JP2014513493A - 高性能ガラスベースの60GHz/MM波フェーズドアレイアンテナおよびその製造方法 - Google Patents
高性能ガラスベースの60GHz/MM波フェーズドアレイアンテナおよびその製造方法 Download PDFInfo
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- JP2014513493A JP2014513493A JP2014509326A JP2014509326A JP2014513493A JP 2014513493 A JP2014513493 A JP 2014513493A JP 2014509326 A JP2014509326 A JP 2014509326A JP 2014509326 A JP2014509326 A JP 2014509326A JP 2014513493 A JP2014513493 A JP 2014513493A
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Abstract
【選択図】 図1
Description
Claims (20)
- 複数のエミッタ配線を有する第1の誘電体層と、
前記第1の誘電体層に結合されている第2の誘電体層と
を備え、
前記第1の誘電体層は、前記第2の誘電体層よりも誘電率が高く、
前記第2の誘電体層は、ガラスであり、上面に配設されている複数の平面状アンテナ素子から構成されるアレイを支持しており、
前記第2の誘電体層は、前記複数の平面状アンテナ素子から構成されるアレイに対応する複数のキャビティから構成されるアレイを有し、
前記複数の平面状アンテナ素子はそれぞれ、前記第2の誘電体層において、前記複数のキャビティのうち対応するキャビティと垂直方向において位置合わせされている、フェーズドアレイアンテナ基板(PAA基板)。 - 前記複数の平面状アンテナ素子はそれぞれ、所与の面積を持ち、
前記複数のキャビティはそれぞれのフットプリントが、前記複数の平面状のアンテナ素子のうち対応する一の平面状アンテナ素子の面積よりも小さい、請求項1に記載のPAA基板。 - 前記複数の平面状アンテナ素子はそれぞれ、所与の面積を持ち、
前記複数のキャビティはそれぞれのフットプリントが、前記複数の平面状アンテナ素子のうち対応する一の平面状アンテナ素子の面積と等しい、請求項1に記載のPAA基板。 - 前記複数の平面状アンテナ素子はそれぞれ、所与の面積を持ち、
前記複数のキャビティはそれぞれのフットプリントが、前記複数の平面状のアンテナ素子のうち対応する一の平面状のアンテナ素子の面積よりも大きい、請求項1に記載のPAA基板。 - 前記複数の平面状アンテナ素子のそれぞれの底面が、前記第2の誘電体層で被覆されている、請求項1から4のいずれか一項に記載のPAA基板。
- 前記複数の平面状アンテナ素子のそれぞれの底面が、前記複数のキャビティのうち対応するキャビティによって露出している、請求項1から4のいずれか一項に記載のPAA基板。
- 前記複数の平面状アンテナ素子はそれぞれ、前記複数のキャビティのうち対応するキャビティの内部に配設されており、前記複数の平面状アンテナ素子のそれぞれの上面が、前記第2の誘電体層で被覆されている、請求項1から4のいずれか一項に記載のPAA基板。
- スルーシリコンビアおよび無線周波数集積回路を有するダイ(TSV RFIC)と、
前記TSV RFICと垂直方向に集積化されているフェーズドアレイアンテナ基板(PAA基板)とを備え、
前記PAA基板は、少なくとも一の配線を支持している第1の誘電体層を有し、
前記PAA基板は、ガラス製の第2の誘電体層上に配設されている複数のアンテナ素子を有し、
前記複数のアンテナ素子はそれぞれ、複数のTSVを介して前記TSV RFICに結合されており、
前記複数のアンテナ素子はそれぞれ、キャビティの上方に配設されており、
前記第2の誘電体層は、少なくとも一のエミッタ配線を支持している第1の誘電体層上に配設されている、装置。 - 前記複数のアンテナ素子はそれぞれ、所与の面積を持ち、
前記キャビティのフットプリントは、前記複数のアンテナ素子のそれぞれの面積よりも小さい、請求項8に記載の装置。 - 前記複数のアンテナ素子はそれぞれ、所与の面積を持ち、
前記キャビティのフットプリントは、前記複数のアンテナ素子のそれぞれの面積と等しい、請求項8に記載の装置。 - 前記複数のアンテナ素子はそれぞれ、所与の面積を持ち、
前記キャビティのフットプリントは、前記複数のアンテナ素子のそれぞれの面積よりも大きい、請求項8に記載の装置。 - 前記PAA基板が有する前記複数のアンテナ素子は、前記PAA基板内の誘導結合開口を介して、前記TSV RFICに結合されている、請求項8から11のいずれか一項に記載の装置。
- 前記PAA基板が有する前記複数のアンテナ素子は、前記PAA基板内のビア結合によって、前記TSV RFICに結合されている、請求項8から11のいずれか一項に記載の装置。
- 前記TSV RFICが実装されている第一次実装基板と、
前記PAA基板と前記TSV RFICが実装されている前記第一次実装基板との間に配設される少なくとも一のダミーバンプと
をさらに備え、
前記PAA基板は、前記複数のアンテナ素子および前記TSV RFICに結合されている埋め込み接地面を有している、請求項8から13のいずれか一項に記載の装置。 - スルーシリコンビアデジタルプロセッサダイ(TSV DP)と、
前記TSV DPが実装されている第一次実装基板と、
前記PAA基板と、前記TSV RFICが実装されている前記基板との間に配置されている少なくとも一のダミーバンプと
をさらに備え、
前記TSV DPは、前記TSV RFIC内の少なくとも一のTSVおよび前記TSV DP内の少なくとも一のTSVを介して前記TSV RFICに結合されており、
前記TSV DPおよび前記TSV RFICは前記PAA基板の下方において垂直方向に集積化されており、
前記PAA基板は、前記複数のアンテナ素子および前記TSV RFICに結合されている埋め込み接地面を含む
請求項8から14のいずれか一項に記載の装置。 - スルーシリコンビアメモリダイ(TSVメモリダイ)と、
前記TSVメモリダイが実装されている第一次実装基板と
をさらに備え、
前記TSVメモリダイは、前記TSV RFIC内の少なくとも一のTSVおよび前記TSVメモリダイ内の少なくとも一のTSVを介して前記TSV RFICに結合されており、
前記TSVメモリダイおよび前記TSV RFICは前記PAA基板の下方において垂直方向に集積化されており、
