KR20200130264A - 전기 박리형 점착 시트, 접합체, 그리고 피착체의 접합 및 분리 방법 - Google Patents
전기 박리형 점착 시트, 접합체, 그리고 피착체의 접합 및 분리 방법 Download PDFInfo
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- KR20200130264A KR20200130264A KR1020207024822A KR20207024822A KR20200130264A KR 20200130264 A KR20200130264 A KR 20200130264A KR 1020207024822 A KR1020207024822 A KR 1020207024822A KR 20207024822 A KR20207024822 A KR 20207024822A KR 20200130264 A KR20200130264 A KR 20200130264A
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- South Korea
- Prior art keywords
- adherend
- pressure
- sensitive adhesive
- adhesive layer
- adhesive sheet
- Prior art date
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
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- B32B2307/70—Other properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2405/00—Adhesive articles, e.g. adhesive tapes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
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- C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
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Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
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| JPJP-P-2018-042353 | 2018-03-08 | ||
| JP2018042353A JP7063660B2 (ja) | 2018-03-08 | 2018-03-08 | 電気剥離型粘着シート、接合体、並びに被着体の接合及び分離方法 |
| PCT/JP2019/008825 WO2019172304A1 (ja) | 2018-03-08 | 2019-03-06 | 電気剥離型粘着シート、接合体、並びに被着体の接合及び分離方法 |
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| KR20230004524A (ko) * | 2020-04-24 | 2023-01-06 | 헨켈 아게 운트 코. 카게아아 | 열 분리형 2 층 점착제 시스템 및 이를 이용한 점착제 디본딩 방법 |
| CN115667447B (zh) | 2021-03-26 | 2023-10-31 | 琳得科株式会社 | 电剥离性粘合片及电剥离性粘合片的剥离方法 |
| EP4194199B1 (en) * | 2021-03-26 | 2025-02-26 | Lintec Corporation | Electrically debondable adhesive sheet, and method for releasing electrically debondable adhesive sheet |
| WO2023282311A1 (ja) * | 2021-07-09 | 2023-01-12 | Dic株式会社 | 粘着テープ、物品、及び物品の解体方法 |
| CN117580920A (zh) * | 2021-07-09 | 2024-02-20 | Dic株式会社 | 粘合带、物品及物品的拆卸方法 |
| JP7685398B2 (ja) * | 2021-08-31 | 2025-05-29 | リンテック株式会社 | 電気剥離性粘着シート |
| CN114261105B (zh) * | 2021-11-23 | 2023-10-03 | 航天海鹰(镇江)特种材料有限公司 | 一种判断钛合金与复材大曲率零件胶接质量的方法 |
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| WO2017064925A1 (ja) | 2015-10-16 | 2017-04-20 | 日東電工株式会社 | 両面粘着シート、両面粘着シート接合体、および、被着体の接合・分離方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20080196828A1 (en) | 1999-07-14 | 2008-08-21 | Gilbert Michael D | Electrically Disbonding Adhesive Compositions and Related Methods |
| US7332218B1 (en) | 1999-07-14 | 2008-02-19 | Eic Laboratories, Inc. | Electrically disbonding materials |
| JP2003012903A (ja) | 2001-04-26 | 2003-01-15 | Mitsubishi Rayon Co Ltd | 熱可塑性ポリエステル系樹脂組成物及び該組成物製光反射体 |
| US20090035580A1 (en) | 2005-08-09 | 2009-02-05 | The Yokohama Rubber Co., Ltd. | Electropeeling composition, and making use of the same, adhesive and electropeeling multilayer adhesive |
| JP5733049B2 (ja) * | 2011-06-23 | 2015-06-10 | 日立化成株式会社 | 接着シート、接着シートの製造方法、接着シートロール、半導体装置の製造方法、及び半導体装置 |
| CN105102568B (zh) | 2013-03-27 | 2017-12-29 | 琳得科株式会社 | 电剥离性粘合剂组合物、电剥离性粘合片、以及电剥离性粘合片的使用方法 |
| CN105143385B (zh) | 2013-09-27 | 2017-09-29 | 琳得科株式会社 | 电剥离性粘合剂组合物、电剥离性粘合片、以及电剥离性粘合片的使用方法 |
| JP6974170B2 (ja) | 2015-10-16 | 2021-12-01 | 日東電工株式会社 | 電気剥離用粘着剤組成物、粘着シート、及び接合体 |
| JP6606038B2 (ja) | 2016-09-06 | 2019-11-13 | 株式会社東芝 | 出力電圧制御回路 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017064925A1 (ja) | 2015-10-16 | 2017-04-20 | 日東電工株式会社 | 両面粘着シート、両面粘着シート接合体、および、被着体の接合・分離方法 |
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| US12441083B2 (en) | 2025-10-14 |
| US20240217208A1 (en) | 2024-07-04 |
| WO2019172304A1 (ja) | 2019-09-12 |
| JP2019156914A (ja) | 2019-09-19 |
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| CN111819257A (zh) | 2020-10-23 |
| US20230256710A1 (en) | 2023-08-17 |
| US20200406582A1 (en) | 2020-12-31 |
| EP4574425A2 (en) | 2025-06-25 |
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| EP3763796B1 (en) | 2025-07-09 |
| JP7063660B2 (ja) | 2022-05-09 |
| TW201938726A (zh) | 2019-10-01 |
| US11623429B2 (en) | 2023-04-11 |
| EP3763796A4 (en) | 2021-12-15 |
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| PA0105 | International application |
Patent event date: 20200827 Patent event code: PA01051R01D Comment text: International Patent Application |
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