JP7060171B2 - 伝送線路及び回路基板 - Google Patents

伝送線路及び回路基板 Download PDF

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Publication number
JP7060171B2
JP7060171B2 JP2021551298A JP2021551298A JP7060171B2 JP 7060171 B2 JP7060171 B2 JP 7060171B2 JP 2021551298 A JP2021551298 A JP 2021551298A JP 2021551298 A JP2021551298 A JP 2021551298A JP 7060171 B2 JP7060171 B2 JP 7060171B2
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JP
Japan
Prior art keywords
conductor
transmission line
interlayer connecting
interlayer
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021551298A
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English (en)
Japanese (ja)
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JPWO2021065883A5 (https=
JPWO2021065883A1 (https=
Inventor
智浩 永井
信之 天野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2021065883A1 publication Critical patent/JPWO2021065883A1/ja
Publication of JPWO2021065883A5 publication Critical patent/JPWO2021065883A5/ja
Application granted granted Critical
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Measuring Magnetic Variables (AREA)
  • Hall/Mr Elements (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2021551298A 2019-10-02 2020-09-29 伝送線路及び回路基板 Active JP7060171B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019181875 2019-10-02
JP2019181875 2019-10-02
PCT/JP2020/036831 WO2021065883A1 (ja) 2019-10-02 2020-09-29 伝送線路及び回路基板

Publications (3)

Publication Number Publication Date
JPWO2021065883A1 JPWO2021065883A1 (https=) 2021-04-08
JPWO2021065883A5 JPWO2021065883A5 (https=) 2022-04-14
JP7060171B2 true JP7060171B2 (ja) 2022-04-26

Family

ID=75338336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021551298A Active JP7060171B2 (ja) 2019-10-02 2020-09-29 伝送線路及び回路基板

Country Status (4)

Country Link
US (1) US12080935B2 (https=)
JP (1) JP7060171B2 (https=)
CN (1) CN217062469U (https=)
WO (1) WO2021065883A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7197057B2 (ja) * 2020-05-15 2022-12-27 株式会社村田製作所 伝送線路
CN113452814A (zh) * 2021-05-21 2021-09-28 荣耀终端有限公司 传输组件及可折叠电子设备
US12506282B2 (en) * 2022-11-24 2025-12-23 Murata Manufacturing Co., Ltd. Antenna device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050627A (ja) 2008-08-20 2010-03-04 Toshiba Corp 高周波多層基板及び高周波多層基板の製造方法
JP2013026601A (ja) 2011-07-26 2013-02-04 Mitsubishi Electric Corp プリント配線板、プリント配線板モジュール、光通信モジュール、光通信装置、および演算処理装置
WO2016163436A1 (ja) 2015-04-09 2016-10-13 株式会社村田製作所 複合伝送線路および電子機器
WO2017199930A1 (ja) 2016-05-17 2017-11-23 株式会社村田製作所 多層基板、および、電子機器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0586859A (ja) 1991-09-27 1993-04-06 Mazda Motor Corp エンジンの冷却装置
JP4462758B2 (ja) * 2000-12-27 2010-05-12 京セラ株式会社 高周波用配線基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050627A (ja) 2008-08-20 2010-03-04 Toshiba Corp 高周波多層基板及び高周波多層基板の製造方法
JP2013026601A (ja) 2011-07-26 2013-02-04 Mitsubishi Electric Corp プリント配線板、プリント配線板モジュール、光通信モジュール、光通信装置、および演算処理装置
WO2016163436A1 (ja) 2015-04-09 2016-10-13 株式会社村田製作所 複合伝送線路および電子機器
WO2017199930A1 (ja) 2016-05-17 2017-11-23 株式会社村田製作所 多層基板、および、電子機器

Also Published As

Publication number Publication date
CN217062469U (zh) 2022-07-26
JPWO2021065883A1 (https=) 2021-04-08
WO2021065883A1 (ja) 2021-04-08
US12080935B2 (en) 2024-09-03
US20220200118A1 (en) 2022-06-23

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