CN109478710B - 用于背侧集成电路高频信号辐射、接收的方法和设备以及互连件 - Google Patents

用于背侧集成电路高频信号辐射、接收的方法和设备以及互连件 Download PDF

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Publication number
CN109478710B
CN109478710B CN201680061528.7A CN201680061528A CN109478710B CN 109478710 B CN109478710 B CN 109478710B CN 201680061528 A CN201680061528 A CN 201680061528A CN 109478710 B CN109478710 B CN 109478710B
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level
semiconductor device
backside
forming
cavity opening
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Chinese (zh)
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CN109478710A (zh
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本杰明·史塔生·库克
斯瓦米纳坦·桑卡兰
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Texas Instruments Inc
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Texas Instruments Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H01P5/107—Hollow-waveguide/strip-line transitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/20—Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/90—Non-optical transmission systems, e.g. transmission systems employing non-photonic corpuscular radiation

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Aerials With Secondary Devices (AREA)
  • Waveguide Aerials (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN201680061528.7A 2015-12-29 2016-12-29 用于背侧集成电路高频信号辐射、接收的方法和设备以及互连件 Active CN109478710B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/982,932 US9985335B2 (en) 2015-12-29 2015-12-29 Methods and apparatus for backside integrated circuit high frequency signal radiation, reception and interconnects
US14/982,932 2015-12-29
PCT/US2016/069137 WO2017117362A2 (en) 2015-12-29 2016-12-29 Method and apparatus for backside integrated circuit high frequency signal radiation, reception and interconnects

Publications (2)

Publication Number Publication Date
CN109478710A CN109478710A (zh) 2019-03-15
CN109478710B true CN109478710B (zh) 2021-07-13

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US (1) US9985335B2 (enExample)
EP (1) EP3398230A4 (enExample)
JP (1) JP7082318B2 (enExample)
CN (1) CN109478710B (enExample)
WO (1) WO2017117362A2 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10199336B2 (en) * 2017-05-24 2019-02-05 Advanced Semiconductor Engineering, Inc. Antenna package device
CN110931938B (zh) * 2018-09-20 2021-04-16 宏碁股份有限公司 电子装置
US10840197B2 (en) * 2018-10-30 2020-11-17 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and manufacturing method thereof
EP3796466B8 (en) * 2019-09-18 2024-04-03 Beijing BOE Sensor Technology Co., Ltd. Radio frequency device
CN110783685B (zh) * 2019-10-30 2021-08-17 深圳捷豹电波科技有限公司 毫米波天线及毫米波天线制程设计
CN113130316B (zh) * 2021-04-08 2022-07-01 华进半导体封装先导技术研发中心有限公司 一种半导体结构及其制备方法
US20240380102A1 (en) * 2023-05-08 2024-11-14 City University Of Hong Kong Radiator for providing terahertz electromagnetic radiation
FI20236116A1 (en) * 2023-10-09 2025-04-10 Teknologian Tutkimuskeskus Vtt Oy On-chip antenna arrangement and manufacturing thereof

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US6061026A (en) * 1997-02-10 2000-05-09 Kabushiki Kaisha Toshiba Monolithic antenna
EP1063723A1 (en) * 1999-06-22 2000-12-27 Interuniversitair Micro-Elektronica Centrum Vzw Slot coupled micromachined waveguide antenna
CN1682161A (zh) * 2002-09-10 2005-10-12 斯沃奇集团管理服务股份公司 在其壳体的背部包括用于存储信息的电子模块的表
CN103247581A (zh) * 2012-02-14 2013-08-14 国际商业机器公司 芯片封装和装置
CN104201162A (zh) * 2009-01-07 2014-12-10 索尼公司 半导体器件及其制造方法、毫米波电介质内传输装置及其制造方法、以及毫米波电介质内传输系统

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JP2790033B2 (ja) * 1993-04-07 1998-08-27 松下電器産業株式会社 半導体装置
TW523920B (en) * 2000-11-18 2003-03-11 Lenghways Technology Co Ltd Integrated multi-channel communication passive device manufactured by using micro-electromechanical technique
US6752931B2 (en) 2001-12-21 2004-06-22 Texas Instruments Incorporated Method for using DRIE with reduced lateral etching
JP4080981B2 (ja) * 2003-09-30 2008-04-23 三菱電機株式会社 変換回路
EP1720213B1 (en) * 2004-02-27 2009-09-02 Mitsubishi Electric Corporation Transducer circuit
FR2908931B1 (fr) 2006-11-21 2009-02-13 Centre Nat Rech Scient Antenne et emetteur/recepteur terahertz integres,et procede pour leur fabrication.
WO2008111914A1 (en) * 2007-03-09 2008-09-18 Nanyang Technological University An integrated circuit structure and a method of forming the same
WO2009111839A1 (en) 2008-03-14 2009-09-17 National Ict Australia Limited Integration of microstrip antenna with cmos transceiver
US8952857B2 (en) * 2008-08-29 2015-02-10 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University Antennas with broadband operating bandwidths
US8187920B2 (en) * 2009-02-20 2012-05-29 Texas Instruments Incorporated Integrated circuit micro-module
JP5812462B2 (ja) * 2011-03-17 2015-11-11 国立大学法人広島大学 チップ間通信システム及び半導体装置
US8693468B2 (en) 2011-09-06 2014-04-08 Texas Instruments Incorporated Wireless bridge IC
ITTO20120174A1 (it) * 2012-02-27 2013-08-28 St Microelectronics Srl Dispositivo elettronico incapsulato comprendente circuiti elettronici integrati dotati di antenne di ricetrasmissione
US9196951B2 (en) * 2012-11-26 2015-11-24 International Business Machines Corporation Millimeter-wave radio frequency integrated circuit packages with integrated antennas
US9478458B2 (en) 2013-03-08 2016-10-25 Northrop Grumman Systems Corporation Waveguide and semiconductor packaging
JP2016036128A (ja) * 2014-07-31 2016-03-17 キヤノン株式会社 発振素子

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6061026A (en) * 1997-02-10 2000-05-09 Kabushiki Kaisha Toshiba Monolithic antenna
EP1063723A1 (en) * 1999-06-22 2000-12-27 Interuniversitair Micro-Elektronica Centrum Vzw Slot coupled micromachined waveguide antenna
CN1682161A (zh) * 2002-09-10 2005-10-12 斯沃奇集团管理服务股份公司 在其壳体的背部包括用于存储信息的电子模块的表
CN104201162A (zh) * 2009-01-07 2014-12-10 索尼公司 半导体器件及其制造方法、毫米波电介质内传输装置及其制造方法、以及毫米波电介质内传输系统
CN103247581A (zh) * 2012-02-14 2013-08-14 国际商业机器公司 芯片封装和装置

Also Published As

Publication number Publication date
EP3398230A2 (en) 2018-11-07
WO2017117362A3 (en) 2019-07-18
US20170187094A1 (en) 2017-06-29
JP7082318B2 (ja) 2022-06-08
US9985335B2 (en) 2018-05-29
CN109478710A (zh) 2019-03-15
JP2019516259A (ja) 2019-06-13
EP3398230A4 (en) 2020-01-01
WO2017117362A2 (en) 2017-07-06

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