JPWO2021065883A1 - - Google Patents

Info

Publication number
JPWO2021065883A1
JPWO2021065883A1 JP2021551298A JP2021551298A JPWO2021065883A1 JP WO2021065883 A1 JPWO2021065883 A1 JP WO2021065883A1 JP 2021551298 A JP2021551298 A JP 2021551298A JP 2021551298 A JP2021551298 A JP 2021551298A JP WO2021065883 A1 JPWO2021065883 A1 JP WO2021065883A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021551298A
Other languages
Japanese (ja)
Other versions
JPWO2021065883A5 (https=
JP7060171B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021065883A1 publication Critical patent/JPWO2021065883A1/ja
Publication of JPWO2021065883A5 publication Critical patent/JPWO2021065883A5/ja
Application granted granted Critical
Publication of JP7060171B2 publication Critical patent/JP7060171B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Measuring Magnetic Variables (AREA)
  • Hall/Mr Elements (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2021551298A 2019-10-02 2020-09-29 伝送線路及び回路基板 Active JP7060171B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019181875 2019-10-02
JP2019181875 2019-10-02
PCT/JP2020/036831 WO2021065883A1 (ja) 2019-10-02 2020-09-29 伝送線路及び回路基板

Publications (3)

Publication Number Publication Date
JPWO2021065883A1 true JPWO2021065883A1 (https=) 2021-04-08
JPWO2021065883A5 JPWO2021065883A5 (https=) 2022-04-14
JP7060171B2 JP7060171B2 (ja) 2022-04-26

Family

ID=75338336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021551298A Active JP7060171B2 (ja) 2019-10-02 2020-09-29 伝送線路及び回路基板

Country Status (4)

Country Link
US (1) US12080935B2 (https=)
JP (1) JP7060171B2 (https=)
CN (1) CN217062469U (https=)
WO (1) WO2021065883A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7197057B2 (ja) * 2020-05-15 2022-12-27 株式会社村田製作所 伝送線路
CN113452814A (zh) * 2021-05-21 2021-09-28 荣耀终端有限公司 传输组件及可折叠电子设备
US12506282B2 (en) * 2022-11-24 2025-12-23 Murata Manufacturing Co., Ltd. Antenna device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050627A (ja) * 2008-08-20 2010-03-04 Toshiba Corp 高周波多層基板及び高周波多層基板の製造方法
JP2013026601A (ja) * 2011-07-26 2013-02-04 Mitsubishi Electric Corp プリント配線板、プリント配線板モジュール、光通信モジュール、光通信装置、および演算処理装置
WO2016163436A1 (ja) * 2015-04-09 2016-10-13 株式会社村田製作所 複合伝送線路および電子機器
WO2017199930A1 (ja) * 2016-05-17 2017-11-23 株式会社村田製作所 多層基板、および、電子機器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0586859A (ja) 1991-09-27 1993-04-06 Mazda Motor Corp エンジンの冷却装置
JP4462758B2 (ja) * 2000-12-27 2010-05-12 京セラ株式会社 高周波用配線基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050627A (ja) * 2008-08-20 2010-03-04 Toshiba Corp 高周波多層基板及び高周波多層基板の製造方法
JP2013026601A (ja) * 2011-07-26 2013-02-04 Mitsubishi Electric Corp プリント配線板、プリント配線板モジュール、光通信モジュール、光通信装置、および演算処理装置
WO2016163436A1 (ja) * 2015-04-09 2016-10-13 株式会社村田製作所 複合伝送線路および電子機器
WO2017199930A1 (ja) * 2016-05-17 2017-11-23 株式会社村田製作所 多層基板、および、電子機器

Also Published As

Publication number Publication date
CN217062469U (zh) 2022-07-26
WO2021065883A1 (ja) 2021-04-08
US12080935B2 (en) 2024-09-03
US20220200118A1 (en) 2022-06-23
JP7060171B2 (ja) 2022-04-26

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