JP7098164B2 - ボンディング装置及びボンディング方法 - Google Patents
ボンディング装置及びボンディング方法 Download PDFInfo
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- JP7098164B2 JP7098164B2 JP2019509659A JP2019509659A JP7098164B2 JP 7098164 B2 JP7098164 B2 JP 7098164B2 JP 2019509659 A JP2019509659 A JP 2019509659A JP 2019509659 A JP2019509659 A JP 2019509659A JP 7098164 B2 JP7098164 B2 JP 7098164B2
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- H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
- H01L24/92—Specific sequence of method steps
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Description
次に、図5、図6、図7及び図8を参照しつつ、ボンディング装置1を利用したボンディング方法について説明する。第1の開示に係るボンディング方法は、図1に示すボンディング装置1を用いて行う。第1の開示に係るボンディング方法によって、半導体装置100(図2参照)を製造する。半導体装置100は、半導体ダイ102と、基板101とを有する。半導体ダイ102は、接着材料103を介して基板101に実装される。
図11に示すボンディング装置1Aについて説明する。ボンディング装置1Aは、シート部材としてテープ形状ではなく、個片状態のシート片を用いる点で、第1の開示に係るボンディング装置1Aと相違する。以下、ボンディング装置1と異なる構成要素について詳細に説明し、ボンディング装置1と共通する構成要素は、同一の符号を用いて示す。従って、共通する構成要素は、詳細な説明を省略する。
以上、本開示に係るボンディング装置を詳細に説明した。しかし、本開示は上記の態様に限定されない。本開示に係るボンディング装置は、その要旨を逸脱しない範囲で様々な変形が可能である。例えば、図17、図18、図19、図20、図21及び図22は、変形例1~6に係るボンディング装置のボンディングツールを拡大して示す図である。
Claims (6)
- 電子部品を基板又はその他の電子部品に接着材料を介して熱圧着するボンディング装置であって、
透気性を有するシート部材の第1部分を介して前記電子部品を着脱可能に保持するボンディング面と、前記ボンディング面に対して平行である軸線上において前記ボンディング面を挟むように前記ボンディング面の両脇にそれぞれ配置され、前記シート部材の第2部分を拘束する一対の第1シート拘束面と、を有するボンディングツールと、
前記第1シート拘束面上の前記シート部材を前記第1シート拘束面に対して押圧する第2シート拘束面を有し、前記第1シート拘束面と前記第2シート拘束面との間に挟持された前記シート部材における前記第2部分を拘束するシート拘束部と、
前記ボンディングツール及び前記シート拘束部の動作を制御するボンディング制御部と、
を備える、ボンディング装置。 - 前記ボンディングツールは、前記ボンディング面の温度を上昇させる加熱部を有し、
前記ボンディング制御部は、前記シート拘束部によって前記シート部材における前記第2部分を拘束した後に、前記加熱部の加熱を開始する、請求項1に記載のボンディング装置。 - 前記第1シート拘束面は、境界辺部を介して前記ボンディング面と連続する、請求項1又は2に記載のボンディング装置。
- 前記シート部材は、テープ状であって、
前記シート部材の一端部が連結され、前記シート部材を巻き出して前記シート部材を提供する第1リールと、前記シート部材の他端部が連結され、前記第1リールから提供される前記シート部材を巻き取る第2リールと、を有するシート供給部を更に備え、
前記ボンディングツールは、前記第1リールと前記第2リールとの間に配置され、
前記シート拘束部は、前記シート部材における前記第2部分である一対の自由辺部を拘束する、請求項1又は2に記載のボンディング装置。 - 前記シート部材は、個片状のシートであって、
前記シート拘束部は、前記シート部材における前記第2部分である少なくとも一対の自由辺部を拘束する、請求項1又は2に記載のボンディング装置。 - 電子部品を基板又はその他の電子部品に接着材料を介して熱圧着するボンディング方法であって、
透気性を有するシート部材の第1部分を介して前記電子部品を着脱可能に保持するボンディング面と、前記ボンディング面に対して平行である軸線上において前記ボンディング面を挟むように前記ボンディング面の両脇にそれぞれ配置され、前記シート部材の第2部分を拘束する一対の第1シート拘束面と、を有するボンディングツールを準備する工程と、
前記ボンディング面上に前記シート部材の前記第1部分を配置するとともに前記第1シート拘束面上に前記シート部材の前記第2部分を配置した後に、前記第2部分をシート拘束部であって、前記第1シート拘束面上の前記シート部材を前記第1シート拘束面に対して押圧する第2シート拘束面を有し、前記第1シート拘束面と前記第2シート拘束面との間に挟持された前記シート部材における前記第2部分を拘束する前記シート拘束部により拘束する工程と、
前記シート部材の前記第1部分を介して前記電子部品を前記ボンディング面に保持する工程と、
前記ボンディングツールが有する加熱部によって前記ボンディング面を加熱し、前記電子部品を前記基板又は前記その他の電子部品に接着剤を介して熱圧着する工程と、を有する、ボンディング方法。
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