前記第一次実装基板は、前記TSV RFICと共に機能する、内部に埋め込まれている少なくとも一の受動型デバイスを有する
請求項8から14のいずれか一項に記載の装置。 - 垂直方向に集積化されている装置を形成するプロセスであって、
ガラス基板内にキャビティを形成する段階と、
前記キャビティの上方であって前記ガラス基板上にフェーズドアレイアンテナ素子(PAA素子)を形成する段階と
を備えるプロセス。 - 各平面状アンテナ素子は、底面が第2の誘電体層で被覆されるように形成される、請求項17に記載のプロセス。
- 各平面状アンテナ素子は、対応するキャビティによって、底面が露出するように形成される、請求項17に記載のプロセス。
- 各平面状アンテナ素子は、対応するキャビティの内部に配設されると共に上面が第2の誘電体層で被覆されるように形成される、請求項17に記載のプロセス。
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016506675A (ja) * | 2013-01-14 | 2016-03-03 | インテル・コーポレーション | 裏面再配線層パッチアンテナ |
JP2018182449A (ja) * | 2017-04-07 | 2018-11-15 | 株式会社東芝 | アンテナモジュール |
JP2020195002A (ja) * | 2019-05-24 | 2020-12-03 | 株式会社Nsc | 平面ガラスアンテナおよびその製造方法 |
JP2020196652A (ja) * | 2019-06-05 | 2020-12-10 | 株式会社Nsc | 平面ガラスアンテナの製造方法。 |
JP2021044611A (ja) * | 2019-09-06 | 2021-03-18 | 大日本印刷株式会社 | 画像表示装置 |
JP2021514571A (ja) * | 2018-02-21 | 2021-06-10 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | 拡張可能フェーズド・アレイ・パッケージを実現する装置および方法 |
JP2021533623A (ja) * | 2018-08-02 | 2021-12-02 | ヴィアサット, インコーポレイテッドViaSat, Inc. | アンテナ素子モジュール |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8901688B2 (en) | 2011-05-05 | 2014-12-02 | Intel Corporation | High performance glass-based 60 ghz / mm-wave phased array antennas and methods of making same |
KR101962499B1 (ko) | 2011-10-28 | 2019-03-26 | 코닝 인코포레이티드 | 적외선 반사도를 갖는 유리 제품 및 이의 제조방법 |
US9153863B2 (en) * | 2012-01-24 | 2015-10-06 | E I Du Pont De Nemours And Company | Low temperature co-fired ceramic (LTCC) system in a package (SiP) configurations for microwave/millimeter wave packaging applications |
US9166284B2 (en) * | 2012-12-20 | 2015-10-20 | Intel Corporation | Package structures including discrete antennas assembled on a device |
US20140264733A1 (en) * | 2013-03-14 | 2014-09-18 | GLOBALFOUNDERS Singapore Pte. Ltd. | Device with integrated passive component |
CN105379007A (zh) * | 2013-08-16 | 2016-03-02 | 英特尔公司 | 具有气隙层或腔的毫米波天线结构 |
KR20160036666A (ko) * | 2013-09-27 | 2016-04-04 | 인텔 코포레이션 | 수동 부품용 중첩체 기판을 구비한 다이 패키지 |
US9659904B2 (en) | 2013-12-12 | 2017-05-23 | Intel Corporation | Distributed on-package millimeter-wave radio |
KR102187775B1 (ko) * | 2014-01-10 | 2020-12-07 | 엘지이노텍 주식회사 | 레이더 장치 |
US9520650B2 (en) * | 2014-03-31 | 2016-12-13 | Intel Corporation | Combination LTE and WiGig antenna |
US9484308B2 (en) * | 2014-06-25 | 2016-11-01 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device |
CN104701610A (zh) * | 2014-08-11 | 2015-06-10 | 庄昆杰 | 具有控制波束宽度的小型化天线单元和大规模天线阵列 |
CN104868236A (zh) * | 2015-04-16 | 2015-08-26 | 深圳市华信天线技术有限公司 | 抗载微带天线 |
CN107531562B (zh) | 2015-04-30 | 2021-05-28 | 康宁股份有限公司 | 具有离散的金属银层的导电制品及其制造方法 |
US10361476B2 (en) * | 2015-05-26 | 2019-07-23 | Qualcomm Incorporated | Antenna structures for wireless communications |
FR3039711B1 (fr) | 2015-07-28 | 2017-12-29 | Commissariat Energie Atomique | Cellule elementaire d'un reseau transmetteur pour une antenne reconfigurable. |
