JP7082318B2 - 裏側集積回路高周波数信号の放射、受信、及び相互接続のための方法及び装置 - Google Patents

裏側集積回路高周波数信号の放射、受信、及び相互接続のための方法及び装置 Download PDF

Info

Publication number
JP7082318B2
JP7082318B2 JP2018534731A JP2018534731A JP7082318B2 JP 7082318 B2 JP7082318 B2 JP 7082318B2 JP 2018534731 A JP2018534731 A JP 2018534731A JP 2018534731 A JP2018534731 A JP 2018534731A JP 7082318 B2 JP7082318 B2 JP 7082318B2
Authority
JP
Japan
Prior art keywords
level
semiconductor substrate
antenna
cavity opening
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018534731A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019516259A5 (enExample
JP2019516259A (ja
Inventor
スタッセン クック ベンジャミン
サンカラン スワミナサン
Original Assignee
テキサス インスツルメンツ インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by テキサス インスツルメンツ インコーポレイテッド filed Critical テキサス インスツルメンツ インコーポレイテッド
Publication of JP2019516259A publication Critical patent/JP2019516259A/ja
Publication of JP2019516259A5 publication Critical patent/JP2019516259A5/ja
Application granted granted Critical
Publication of JP7082318B2 publication Critical patent/JP7082318B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H01P5/107—Hollow-waveguide/strip-line transitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/20—Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/90—Non-optical transmission systems, e.g. transmission systems employing non-photonic corpuscular radiation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Aerials With Secondary Devices (AREA)
  • Waveguide Aerials (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2018534731A 2015-12-29 2016-12-29 裏側集積回路高周波数信号の放射、受信、及び相互接続のための方法及び装置 Active JP7082318B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/982,932 US9985335B2 (en) 2015-12-29 2015-12-29 Methods and apparatus for backside integrated circuit high frequency signal radiation, reception and interconnects
US14/982,932 2015-12-29
PCT/US2016/069137 WO2017117362A2 (en) 2015-12-29 2016-12-29 Method and apparatus for backside integrated circuit high frequency signal radiation, reception and interconnects

Publications (3)

Publication Number Publication Date
JP2019516259A JP2019516259A (ja) 2019-06-13
JP2019516259A5 JP2019516259A5 (enExample) 2020-01-30
JP7082318B2 true JP7082318B2 (ja) 2022-06-08

Family

ID=59086642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018534731A Active JP7082318B2 (ja) 2015-12-29 2016-12-29 裏側集積回路高周波数信号の放射、受信、及び相互接続のための方法及び装置

Country Status (5)

Country Link
US (1) US9985335B2 (enExample)
EP (1) EP3398230A4 (enExample)
JP (1) JP7082318B2 (enExample)
CN (1) CN109478710B (enExample)
WO (1) WO2017117362A2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10199336B2 (en) * 2017-05-24 2019-02-05 Advanced Semiconductor Engineering, Inc. Antenna package device
CN110931938B (zh) * 2018-09-20 2021-04-16 宏碁股份有限公司 电子装置
US10840197B2 (en) * 2018-10-30 2020-11-17 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and manufacturing method thereof
EP3796466B8 (en) * 2019-09-18 2024-04-03 Beijing BOE Sensor Technology Co., Ltd. Radio frequency device
CN110783685B (zh) * 2019-10-30 2021-08-17 深圳捷豹电波科技有限公司 毫米波天线及毫米波天线制程设计
CN113130316B (zh) * 2021-04-08 2022-07-01 华进半导体封装先导技术研发中心有限公司 一种半导体结构及其制备方法
US20240380102A1 (en) * 2023-05-08 2024-11-14 City University Of Hong Kong Radiator for providing terahertz electromagnetic radiation
FI20236116A1 (en) * 2023-10-09 2025-04-10 Teknologian Tutkimuskeskus Vtt Oy On-chip antenna arrangement and manufacturing thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005109933A (ja) 2003-09-30 2005-04-21 Mitsubishi Electric Corp 変換回路
JP2012195886A (ja) 2011-03-17 2012-10-11 Hiroshima Univ チップ間通信システム及び半導体装置
JP2016516327A (ja) 2013-03-08 2016-06-02 ノースロップ グルマン システムズ コーポレーションＮｏｒｔｈｒｏｐ Ｇｒｕｍｍａｎ Ｓｙｓｔｅｍｓ Ｃｏｒｐｏｒａｔｉｏｎ 導波路および半導体パッケージング

