JP7063660B2 - 電気剥離型粘着シート、接合体、並びに被着体の接合及び分離方法 - Google Patents

電気剥離型粘着シート、接合体、並びに被着体の接合及び分離方法 Download PDF

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Publication number
JP7063660B2
JP7063660B2 JP2018042353A JP2018042353A JP7063660B2 JP 7063660 B2 JP7063660 B2 JP 7063660B2 JP 2018042353 A JP2018042353 A JP 2018042353A JP 2018042353 A JP2018042353 A JP 2018042353A JP 7063660 B2 JP7063660 B2 JP 7063660B2
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Prior art keywords
sensitive adhesive
pressure
adherend
adhesive layer
adhesive sheet
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JP2018042353A
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Japanese (ja)
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JP2019156914A5 (enExample
JP2019156914A (ja
Inventor
香織 新家
香 三木
諒 粟根
昭 平尾
純二 横山
陽介 清水
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Nitto Denko Corp
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Nitto Denko Corp
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Priority to JP2018042353A priority Critical patent/JP7063660B2/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to EP19764294.5A priority patent/EP3763796B1/en
Priority to CN201980016859.2A priority patent/CN111819257B/zh
Priority to KR1020207024822A priority patent/KR20200130264A/ko
Priority to EP25175676.3A priority patent/EP4574425A3/en
Priority to PCT/JP2019/008825 priority patent/WO2019172304A1/ja
Priority to US16/979,014 priority patent/US11623429B2/en
Priority to TW108107818A priority patent/TW201938726A/zh
Publication of JP2019156914A publication Critical patent/JP2019156914A/ja
Publication of JP2019156914A5 publication Critical patent/JP2019156914A5/ja
Application granted granted Critical
Publication of JP7063660B2 publication Critical patent/JP7063660B2/ja
Priority to US18/178,670 priority patent/US11964462B2/en
Priority to US18/610,364 priority patent/US12441083B2/en
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • B32B7/06Interconnection of layers permitting easy separation
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K2201/001Conductive additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
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    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/00Additional features of adhesives in the form of films or foils
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    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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    • C09J2301/00Additional features of adhesives in the form of films or foils
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00Presence of inorganic and organic materials
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    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
JP2018042353A 2018-03-08 2018-03-08 電気剥離型粘着シート、接合体、並びに被着体の接合及び分離方法 Active JP7063660B2 (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP2018042353A JP7063660B2 (ja) 2018-03-08 2018-03-08 電気剥離型粘着シート、接合体、並びに被着体の接合及び分離方法
CN201980016859.2A CN111819257B (zh) 2018-03-08 2019-03-06 电剥离型粘合片材、接合体、和被粘接物的接合及分离方法
KR1020207024822A KR20200130264A (ko) 2018-03-08 2019-03-06 전기 박리형 점착 시트, 접합체, 그리고 피착체의 접합 및 분리 방법
EP25175676.3A EP4574425A3 (en) 2018-03-08 2019-03-06 Electrical debonding type adhesive sheet, joined body, and joining and separation method for adherend
PCT/JP2019/008825 WO2019172304A1 (ja) 2018-03-08 2019-03-06 電気剥離型粘着シート、接合体、並びに被着体の接合及び分離方法
US16/979,014 US11623429B2 (en) 2018-03-08 2019-03-06 Electrical debonding adhesive sheet, joined body, and joining and separation method for adherend
EP19764294.5A EP3763796B1 (en) 2018-03-08 2019-03-06 Electrical debonding type adhesive sheet, joined body, and joining and separation method for adherend
TW108107818A TW201938726A (zh) 2018-03-08 2019-03-08 電氣剝離型黏著片材、接合體、以及被黏著體之接合與分離方法
US18/178,670 US11964462B2 (en) 2018-03-08 2023-03-06 Electrical debonding adhesive sheet, joined body, and joining and separation method for adherend
US18/610,364 US12441083B2 (en) 2018-03-08 2024-03-20 Electrical debonding adhesive sheet, joined body, and joining and separation method for adherend

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018042353A JP7063660B2 (ja) 2018-03-08 2018-03-08 電気剥離型粘着シート、接合体、並びに被着体の接合及び分離方法

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JP2019156914A JP2019156914A (ja) 2019-09-19
JP2019156914A5 JP2019156914A5 (enExample) 2021-04-08
JP7063660B2 true JP7063660B2 (ja) 2022-05-09

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JP2018042353A Active JP7063660B2 (ja) 2018-03-08 2018-03-08 電気剥離型粘着シート、接合体、並びに被着体の接合及び分離方法

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US (3) US11623429B2 (enExample)
EP (2) EP3763796B1 (enExample)
JP (1) JP7063660B2 (enExample)
KR (1) KR20200130264A (enExample)
CN (1) CN111819257B (enExample)
TW (1) TW201938726A (enExample)
WO (1) WO2019172304A1 (enExample)

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KR20230004524A (ko) * 2020-04-24 2023-01-06 헨켈 아게 운트 코. 카게아아 열 분리형 2 층 점착제 시스템 및 이를 이용한 점착제 디본딩 방법
CN115667447B (zh) 2021-03-26 2023-10-31 琳得科株式会社 电剥离性粘合片及电剥离性粘合片的剥离方法
EP4194199B1 (en) * 2021-03-26 2025-02-26 Lintec Corporation Electrically debondable adhesive sheet, and method for releasing electrically debondable adhesive sheet
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