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US10476164B2 (en) | 2015-10-28 | 2019-11-12 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
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DE102016201978B4 (de) | 2016-02-10 | 2018-09-06 | National Chung Shan Institute Of Science And Technology | Antennenvorrichtung und Antennengruppenvorrichtung für Millimeterwellen |
US10116064B2 (en) | 2016-02-16 | 2018-10-30 | National Chung Shan Institute Of Science And Technology | Millimeter-wave antenna device and millimeter-wave antenna array device thereof |
CN107369653A (zh) * | 2016-05-13 | 2017-11-21 | 北京中电网信息技术有限公司 | 一种高干扰组件的系统级封装方法、结构及分离阵列结构 |
US10756033B2 (en) | 2016-06-03 | 2020-08-25 | Intel IP Corporation | Wireless module with antenna package and cap package |
US10319694B2 (en) | 2016-08-10 | 2019-06-11 | Qualcomm Incorporated | Semiconductor assembly and method of making same |
CN110447146A (zh) * | 2016-12-21 | 2019-11-12 | 英特尔公司 | 无线通信技术、装置和方法 |
US11876295B2 (en) * | 2017-05-02 | 2024-01-16 | Rogers Corporation | Electromagnetic reflector for use in a dielectric resonator antenna system |
KR102411147B1 (ko) | 2017-07-28 | 2022-06-21 | 삼성전기주식회사 | 안테나 모듈 및 안테나 모듈 제조 방법 |
US10971825B2 (en) * | 2017-07-28 | 2021-04-06 | Samsung Electro-Mechanics Co., Ltd. | Antenna module and method of manufacturing the same |
KR102019951B1 (ko) | 2017-08-11 | 2019-09-11 | 삼성전기주식회사 | 안테나 모듈 |
US11095037B2 (en) * | 2017-08-11 | 2021-08-17 | Samsung Electro-Mechanics Co., Ltd. | Antenna module |
US11005167B2 (en) * | 2017-11-03 | 2021-05-11 | Antenum Llc | Low profile antenna-conformal one dimensional |
KR102494338B1 (ko) * | 2017-11-08 | 2023-02-01 | 삼성전기주식회사 | 안테나 모듈 |
KR102425821B1 (ko) * | 2017-11-28 | 2022-07-27 | 삼성전자주식회사 | 커플링 급전을 이용한 이중 대역 안테나 및 그것을 포함하는 전자 장치 |
KR102028714B1 (ko) | 2017-12-06 | 2019-10-07 | 삼성전자주식회사 | 안테나 모듈 및 안테나 모듈 제조 방법 |
US11616302B2 (en) | 2018-01-15 | 2023-03-28 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
KR102022353B1 (ko) | 2018-01-18 | 2019-09-18 | 삼성전기주식회사 | 안테나 모듈 |
US11189905B2 (en) | 2018-04-13 | 2021-11-30 | International Business Machines Corporation | Integrated antenna array packaging structures and methods |
US10854978B2 (en) * | 2018-04-23 | 2020-12-01 | Samsung Electro-Mechanics Co., Ltd. | Antenna apparatus and antenna module |
US11271309B2 (en) | 2018-08-10 | 2022-03-08 | Ball Aerospace & Technologies Corp. | Systems and methods for interconnecting and isolating antenna system components |
US11552390B2 (en) | 2018-09-11 | 2023-01-10 | Rogers Corporation | Dielectric resonator antenna system |
WO2020054001A1 (ja) * | 2018-09-12 | 2020-03-19 | 三菱電機株式会社 | 空中線 |
TWI682521B (zh) * | 2018-09-13 | 2020-01-11 | 矽品精密工業股份有限公司 | 電子封裝件及其製法 |
US11398415B2 (en) * | 2018-09-19 | 2022-07-26 | Intel Corporation | Stacked through-silicon vias for multi-device packages |
CN111566876B (zh) * | 2018-10-18 | 2021-07-30 | 阿莫技术有限公司 | 具有腔体结构的天线封装组件 |
