JP7064846B2 - 表示装置及び表示装置の製造方法 - Google Patents

表示装置及び表示装置の製造方法 Download PDF

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Publication number
JP7064846B2
JP7064846B2 JP2017204545A JP2017204545A JP7064846B2 JP 7064846 B2 JP7064846 B2 JP 7064846B2 JP 2017204545 A JP2017204545 A JP 2017204545A JP 2017204545 A JP2017204545 A JP 2017204545A JP 7064846 B2 JP7064846 B2 JP 7064846B2
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Japan
Prior art keywords
layer
inorganic insulating
insulating layer
resin layer
display device
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JP2017204545A
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English (en)
Japanese (ja)
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JP2019078847A (ja
JP2019078847A5 (enExample
Inventor
哲 丸山
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Japan Display Inc
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Japan Display Inc
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Application filed by Japan Display Inc filed Critical Japan Display Inc
Priority to JP2017204545A priority Critical patent/JP7064846B2/ja
Priority to PCT/JP2018/039202 priority patent/WO2019082847A1/ja
Publication of JP2019078847A publication Critical patent/JP2019078847A/ja
Priority to US16/846,478 priority patent/US11258022B2/en
Publication of JP2019078847A5 publication Critical patent/JP2019078847A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/06—Electrode terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2017204545A 2017-10-23 2017-10-23 表示装置及び表示装置の製造方法 Active JP7064846B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017204545A JP7064846B2 (ja) 2017-10-23 2017-10-23 表示装置及び表示装置の製造方法
PCT/JP2018/039202 WO2019082847A1 (ja) 2017-10-23 2018-10-22 表示装置及び表示装置の製造方法
US16/846,478 US11258022B2 (en) 2017-10-23 2020-04-13 Manufacturing method of display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017204545A JP7064846B2 (ja) 2017-10-23 2017-10-23 表示装置及び表示装置の製造方法

Publications (3)

Publication Number Publication Date
JP2019078847A JP2019078847A (ja) 2019-05-23
JP2019078847A5 JP2019078847A5 (enExample) 2020-12-10
JP7064846B2 true JP7064846B2 (ja) 2022-05-11

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JP2017204545A Active JP7064846B2 (ja) 2017-10-23 2017-10-23 表示装置及び表示装置の製造方法

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US (1) US11258022B2 (enExample)
JP (1) JP7064846B2 (enExample)
WO (1) WO2019082847A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109755256B (zh) 2017-11-01 2022-01-11 京东方科技集团股份有限公司 柔性显示面板及制备方法、柔性显示装置
KR102536257B1 (ko) * 2018-01-25 2023-05-24 삼성디스플레이 주식회사 표시 장치
US11699778B2 (en) * 2018-03-16 2023-07-11 Sharp Kabushiki Kaisha Display device with a controlled thickness
WO2019180838A1 (ja) * 2018-03-20 2019-09-26 シャープ株式会社 表示装置及びその製造方法
US11380222B2 (en) * 2018-03-27 2022-07-05 Sharp Kabushiki Kaisha Display device
KR102754154B1 (ko) * 2019-08-05 2025-01-10 엘지디스플레이 주식회사 표시 장치
EP4080594B1 (en) * 2019-12-20 2025-11-12 BOE Technology Group Co., Ltd. Flexible display panel and manufacturing method therefor, and flexible display apparatus
JP7499089B2 (ja) * 2019-12-26 2024-06-13 Ｔｉａｎｍａ Ｊａｐａｎ株式会社 表示装置
KR102752245B1 (ko) * 2019-12-31 2025-01-10 엘지디스플레이 주식회사 전계발광 표시장치 및 그의 제조방법
WO2021214829A1 (ja) * 2020-04-20 2021-10-28 シャープ株式会社 表示装置および表示装置の製造方法
WO2021214872A1 (ja) * 2020-04-21 2021-10-28 シャープ株式会社 表示装置および表示装置の製造方法
JPWO2022153146A1 (enExample) * 2021-01-14 2022-07-21
US12278220B2 (en) 2021-06-25 2025-04-15 Boe Technology Group Co., Ltd. Driving substrate, light-emitting apparatus and manufacturing method thereof, and splicing display apparatus each having driving substrate in bending area

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014232300A (ja) 2013-05-28 2014-12-11 エルジー ディスプレイ カンパニー リミテッド フレキシブル表示装置及びその製造方法
US20160141551A1 (en) 2014-11-17 2016-05-19 Samsung Display Co., Ltd. Organic light-emitting diode (oled) display, electronic device including the same, and method of manufacturing the oled display
US20160174304A1 (en) 2014-12-10 2016-06-16 Lg Display Co., Ltd. Flexible display device with multiple types of micro-coating layers
JP2017111435A (ja) 2015-12-15 2017-06-22 エルジー ディスプレイ カンパニー リミテッド フレキシブル表示装置
US20170288007A1 (en) 2016-03-31 2017-10-05 Samsung Display Co., Ltd. Display device and manufacturing method thereof that may minimize an occurrence of a defect in the display device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5720222B2 (ja) 2010-12-13 2015-05-20 ソニー株式会社 表示装置及び電子機器
CN105552247B (zh) * 2015-12-08 2018-10-26 上海天马微电子有限公司 复合基板、柔性显示装置及其制备方法
KR102405120B1 (ko) * 2016-09-29 2022-06-08 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조방법
KR102631989B1 (ko) * 2016-10-31 2024-01-31 엘지디스플레이 주식회사 유기발광 표시장치 및 그 제조방법
US10847733B2 (en) * 2017-08-04 2020-11-24 Sharp Kabushiki Kaisha Display device
JP2019124811A (ja) * 2018-01-16 2019-07-25 株式会社ジャパンディスプレイ 表示装置及び表示装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014232300A (ja) 2013-05-28 2014-12-11 エルジー ディスプレイ カンパニー リミテッド フレキシブル表示装置及びその製造方法
US20160141551A1 (en) 2014-11-17 2016-05-19 Samsung Display Co., Ltd. Organic light-emitting diode (oled) display, electronic device including the same, and method of manufacturing the oled display
US20160174304A1 (en) 2014-12-10 2016-06-16 Lg Display Co., Ltd. Flexible display device with multiple types of micro-coating layers
JP2017111435A (ja) 2015-12-15 2017-06-22 エルジー ディスプレイ カンパニー リミテッド フレキシブル表示装置
US20170288007A1 (en) 2016-03-31 2017-10-05 Samsung Display Co., Ltd. Display device and manufacturing method thereof that may minimize an occurrence of a defect in the display device

Also Published As

Publication number Publication date
WO2019082847A1 (ja) 2019-05-02
US20200243782A1 (en) 2020-07-30
JP2019078847A (ja) 2019-05-23
US11258022B2 (en) 2022-02-22

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