JP7097224B2 - レーザ偏向装置及びレーザ加工装置 - Google Patents
レーザ偏向装置及びレーザ加工装置 Download PDFInfo
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/29—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/0025—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration
- G02B27/0031—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical correction, e.g. distorsion, aberration for scanning purposes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0955—Lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/02—Simple or compound lenses with non-spherical faces
- G02B3/04—Simple or compound lenses with non-spherical faces with continuous faces that are rotationally symmetrical but deviate from a true sphere, e.g. so called "aspheric" lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/02—Simple or compound lenses with non-spherical faces
- G02B3/06—Simple or compound lenses with non-spherical faces with cylindrical or toric faces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
- H01S3/0071—Beam steering, e.g. whereby a mirror outside the cavity is present to change the beam direction
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/29—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
- G02F1/291—Two-dimensional analogue deflection
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2203/00—Function characteristic
- G02F2203/24—Function characteristic beam steering
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Description
d=f×λ×M2/(π×D) ・・・(1)
f=r/(1-n) ・・・(2)
d=r×λ×M2/{(π×D)×(1-n)} ・・・(3)
次に、図7を参照して、実施形態2に係るレーザ加工装置100について説明する。なお、実施形態2では、重複した記載を避けるべく、実施形態1と異なる部分について説明し、実施形態1と同様の構成である部分については、同じ符号を付して説明する。図7は、実施形態2に係る偏向光学系及び集光光学系を模式的に示す図である。
次に、図8を参照して、実施形態3に係るレーザ加工装置120について説明する。なお、実施形態3でも、重複した記載を避けるべく、実施形態1及び2と異なる部分について説明し、実施形態1及び2と同様の構成である部分については、同じ符号を付して説明する。図8は、実施形態3に係る偏向光学系及び集光光学系を模式的に示す図である。
10 レーザ加工装置
12 レーザ照射装置
18 偏向光学系
22 集光光学系
26 支持台
28 制御装置
41 X軸電気光学偏向器
42 X軸補正用光学系
45 電気光学結晶
46 電極
47 補正用レンズ
47a 入射面
47b 出射面
65 集光レンズ
100 レーザ加工装置(実施形態2)
101 偏向光学系
105 X軸偏向光学系
106 Y軸偏向光学系
107 リレー光学系
108 波長板
110 Y軸電気光学偏向器
111 Y軸補正用光学系
115,116 リレーレンズ
120 レーザ加工装置(実施形態3)
121 偏向光学系
122 補正用光学系
125 補正用レンズ
L レーザ
L1 基準光軸
Claims (7)
- レーザの光路上に設けられる電気光学結晶、及び前記電気光学結晶に対して所定の印加方向に電圧を印加する電極を含む電気光学偏向器と、
前記レーザの照射方向において前記電気光学偏向器の下流側に設けられると共に、前記電極の印加方向に偏向される前記レーザのビーム径を補正する補正用光学系と、を備え、
前記レーザは、1W以上の出力となる高出力レーザであり、
前記電極による電圧の印加がないときの未偏向となる前記レーザの照射方向を基準光軸とし、
前記電気光学偏向器において偏向された前記レーザと前記基準光軸とが為す角度を偏向角度とすると、
前記補正用光学系は、前記偏向角度に応じた前記ビーム径の歪みに応じて、少なくとも前記印加方向における前記レーザの前記ビーム径を補正する光学系となっており、
前記偏向角度がゼロのときの前記ビーム径を基準ビーム径とすると、
前記補正用光学系は、前記印加方向において、前記偏向角度がゼロの場合に前記ビーム径の補正量がゼロとなり、前記偏向角度が大きくなるにつれて前記ビーム径が前記基準ビーム径となるように補正量が大きくなる非球面レンズであり、
前記電気光学偏向器から出射した前記レーザの前記ビーム径は、前記偏向角度が大きくなるにつれて拡大しており、
前記非球面レンズは、
入射側が凹面となる入射面と出射側が平面となる出射面とを有する平凹レンズであり、
前記偏向角度がゼロの場合において、前記レーザが照射される前記入射面の曲率がゼロとなり、前記偏向角度が大きくなるにつれて、前記レーザが照射される前記入射面の曲率が大きくなることを特徴とするレーザ偏向装置。 - 前記非球面レンズは、
前記入射面内における、前記照射方向及び前記印加方向に直交する方向において、前記曲率が一定となるシリンドリカルレンズであることを特徴とする請求項1に記載のレーザ偏向装置。 - 前記非球面レンズは、
前記入射面内における、前記照射方向及び前記印加方向に直交する方向において、前記ビーム径の歪みに応じて前記ビーム径を補正する曲率となるレンズであることを特徴とする請求項1に記載のレーザ偏向装置。 - 前記レーザの光路上における前記電気光学偏向器と前記補正用光学系との間の距離は、2mm以上100mm以下の範囲となっていることを特徴とする請求項1から3のいずれか1項に記載のレーザ偏向装置。
- 加工対象物へ向けてレーザを照射するレーザ照射装置と、
前記レーザ照射装置から出射した前記レーザが入射する、請求項1から4のいずれか1項に記載のレーザ偏向装置と、
前記レーザ偏向装置から出射した前記レーザを、前記加工対象物上へ集光する集光光学系と、を備えることを特徴とするレーザ加工装置。 - 前記レーザ偏向装置は、前記レーザの照射方向に直交する面内において、前記レーザをX軸方向に偏向するX軸偏向光学系と、前記レーザをY軸方向に偏向するY軸偏向光学系と、を有することを特徴とする請求項5に記載のレーザ加工装置。
- 前記レーザ偏向装置は、
前記電気光学偏向器が、前記レーザをX軸方向に偏向するX軸電気光学偏向器と、前記レーザをY軸方向に偏向するY軸電気光学偏向器と、を有し、
前記補正用光学系が、前記レーザの照射方向において前記X軸電気光学偏向器及び前記Y軸電気光学偏向器の下流側に設けられることを特徴とする請求項5に記載のレーザ加工装置。
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JP2018087195A JP7097224B2 (ja) | 2018-04-27 | 2018-04-27 | レーザ偏向装置及びレーザ加工装置 |
US16/394,619 US20190329351A1 (en) | 2018-04-27 | 2019-04-25 | Laser deflection device and laser machining apparatus |
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JP2018087195A JP7097224B2 (ja) | 2018-04-27 | 2018-04-27 | レーザ偏向装置及びレーザ加工装置 |
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JP2019191500A JP2019191500A (ja) | 2019-10-31 |
JP7097224B2 true JP7097224B2 (ja) | 2022-07-07 |
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JP7435936B1 (ja) | 2023-07-18 | 2024-02-21 | 三菱電機株式会社 | ガルバノスキャナ及びレーザ加工機 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004230438A (ja) | 2003-01-31 | 2004-08-19 | Sunx Ltd | レーザ加工装置 |
JP2008102191A (ja) | 2006-10-17 | 2008-05-01 | Seiko Epson Corp | 走査型光学装置 |
US20080204858A1 (en) | 2007-02-28 | 2008-08-28 | Samsung Electronics Co., Ltd. | One dimensional spatial light modulator and image output device employing the same |
JP2012150409A (ja) | 2011-01-21 | 2012-08-09 | Nippon Telegr & Teleph Corp <Ntt> | 光偏向器 |
CN206209099U (zh) | 2016-09-19 | 2017-05-31 | 北京万集科技股份有限公司 | 一种非机械式扫描激光雷达光学装置和激光雷达系统 |
JP2018013775A (ja) | 2016-07-11 | 2018-01-25 | 日本電信電話株式会社 | 光偏向器 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3109358B2 (ja) * | 1993-12-16 | 2000-11-13 | 富士ゼロックス株式会社 | 走査光学系の取付構造 |
JPH11258532A (ja) * | 1998-03-10 | 1999-09-24 | Fuji Photo Optical Co Ltd | 光走査装置 |
-
2018
- 2018-04-27 JP JP2018087195A patent/JP7097224B2/ja active Active
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- 2019-04-25 US US16/394,619 patent/US20190329351A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004230438A (ja) | 2003-01-31 | 2004-08-19 | Sunx Ltd | レーザ加工装置 |
JP2008102191A (ja) | 2006-10-17 | 2008-05-01 | Seiko Epson Corp | 走査型光学装置 |
US20080204858A1 (en) | 2007-02-28 | 2008-08-28 | Samsung Electronics Co., Ltd. | One dimensional spatial light modulator and image output device employing the same |
JP2012150409A (ja) | 2011-01-21 | 2012-08-09 | Nippon Telegr & Teleph Corp <Ntt> | 光偏向器 |
JP2018013775A (ja) | 2016-07-11 | 2018-01-25 | 日本電信電話株式会社 | 光偏向器 |
CN206209099U (zh) | 2016-09-19 | 2017-05-31 | 北京万集科技股份有限公司 | 一种非机械式扫描激光雷达光学装置和激光雷达系统 |
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