JP7061647B2 - 固体撮像素子の製造方法、積層体、及びドライフィルム - Google Patents

固体撮像素子の製造方法、積層体、及びドライフィルム Download PDF

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JP7061647B2
JP7061647B2 JP2020134507A JP2020134507A JP7061647B2 JP 7061647 B2 JP7061647 B2 JP 7061647B2 JP 2020134507 A JP2020134507 A JP 2020134507A JP 2020134507 A JP2020134507 A JP 2020134507A JP 7061647 B2 JP7061647 B2 JP 7061647B2
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laminated body
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JP2022030453A (ja
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武広 瀬下
朋之 井上
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Tokyo Ohka Kogyo Co Ltd
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Tokyo Ohka Kogyo Co Ltd
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Priority to JP2020134507A priority Critical patent/JP7061647B2/ja
Priority to TW110120385A priority patent/TW202218884A/zh
Priority to KR1020210094408A priority patent/KR20220018911A/ko
Priority to CN202110836270.6A priority patent/CN114068593A/zh
Priority to JP2022005505A priority patent/JP2022063268A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/1469—Assemblies, i.e. hybrid integration
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

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  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Optical Filters (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Polymerisation Methods In General (AREA)
JP2020134507A 2020-08-07 2020-08-07 固体撮像素子の製造方法、積層体、及びドライフィルム Active JP7061647B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020134507A JP7061647B2 (ja) 2020-08-07 2020-08-07 固体撮像素子の製造方法、積層体、及びドライフィルム
TW110120385A TW202218884A (zh) 2020-08-07 2021-06-04 固體攝像元件之製造方法、層合體，及乾膜
KR1020210094408A KR20220018911A (ko) 2020-08-07 2021-07-19 고체 촬상 소자의 제조 방법, 적층체, 및 드라이 필름
CN202110836270.6A CN114068593A (zh) 2020-08-07 2021-07-23 固体摄像器件的制造方法、层叠体、及干膜
JP2022005505A JP2022063268A (ja) 2020-08-07 2022-01-18 積層体、及びドライフィルム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020134507A JP7061647B2 (ja) 2020-08-07 2020-08-07 固体撮像素子の製造方法、積層体、及びドライフィルム

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JP2022005505A Division JP2022063268A (ja) 2020-08-07 2022-01-18 積層体、及びドライフィルム

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JP2022030453A JP2022030453A (ja) 2022-02-18
JP7061647B2 true JP7061647B2 (ja) 2022-04-28

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JP2022005505A Pending JP2022063268A (ja) 2020-08-07 2022-01-18 積層体、及びドライフィルム

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KR (1) KR20220018911A (ko)
CN (1) CN114068593A (ko)
TW (1) TW202218884A (ko)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004029191A (ja) 2002-06-24 2004-01-29 Mitsubishi Chemicals Corp ネガ型画像形成材料の製造方法及びネガ画像形成方法
JP2015086357A (ja) 2013-09-27 2015-05-07 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびディスプレイ部材
JP2020164749A (ja) 2019-03-29 2020-10-08 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4513420B2 (ja) * 2004-05-26 2010-07-28 Ｊｓｒ株式会社 近赤外線カットフィルターおよびその製造方法
KR101878013B1 (ko) 2011-06-06 2018-08-09 에이지씨 가부시키가이샤 광학 필터, 고체 촬상 소자, 촬상 장치용 렌즈 및 촬상 장치
JP6281395B2 (ja) * 2013-11-26 2018-02-21 ソニー株式会社 撮像素子
KR102158230B1 (ko) * 2016-01-15 2020-09-21 토요잉크Sc홀딩스주식회사 고체 촬상 소자용 근적외선 흡수성 조성물 및 필터
JP2018009053A (ja) * 2016-07-11 2018-01-18 住友金属鉱山株式会社 近赤外線吸収性粘着組成物、近赤外線吸収性粘着フィルム、並びに近赤外線吸収性光学部材
JP2018097064A (ja) * 2016-12-09 2018-06-21 株式会社日本触媒 光学フィルターおよびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004029191A (ja) 2002-06-24 2004-01-29 Mitsubishi Chemicals Corp ネガ型画像形成材料の製造方法及びネガ画像形成方法
JP2015086357A (ja) 2013-09-27 2015-05-07 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびディスプレイ部材
JP2020164749A (ja) 2019-03-29 2020-10-08 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板

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JP2022030453A (ja) 2022-02-18
JP2022063268A (ja) 2022-04-21
CN114068593A (zh) 2022-02-18
KR20220018911A (ko) 2022-02-15
TW202218884A (zh) 2022-05-16

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