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2790033B2 (ja) * 1993-04-07 1998-08-27 松下電器産業株式会社 半導体装置
JPH10224141A (ja) * 1997-02-10 1998-08-21 Toshiba Corp モノリシックアンテナ
EP1063723A1 (en) * 1999-06-22 2000-12-27 Interuniversitair Micro-Elektronica Centrum Vzw Slot coupled micromachined waveguide antenna
TW523920B (en) * 2000-11-18 2003-03-11 Lenghways Technology Co Ltd Integrated multi-channel communication passive device manufactured by using micro-electromechanical technique
US6752931B2 (en) 2001-12-21 2004-06-22 Texas Instruments Incorporated Method for using DRIE with reduced lateral etching
EP1398676A1 (fr) * 2002-09-10 2004-03-17 The Swatch Group Management Services AG Montre comportant un module électronique pour la mémorisation d'informations logé dans le fond de la boíte
EP1720213B1 (en) * 2004-02-27 2009-09-02 Mitsubishi Electric Corporation Transducer circuit
FR2908931B1 (fr) 2006-11-21 2009-02-13 Centre Nat Rech Scient Antenne et emetteur/recepteur terahertz integres,et procede pour leur fabrication.
WO2008111914A1 (en) * 2007-03-09 2008-09-18 Nanyang Technological University An integrated circuit structure and a method of forming the same
WO2009111839A1 (en) 2008-03-14 2009-09-17 National Ict Australia Limited Integration of microstrip antenna with cmos transceiver
US8952857B2 (en) * 2008-08-29 2015-02-10 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University Antennas with broadband operating bandwidths
JP5556072B2 (ja) * 2009-01-07 2014-07-23 ソニー株式会社 半導体装置、その製造方法、ミリ波誘電体内伝送装置
US8187920B2 (en) * 2009-02-20 2012-05-29 Texas Instruments Incorporated Integrated circuit micro-module
US8693468B2 (en) 2011-09-06 2014-04-08 Texas Instruments Incorporated Wireless bridge IC
US8648454B2 (en) * 2012-02-14 2014-02-11 International Business Machines Corporation Wafer-scale package structures with integrated antennas
ITTO20120174A1 (it) * 2012-02-27 2013-08-28 St Microelectronics Srl Dispositivo elettronico incapsulato comprendente circuiti elettronici integrati dotati di antenne di ricetrasmissione
US9196951B2 (en) * 2012-11-26 2015-11-24 International Business Machines Corporation Millimeter-wave radio frequency integrated circuit packages with integrated antennas
JP2016036128A (ja) * 2014-07-31 2016-03-17 キヤノン株式会社 発振素子

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005109933A (ja) 2003-09-30 2005-04-21 Mitsubishi Electric Corp 変換回路
JP2012195886A (ja) 2011-03-17 2012-10-11 Hiroshima Univ チップ間通信システム及び半導体装置
JP2016516327A (ja) 2013-03-08 2016-06-02 ノースロップ グルマン システムズ コーポレーションＮｏｒｔｈｒｏｐ Ｇｒｕｍｍａｎ Ｓｙｓｔｅｍｓ Ｃｏｒｐｏｒａｔｉｏｎ 導波路および半導体パッケージング

Also Published As

Publication number Publication date
EP3398230A2 (en) 2018-11-07
WO2017117362A3 (en) 2019-07-18
US20170187094A1 (en) 2017-06-29
US9985335B2 (en) 2018-05-29
CN109478710A (zh) 2019-03-15
JP2019516259A (ja) 2019-06-13
EP3398230A4 (en) 2020-01-01
CN109478710B (zh) 2021-07-13
WO2017117362A2 (en) 2017-07-06

Similar Documents

Publication Publication Date Title
JP7082318B2 (ja) 裏側集積回路高周波数信号の放射、受信、及び相互接続のための方法及び装置
US10103450B2 (en) Integration of area efficient antennas for phased array or wafer scale array antenna applications
US10109604B2 (en) Package with embedded electronic components and a waveguide cavity through the package cover, antenna apparatus including package, and method of manufacturing the same
US9536845B2 (en) Device for radiofrequency (RF) transmission with an integrated electromagnetic wave reflector
US8232920B2 (en) Integrated millimeter wave antenna and transceiver on a substrate
US7943404B2 (en) Integrated millimeter wave antenna and transceiver on a substrate
US8674883B2 (en) Antenna using through-silicon via
CN108428693A (zh) 集成电路封装
JP4856078B2 (ja) 反射アンテナ
US7548205B2 (en) Wafer scale antenna module with a backside connectivity
CN104160555A (zh) 用于辐射或接收电磁波的装置
US20160308270A1 (en) On chip antenna with opening
JP2019516259A5 (enExample)
CN105529341A (zh) 制作多晶片图像传感器的方法
Ndip et al. Modelling the shape, length and radiation characteristics of bond wire antennas
TW550856B (en) Dual damascene horn antenna
US20140217606A1 (en) Three-dimensional monolithic electronic-photonic integrated circuit
EP3529831B1 (en) Coaxial connector feed-through for multi-level interconnected semiconductor wafers
CN113258256A (zh) 天线模块
CN110429076B (zh) 垂直互联框架
WO2020220175A1 (zh) 封装天线及雷达组件封装体
Sravani et al. Design of 3d antennas for 24 ghz ism band applications
US20120032291A1 (en) Stand-Alone Device
US10403970B2 (en) Chip antenna, electronic component, and method for producing same
Zhang et al. Design of a partially-corporate feed double-layer slotted waveguide array antenna in 39 GHz band and fabrication by diffusion bonding of laminated thin metal plates

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20180629

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191213

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20191213

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20210202

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20210218

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210323

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210602

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210616

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20210915

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20211115

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211130

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220427

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220510

R150 Certificate of patent or registration of utility model

Ref document number: 7082318

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250