JP2019516259A5 - - Google Patents

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Publication number
JP2019516259A5
JP2019516259A5 JP2018534731A JP2018534731A JP2019516259A5 JP 2019516259 A5 JP2019516259 A5 JP 2019516259A5 JP 2018534731 A JP2018534731 A JP 2018534731A JP 2018534731 A JP2018534731 A JP 2018534731A JP 2019516259 A5 JP2019516259 A5 JP 2019516259A5
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JP
Japan
Prior art keywords
level
cavity opening
semiconductor substrate
antenna
opening
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JP2018534731A
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English (en)
Japanese (ja)
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JP7082318B2 (ja
JP2019516259A (ja
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Priority claimed from US14/982,932 external-priority patent/US9985335B2/en
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Publication of JP2019516259A5 publication Critical patent/JP2019516259A5/ja
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Publication of JP7082318B2 publication Critical patent/JP7082318B2/ja
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JP2018534731A 2015-12-29 2016-12-29 裏側集積回路高周波数信号の放射、受信、及び相互接続のための方法及び装置 Active JP7082318B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/982,932 US9985335B2 (en) 2015-12-29 2015-12-29 Methods and apparatus for backside integrated circuit high frequency signal radiation, reception and interconnects
US14/982,932 2015-12-29
PCT/US2016/069137 WO2017117362A2 (en) 2015-12-29 2016-12-29 Method and apparatus for backside integrated circuit high frequency signal radiation, reception and interconnects

Publications (3)

Publication Number Publication Date
JP2019516259A JP2019516259A (ja) 2019-06-13
JP2019516259A5 true JP2019516259A5 (enExample) 2020-01-30
JP7082318B2 JP7082318B2 (ja) 2022-06-08

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ID=59086642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018534731A Active JP7082318B2 (ja) 2015-12-29 2016-12-29 裏側集積回路高周波数信号の放射、受信、及び相互接続のための方法及び装置

Country Status (5)

Country Link
US (1) US9985335B2 (enExample)
EP (1) EP3398230A4 (enExample)
JP (1) JP7082318B2 (enExample)
CN (1) CN109478710B (enExample)
WO (1) WO2017117362A2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10199336B2 (en) * 2017-05-24 2019-02-05 Advanced Semiconductor Engineering, Inc. Antenna package device
CN110931938B (zh) * 2018-09-20 2021-04-16 宏碁股份有限公司 电子装置
US10840197B2 (en) * 2018-10-30 2020-11-17 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and manufacturing method thereof
EP3796466B8 (en) * 2019-09-18 2024-04-03 Beijing BOE Sensor Technology Co., Ltd. Radio frequency device
CN110783685B (zh) * 2019-10-30 2021-08-17 深圳捷豹电波科技有限公司 毫米波天线及毫米波天线制程设计
CN113130316B (zh) * 2021-04-08 2022-07-01 华进半导体封装先导技术研发中心有限公司 一种半导体结构及其制备方法
US20240380102A1 (en) * 2023-05-08 2024-11-14 City University Of Hong Kong Radiator for providing terahertz electromagnetic radiation
FI20236116A1 (en) * 2023-10-09 2025-04-10 Teknologian Tutkimuskeskus Vtt Oy On-chip antenna arrangement and manufacturing thereof

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2790033B2 (ja) * 1993-04-07 1998-08-27 松下電器産業株式会社 半導体装置
JPH10224141A (ja) * 1997-02-10 1998-08-21 Toshiba Corp モノリシックアンテナ
EP1063723A1 (en) * 1999-06-22 2000-12-27 Interuniversitair Micro-Elektronica Centrum Vzw Slot coupled micromachined waveguide antenna
TW523920B (en) * 2000-11-18 2003-03-11 Lenghways Technology Co Ltd Integrated multi-channel communication passive device manufactured by using micro-electromechanical technique
US6752931B2 (en) 2001-12-21 2004-06-22 Texas Instruments Incorporated Method for using DRIE with reduced lateral etching
EP1398676A1 (fr) * 2002-09-10 2004-03-17 The Swatch Group Management Services AG Montre comportant un module électronique pour la mémorisation d'informations logé dans le fond de la boíte
JP4080981B2 (ja) * 2003-09-30 2008-04-23 三菱電機株式会社 変換回路
EP1720213B1 (en) * 2004-02-27 2009-09-02 Mitsubishi Electric Corporation Transducer circuit
FR2908931B1 (fr) 2006-11-21 2009-02-13 Centre Nat Rech Scient Antenne et emetteur/recepteur terahertz integres,et procede pour leur fabrication.
WO2008111914A1 (en) * 2007-03-09 2008-09-18 Nanyang Technological University An integrated circuit structure and a method of forming the same
WO2009111839A1 (en) 2008-03-14 2009-09-17 National Ict Australia Limited Integration of microstrip antenna with cmos transceiver
US8952857B2 (en) * 2008-08-29 2015-02-10 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University Antennas with broadband operating bandwidths
JP5556072B2 (ja) * 2009-01-07 2014-07-23 ソニー株式会社 半導体装置、その製造方法、ミリ波誘電体内伝送装置
US8187920B2 (en) * 2009-02-20 2012-05-29 Texas Instruments Incorporated Integrated circuit micro-module
JP5812462B2 (ja) * 2011-03-17 2015-11-11 国立大学法人広島大学 チップ間通信システム及び半導体装置
US8693468B2 (en) 2011-09-06 2014-04-08 Texas Instruments Incorporated Wireless bridge IC
US8648454B2 (en) * 2012-02-14 2014-02-11 International Business Machines Corporation Wafer-scale package structures with integrated antennas
ITTO20120174A1 (it) * 2012-02-27 2013-08-28 St Microelectronics Srl Dispositivo elettronico incapsulato comprendente circuiti elettronici integrati dotati di antenne di ricetrasmissione
US9196951B2 (en) * 2012-11-26 2015-11-24 International Business Machines Corporation Millimeter-wave radio frequency integrated circuit packages with integrated antennas
US9478458B2 (en) 2013-03-08 2016-10-25 Northrop Grumman Systems Corporation Waveguide and semiconductor packaging
JP2016036128A (ja) * 2014-07-31 2016-03-17 キヤノン株式会社 発振素子

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