US11637377B2 (en) | 2018-12-04 | 2023-04-25 | Rogers Corporation | Dielectric electromagnetic structure and method of making the same |
KR102593888B1 (ko) * | 2019-06-13 | 2023-10-24 | 삼성전기주식회사 | 안테나 모듈 및 이를 포함하는 전자기기 |
KR102268383B1 (ko) * | 2019-08-02 | 2021-06-23 | 삼성전기주식회사 | 칩 안테나 |
US11145952B2 (en) * | 2019-11-14 | 2021-10-12 | Raytheon Company | Advanced communications array |
DE102020200974A1 (de) * | 2020-01-28 | 2021-07-29 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Antennenmodul |
US11482790B2 (en) | 2020-04-08 | 2022-10-25 | Rogers Corporation | Dielectric lens and electromagnetic device with same |
US11735804B2 (en) * | 2020-05-11 | 2023-08-22 | Qualcomm Incorporated | Multi-core broadband PCB antenna |
US20220131277A1 (en) * | 2020-10-27 | 2022-04-28 | Mixcomm, Inc. | Methods and apparatus for implementing antenna assemblies and/or combining antenna assemblies to form arrays |
JP2022154499A (ja) * | 2021-03-30 | 2022-10-13 | Tdk株式会社 | アンテナモジュール |
US20230268295A1 (en) * | 2022-02-18 | 2023-08-24 | Advanced Semiconductor Engineering, Inc. | Semiconductor device and method of manufacturing the same |
US20230307846A1 (en) * | 2022-03-22 | 2023-09-28 | Intel Corporation | High precision scalable packaging architecture based on radio frequency scanning |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63316905A (ja) * | 1987-06-19 | 1988-12-26 | Mitsubishi Electric Corp | アンテナ一体化マイクロ波集積回路 |
JP2000114866A (ja) * | 1998-08-07 | 2000-04-21 | Sarnoff Corp | 多層セラミック基板を用いて形成されるアンテナ |
JP2001028413A (ja) * | 1996-02-29 | 2001-01-30 | Kyocera Corp | 高周波用パッケージ |
US20060017157A1 (en) * | 2004-04-30 | 2006-01-26 | Sharp Kabushiki Kaisha | High frequency semiconductor apparatus, transmitting apparatus and receiving apparatus |
JP2009010311A (ja) * | 2007-06-26 | 2009-01-15 | Hynix Semiconductor Inc | スルーシリコンビアスタックパッケージ及びその製造方法 |
JP2010016789A (ja) * | 2008-07-07 | 2010-01-21 | Internatl Business Mach Corp <Ibm> | N個集積開口部結合型パッチ・アンテナを有する無線周波数集積回路チップ・パッケージ、及びその製造する方法 |
US20100066631A1 (en) * | 2006-09-21 | 2010-03-18 | Raytheon Company | Panel Array |
JP2012514431A (ja) * | 2008-12-31 | 2012-06-21 | インテル コーポレイション | プラットフォーム統合型フェーズドアレイ送受信モジュールのための装置 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000196329A (ja) | 1998-12-24 | 2000-07-14 | Nec Corp | フェーズドアレイアンテナおよびその製造方法 |
US6166705A (en) | 1999-07-20 | 2000-12-26 | Harris Corporation | Multi title-configured phased array antenna architecture |
US6266015B1 (en) | 2000-07-19 | 2001-07-24 | Harris Corporation | Phased array antenna having stacked patch antenna element with single millimeter wavelength feed and microstrip quadrature-to-circular polarization circuit |
JP2004023228A (ja) * | 2002-06-13 | 2004-01-22 | Matsushita Electric Ind Co Ltd | アンテナ制御装置、及びフェイズドアレイアンテナ |
US6822616B2 (en) * | 2002-12-03 | 2004-11-23 | Harris Corporation | Multi-layer capacitive coupling in phased array antennas |
US6927745B2 (en) | 2003-08-25 | 2005-08-09 | Harris Corporation | Frequency selective surfaces and phased array antennas using fluidic dielectrics |
DE102006023123B4 (de) * | 2005-06-01 | 2011-01-13 | Infineon Technologies Ag | Abstandserfassungsradar für Fahrzeuge mit einem Halbleitermodul mit Komponenten für Höchstfrequenztechnik in Kunststoffgehäuse und Verfahren zur Herstellung eines Halbleitermoduls mit Komponenten für ein Abstandserfassungsradar für Fahrzeuge in einem Kunststoffgehäuse |
US7692295B2 (en) * | 2006-03-31 | 2010-04-06 | Intel Corporation | Single package wireless communication device |
US20080001262A1 (en) | 2006-06-29 | 2008-01-03 | Telesphor Kamgaing | Silicon level solution for mitigation of substrate noise |
US7518229B2 (en) | 2006-08-03 | 2009-04-14 | International Business Machines Corporation | Versatile Si-based packaging with integrated passive components for mmWave applications |
DE102007046566B4 (de) * | 2006-10-05 | 2011-07-07 | Infineon Technologies AG, 85579 | HF-Frontend für ein Radarsystem |
US8053873B2 (en) | 2008-06-06 | 2011-11-08 | Texas Instruments Incorporated | IC having voltage regulated integrated Faraday shield |
US8169059B2 (en) | 2008-09-30 | 2012-05-01 | Infineon Technologies Ag | On-chip RF shields with through substrate conductors |
US7936052B2 (en) | 2008-09-30 | 2011-05-03 | Infineon Technologies Ag | On-chip RF shields with backside redistribution lines |
US7948064B2 (en) | 2008-09-30 | 2011-05-24 | Infineon Technologies Ag | System on a chip with on-chip RF shield |
CN101728369B (zh) * | 2008-10-28 | 2014-05-07 | 赛伊公司 | 表面可安装的集成电路封装方法 |
US20100127937A1 (en) | 2008-11-25 | 2010-05-27 | Qualcomm Incorporated | Antenna Integrated in a Semiconductor Chip |
US8256685B2 (en) * | 2009-06-30 | 2012-09-04 | International Business Machines Corporation | Compact millimeter wave packages with integrated antennas |
US8362599B2 (en) | 2009-09-24 | 2013-01-29 | Qualcomm Incorporated | Forming radio frequency integrated circuits |
US8901688B2 (en) | 2011-05-05 | 2014-12-02 | Intel Corporation | High performance glass-based 60 ghz / mm-wave phased array antennas and methods of making same |
US8816906B2 (en) * | 2011-05-05 | 2014-08-26 | Intel Corporation | Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates |
US8759950B2 (en) * | 2011-05-05 | 2014-06-24 | Intel Corporation | Radio- and electromagnetic interference through-silicon vias for stacked-die packages, and methods of making same |
-
2011
- 2011-05-05 US US13/101,891 patent/US8901688B2/en active Active
-
2012
- 2012-04-27 BR BR112013033613-7A patent/BR112013033613A2/pt not_active IP Right Cessation
- 2012-04-27 JP JP2014509326A patent/JP5740048B2/ja active Active
- 2012-04-27 KR KR1020137031191A patent/KR101537884B1/ko active IP Right Grant
- 2012-04-27 EP EP12779473.3A patent/EP2705572B1/en active Active
