) | 2014-11-07 | 2016-05-12 | 日立化成株式会社 | 封止フィルム用樹脂組成物、封止フィルム、支持体付き封止フィルム、及び電子装置 |
WO2016117237A1 (ja) | 2015-01-21 | 2016-07-28 | 太陽インキ製造株式会社 | 熱硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
JP2016141757A (ja) | 2015-02-03 | 2016-08-08 | 日立化成株式会社 | エポキシ樹脂組成物、フィルム状エポキシ樹脂組成物及び電子部品装置 |
JP2016216708A (ja) | 2015-05-20 | 2016-12-22 | 信越化学工業株式会社 | 液状樹脂組成物 |
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