JP7088443B1 - 伸縮性実装基板及び伸縮性実装基板の製造方法 - Google Patents

伸縮性実装基板及び伸縮性実装基板の製造方法 Download PDF

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Publication number
JP7088443B1
JP7088443B1 JP2022522373A JP2022522373A JP7088443B1 JP 7088443 B1 JP7088443 B1 JP 7088443B1 JP 2022522373 A JP2022522373 A JP 2022522373A JP 2022522373 A JP2022522373 A JP 2022522373A JP 7088443 B1 JP7088443 B1 JP 7088443B1
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Japan
Prior art keywords
mounting
region
electrode layer
stretchable
solder
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JP2022522373A
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English (en)
Japanese (ja)
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JPWO2022070624A5 (https=
JPWO2022070624A1 (https=
Inventor
祐依 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication of JPWO2022070624A1 publication Critical patent/JPWO2022070624A1/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Structure Of Printed Boards (AREA)
JP2022522373A 2020-09-29 2021-08-11 伸縮性実装基板及び伸縮性実装基板の製造方法 Active JP7088443B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020163625 2020-09-29
JP2020163625 2020-09-29
PCT/JP2021/029619 WO2022070624A1 (ja) 2020-09-29 2021-08-11 伸縮性実装基板及び伸縮性実装基板の製造方法

Publications (3)

Publication Number Publication Date
JPWO2022070624A1 JPWO2022070624A1 (https=) 2022-04-07
JP7088443B1 true JP7088443B1 (ja) 2022-06-21
JPWO2022070624A5 JPWO2022070624A5 (https=) 2022-09-20

Family

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Family Applications (1)

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JP2022522373A Active JP7088443B1 (ja) 2020-09-29 2021-08-11 伸縮性実装基板及び伸縮性実装基板の製造方法

Country Status (4)

Country Link
US (1) US12035464B2 (https=)
JP (1) JP7088443B1 (https=)
CN (1) CN114846911B (https=)
WO (1) WO2022070624A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024004783A1 (ja) * 2022-06-30 2024-01-04 株式会社村田製作所 伸縮デバイス

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002042548A (ja) * 2000-07-19 2002-02-08 Furukawa Electric Co Ltd:The 電子部品用リード線とその製造方法、そのリード線を用いた電子部品
JP2011159922A (ja) * 2010-02-03 2011-08-18 Nippon Mektron Ltd 配線回路基板及びその製造方法
WO2015125944A1 (ja) * 2014-02-21 2015-08-27 学校法人早稲田大学 自己修復型配線及び伸縮デバイス
US20170231089A1 (en) * 2014-09-29 2017-08-10 Imec Vzw Smart textile product and method for fabricating the same
JP2018014381A (ja) * 2016-07-20 2018-01-25 富士通株式会社 基板及び電子機器
JP2019012745A (ja) * 2017-06-29 2019-01-24 パナソニック株式会社 電子部品の実装方法及び実装基板
WO2019045108A1 (ja) * 2017-09-04 2019-03-07 パナソニックＩｐマネジメント株式会社 伸縮性回路基板、及び、それを用いたパッチデバイス
WO2020203135A1 (ja) * 2019-03-29 2020-10-08 株式会社村田製作所 伸縮性実装基板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002025339A (ja) * 2000-07-03 2002-01-25 Matsushita Electric Ind Co Ltd 実装構造体およびその製造方法
JP2002124755A (ja) * 2000-08-09 2002-04-26 Murata Mfg Co Ltd 導電性接着剤と電極との接合方法およびその接合構造
EP2234466B1 (en) * 2007-12-26 2019-04-10 Fujikura Ltd. Mounting board and method of producing the same
JP5177027B2 (ja) * 2009-03-12 2013-04-03 日本電気株式会社 電極パッドの製造方法、電極パッドを備えた回路配線体及びその製造方法、並びに、この電極パッドによるはんだ継手構造及びその方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002042548A (ja) * 2000-07-19 2002-02-08 Furukawa Electric Co Ltd:The 電子部品用リード線とその製造方法、そのリード線を用いた電子部品
JP2011159922A (ja) * 2010-02-03 2011-08-18 Nippon Mektron Ltd 配線回路基板及びその製造方法
WO2015125944A1 (ja) * 2014-02-21 2015-08-27 学校法人早稲田大学 自己修復型配線及び伸縮デバイス
US20170231089A1 (en) * 2014-09-29 2017-08-10 Imec Vzw Smart textile product and method for fabricating the same
JP2018014381A (ja) * 2016-07-20 2018-01-25 富士通株式会社 基板及び電子機器
JP2019012745A (ja) * 2017-06-29 2019-01-24 パナソニック株式会社 電子部品の実装方法及び実装基板
WO2019045108A1 (ja) * 2017-09-04 2019-03-07 パナソニックＩｐマネジメント株式会社 伸縮性回路基板、及び、それを用いたパッチデバイス
WO2020203135A1 (ja) * 2019-03-29 2020-10-08 株式会社村田製作所 伸縮性実装基板

Also Published As

Publication number Publication date
WO2022070624A1 (ja) 2022-04-07
CN114846911B (zh) 2025-06-03
US20220312588A1 (en) 2022-09-29
CN114846911A (zh) 2022-08-02
US12035464B2 (en) 2024-07-09
JPWO2022070624A1 (https=) 2022-04-07

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