JP7089133B1 - めっき装置および基板洗浄方法 - Google Patents

めっき装置および基板洗浄方法 Download PDF

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Publication number
JP7089133B1
JP7089133B1 JP2022521687A JP2022521687A JP7089133B1 JP 7089133 B1 JP7089133 B1 JP 7089133B1 JP 2022521687 A JP2022521687 A JP 2022521687A JP 2022521687 A JP2022521687 A JP 2022521687A JP 7089133 B1 JP7089133 B1 JP 7089133B1
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Japan
Prior art keywords
substrate
cleaning
plating
rotation
plated
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Active
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JP2022521687A
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English (en)
Japanese (ja)
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JPWO2023079632A1 (https=
JPWO2023079632A5 (https=
Inventor
一仁 辻
健太郎 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
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Publication of JPWO2023079632A1 publication Critical patent/JPWO2023079632A1/ja
Publication of JPWO2023079632A5 publication Critical patent/JPWO2023079632A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1669—Agitation, e.g. air introduction
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2022521687A 2021-11-04 2021-11-04 めっき装置および基板洗浄方法 Active JP7089133B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/040600 WO2023079632A1 (ja) 2021-11-04 2021-11-04 めっき装置および基板洗浄方法

Publications (3)

Publication Number Publication Date
JP7089133B1 true JP7089133B1 (ja) 2022-06-21
JPWO2023079632A1 JPWO2023079632A1 (https=) 2023-05-11
JPWO2023079632A5 JPWO2023079632A5 (https=) 2023-10-03

Family

ID=82100065

Family Applications (1)

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JP2022521687A Active JP7089133B1 (ja) 2021-11-04 2021-11-04 めっき装置および基板洗浄方法

Country Status (5)

Country Link
US (1) US12606929B2 (https=)
JP (1) JP7089133B1 (https=)
KR (1) KR102556645B1 (https=)
CN (1) CN116368268B (https=)
WO (1) WO2023079632A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7199618B1 (ja) * 2022-08-02 2023-01-05 株式会社荏原製作所 めっき方法、及び、めっき装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120311280A (zh) * 2024-01-12 2025-07-15 盛美半导体设备(上海)股份有限公司 电镀装置及清洗方法
CN120311276A (zh) * 2024-01-12 2025-07-15 盛美半导体设备(上海)股份有限公司 电镀装置及基板清洁方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6934127B1 (ja) * 2020-12-22 2021-09-08 株式会社荏原製作所 めっき装置、プリウェット処理方法及び洗浄処理方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0671544B2 (ja) 1990-03-26 1994-09-14 日本テクノ株式会社 液槽における液体の攪拌方法および装置
US6478937B2 (en) * 2001-01-19 2002-11-12 Applied Material, Inc. Substrate holder system with substrate extension apparatus and associated method
JP3784697B2 (ja) * 2001-11-08 2006-06-14 東京エレクトロン株式会社 メッキ処理装置のミストトラップ機構、メッキ処理装置のミストトラップ方法
CN1263064C (zh) * 2002-05-28 2006-07-05 东元资讯股份有限公司 玻璃基板固定承座
JP3860111B2 (ja) 2002-12-19 2006-12-20 大日本スクリーン製造株式会社 メッキ装置およびメッキ方法
JP4303484B2 (ja) * 2003-01-21 2009-07-29 大日本スクリーン製造株式会社 メッキ装置
JP2005264245A (ja) * 2004-03-18 2005-09-29 Ebara Corp 基板の湿式処理方法及び処理装置
KR20070064847A (ko) * 2005-12-19 2007-06-22 삼성전자주식회사 반도체 웨이퍼 전기도금장치
KR101102328B1 (ko) * 2008-08-07 2012-01-03 주식회사 케이씨텍 기판도금장치
JP5490610B2 (ja) * 2010-05-24 2014-05-14 昭和電工株式会社 洗浄方法
JP5321574B2 (ja) 2010-12-17 2013-10-23 ルネサスエレクトロニクス株式会社 半導体製造装置の動作方法及び半導体装置の製造方法
JP5815827B2 (ja) * 2014-10-10 2015-11-17 東京エレクトロン株式会社 めっき処理装置、めっき処理方法および記憶媒体
CN112509945A (zh) * 2020-11-30 2021-03-16 硅密芯镀(海宁)半导体技术有限公司 晶圆处理系统及晶圆电镀方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6934127B1 (ja) * 2020-12-22 2021-09-08 株式会社荏原製作所 めっき装置、プリウェット処理方法及び洗浄処理方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7199618B1 (ja) * 2022-08-02 2023-01-05 株式会社荏原製作所 めっき方法、及び、めっき装置
WO2024028973A1 (ja) * 2022-08-02 2024-02-08 株式会社荏原製作所 めっき方法、及び、めっき装置
CN119013440A (zh) * 2022-08-02 2024-11-22 株式会社荏原制作所 镀覆方法以及镀覆装置
US12351933B2 (en) 2022-08-02 2025-07-08 Ebara Corporation Plating method and plating apparatus

Also Published As

Publication number Publication date
US12606929B2 (en) 2026-04-21
JPWO2023079632A1 (https=) 2023-05-11
KR20230066270A (ko) 2023-05-15
US20250075363A1 (en) 2025-03-06
KR102556645B1 (ko) 2023-07-18
CN116368268B (zh) 2024-02-13
WO2023079632A1 (ja) 2023-05-11
CN116368268A (zh) 2023-06-30

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