- 2012-04-27 CN CN201280026451.1A patent/CN103782448B/zh active Active
- 2012-04-27 WO PCT/US2012/035421 patent/WO2012151123A2/en active Application Filing
- 2012-05-03 TW TW101115764A patent/TWI557994B/zh active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63316905A (ja) * | 1987-06-19 | 1988-12-26 | Mitsubishi Electric Corp | アンテナ一体化マイクロ波集積回路 |
JP2001028413A (ja) * | 1996-02-29 | 2001-01-30 | Kyocera Corp | 高周波用パッケージ |
JP2000114866A (ja) * | 1998-08-07 | 2000-04-21 | Sarnoff Corp | 多層セラミック基板を用いて形成されるアンテナ |
US20060017157A1 (en) * | 2004-04-30 | 2006-01-26 | Sharp Kabushiki Kaisha | High frequency semiconductor apparatus, transmitting apparatus and receiving apparatus |
US20100066631A1 (en) * | 2006-09-21 | 2010-03-18 | Raytheon Company | Panel Array |
JP2009010311A (ja) * | 2007-06-26 | 2009-01-15 | Hynix Semiconductor Inc | スルーシリコンビアスタックパッケージ及びその製造方法 |
JP2010016789A (ja) * | 2008-07-07 | 2010-01-21 | Internatl Business Mach Corp <Ibm> | N個集積開口部結合型パッチ・アンテナを有する無線周波数集積回路チップ・パッケージ、及びその製造する方法 |
JP2012514431A (ja) * | 2008-12-31 | 2012-06-21 | インテル コーポレイション | プラットフォーム統合型フェーズドアレイ送受信モジュールのための装置 |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016506675A (ja) * | 2013-01-14 | 2016-03-03 | インテル・コーポレーション | 裏面再配線層パッチアンテナ |
US10403511B2 (en) | 2013-01-14 | 2019-09-03 | Intel Corporation | Backside redistribution layer patch antenna |
JP2018182449A (ja) * | 2017-04-07 | 2018-11-15 | 株式会社東芝 | アンテナモジュール |
JP7287971B2 (ja) | 2018-02-21 | 2023-06-06 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 拡張可能フェーズド・アレイ・パッケージを実現する装置および方法 |
JP2021514571A (ja) * | 2018-02-21 | 2021-06-10 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | 拡張可能フェーズド・アレイ・パッケージを実現する装置および方法 |
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JP2021533623A (ja) * | 2018-08-02 | 2021-12-02 | ヴィアサット, インコーポレイテッドViaSat, Inc. | アンテナ素子モジュール |
JP2020195002A (ja) * | 2019-05-24 | 2020-12-03 | 株式会社Nsc | 平面ガラスアンテナおよびその製造方法 |
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JP7264461B2 (ja) | 2019-06-05 | 2023-04-25 | 株式会社Nsc | 平面ガラスアンテナの製造方法。 |
JP2020196652A (ja) * | 2019-06-05 | 2020-12-10 | 株式会社Nsc | 平面ガラスアンテナの製造方法。 |
JP2021044611A (ja) * | 2019-09-06 | 2021-03-18 | 大日本印刷株式会社 | 画像表示装置 |
JP7302396B2 (ja) | 2019-09-06 | 2023-07-04 | 大日本印刷株式会社 | 画像表示装置 |
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TW201251198A (en) | 2012-12-16 |
CN103782448B (zh) | 2017-02-15 |
KR20140005339A (ko) | 2014-01-14 |
KR101537884B1 (ko) | 2015-07-21 |
US20120280380A1 (en) | 2012-11-08 |
WO2012151123A3 (en) | 2013-01-10 |
WO2012151123A9 (en) | 2013-05-30 |
BR112013033613A2 (pt) | 2020-08-04 |
EP2705572B1 (en) | 2018-11-21 |
EP2705572A2 (en) | 2014-03-12 |
US8901688B2 (en) | 2014-12-02 |
CN103782448A (zh) | 2014-05-07 |
WO2012151123A2 (en) | 2012-11-08 |
EP2705572A4 (en) | 2014-11-26 |
JP5740048B2 (ja) | 2015-06-24 |
TWI557994B (zh) | 2016-11-11 |
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