CN116368268B - 镀覆装置及基板清洗方法 - Google Patents

镀覆装置及基板清洗方法 Download PDF

Info

Publication number
CN116368268B
CN116368268B CN202180038910.7A CN202180038910A CN116368268B CN 116368268 B CN116368268 B CN 116368268B CN 202180038910 A CN202180038910 A CN 202180038910A CN 116368268 B CN116368268 B CN 116368268B
Authority
CN
China
Prior art keywords
substrate
cleaning
plating
liquid
rotation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180038910.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN116368268A (zh
Inventor
辻一仁
山本健太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN116368268A publication Critical patent/CN116368268A/zh
Application granted granted Critical
Publication of CN116368268B publication Critical patent/CN116368268B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1669—Agitation, e.g. air introduction
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
CN202180038910.7A 2021-11-04 2021-11-04 镀覆装置及基板清洗方法 Active CN116368268B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/040600 WO2023079632A1 (ja) 2021-11-04 2021-11-04 めっき装置および基板洗浄方法

Publications (2)

Publication Number Publication Date
CN116368268A CN116368268A (zh) 2023-06-30
CN116368268B true CN116368268B (zh) 2024-02-13

Family

ID=82100065

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180038910.7A Active CN116368268B (zh) 2021-11-04 2021-11-04 镀覆装置及基板清洗方法

Country Status (5)

Country Link
US (1) US12606929B2 (https=)
JP (1) JP7089133B1 (https=)
KR (1) KR102556645B1 (https=)
CN (1) CN116368268B (https=)
WO (1) WO2023079632A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102595617B1 (ko) * 2022-08-02 2023-10-31 가부시키가이샤 에바라 세이사꾸쇼 도금 방법 및 도금 장치
CN120311280A (zh) * 2024-01-12 2025-07-15 盛美半导体设备(上海)股份有限公司 电镀装置及清洗方法
CN120311276A (zh) * 2024-01-12 2025-07-15 盛美半导体设备(上海)股份有限公司 电镀装置及基板清洁方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1508296A (zh) * 2002-12-19 2004-06-30 ���ձ���Ŀ��������ʽ���� 电镀装置以及电镀方法
JP2005264245A (ja) * 2004-03-18 2005-09-29 Ebara Corp 基板の湿式処理方法及び処理装置
JP2011089209A (ja) * 2010-12-17 2011-05-06 Renesas Electronics Corp 半導体製造装置の動作方法及び半導体装置の製造方法
JP6934127B1 (ja) * 2020-12-22 2021-09-08 株式会社荏原製作所 めっき装置、プリウェット処理方法及び洗浄処理方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0671544B2 (ja) 1990-03-26 1994-09-14 日本テクノ株式会社 液槽における液体の攪拌方法および装置
US6478937B2 (en) * 2001-01-19 2002-11-12 Applied Material, Inc. Substrate holder system with substrate extension apparatus and associated method
JP3784697B2 (ja) * 2001-11-08 2006-06-14 東京エレクトロン株式会社 メッキ処理装置のミストトラップ機構、メッキ処理装置のミストトラップ方法
CN1263064C (zh) * 2002-05-28 2006-07-05 东元资讯股份有限公司 玻璃基板固定承座
JP4303484B2 (ja) * 2003-01-21 2009-07-29 大日本スクリーン製造株式会社 メッキ装置
KR20070064847A (ko) * 2005-12-19 2007-06-22 삼성전자주식회사 반도체 웨이퍼 전기도금장치
KR101102328B1 (ko) * 2008-08-07 2012-01-03 주식회사 케이씨텍 기판도금장치
JP5490610B2 (ja) * 2010-05-24 2014-05-14 昭和電工株式会社 洗浄方法
JP5815827B2 (ja) * 2014-10-10 2015-11-17 東京エレクトロン株式会社 めっき処理装置、めっき処理方法および記憶媒体
CN112509945A (zh) * 2020-11-30 2021-03-16 硅密芯镀(海宁)半导体技术有限公司 晶圆处理系统及晶圆电镀方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1508296A (zh) * 2002-12-19 2004-06-30 ���ձ���Ŀ��������ʽ���� 电镀装置以及电镀方法
JP2005264245A (ja) * 2004-03-18 2005-09-29 Ebara Corp 基板の湿式処理方法及び処理装置
JP2011089209A (ja) * 2010-12-17 2011-05-06 Renesas Electronics Corp 半導体製造装置の動作方法及び半導体装置の製造方法
JP6934127B1 (ja) * 2020-12-22 2021-09-08 株式会社荏原製作所 めっき装置、プリウェット処理方法及び洗浄処理方法

Also Published As

Publication number Publication date
JP7089133B1 (ja) 2022-06-21
US12606929B2 (en) 2026-04-21
JPWO2023079632A1 (https=) 2023-05-11
KR20230066270A (ko) 2023-05-15
US20250075363A1 (en) 2025-03-06
KR102556645B1 (ko) 2023-07-18
WO2023079632A1 (ja) 2023-05-11
CN116368268A (zh) 2023-06-30

Similar Documents

Publication Publication Date Title
CN116324046B (zh) 镀覆装置及触点清洗方法
CN115461499B (zh) 镀覆装置及基板清洗方法
CN116368268B (zh) 镀覆装置及基板清洗方法
TWI612555B (zh) 用於先進封裝應用之設備
US6854473B2 (en) Method and apparatus for executing plural processes on a microelectronic workpiece at a single processing station
JP2002212786A (ja) 基板処理装置
CN116097077B (zh) 泄漏判定方法以及镀覆装置
JP7162787B1 (ja) めっき装置
KR20150138826A (ko) 저항성 기판들 상에서의 최적화된 전기 도금 성능을 위한 웨이퍼 에지의 금속화
TWI775670B (zh) 鍍覆裝置及基板清洗方法
TWI803048B (zh) 鍍覆裝置及基板清洗方法
TWI798928B (zh) 鍍覆裝置及接觸件清洗方法
TWI854050B (zh) 基板液處理方法及基板液處理裝置
JP2002249896A (ja) 液処理装置、液処理方法
TW202400855A (zh) 鍍覆裝置
JP7199618B1 (ja) めっき方法、及び、めっき装置
TW202611338A (zh) 搬送裝置及鍍覆裝置
TW202540505A (zh) 鍍覆裝置及基板處理方法
JP2001319919A5 (https=)

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant