JPWO2021065883A1 - - Google Patents
Info
- Publication number
- JPWO2021065883A1 JPWO2021065883A1 JP2021551298A JP2021551298A JPWO2021065883A1 JP WO2021065883 A1 JPWO2021065883 A1 JP WO2021065883A1 JP 2021551298 A JP2021551298 A JP 2021551298A JP 2021551298 A JP2021551298 A JP 2021551298A JP WO2021065883 A1 JPWO2021065883 A1 JP WO2021065883A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/088—Stacked transmission lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/085—Triplate lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
- H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
- H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
- H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019181875 | 2019-10-02 | ||
JP2019181875 | 2019-10-02 | ||
PCT/JP2020/036831 WO2021065883A1 (ja) | 2019-10-02 | 2020-09-29 | 伝送線路及び回路基板 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2021065883A1 true JPWO2021065883A1 (ja) | 2021-04-08 |
JPWO2021065883A5 JPWO2021065883A5 (ja) | 2022-04-14 |
JP7060171B2 JP7060171B2 (ja) | 2022-04-26 |
Family
ID=75338336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021551298A Active JP7060171B2 (ja) | 2019-10-02 | 2020-09-29 | 伝送線路及び回路基板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20220200118A1 (ja) |
JP (1) | JP7060171B2 (ja) |
CN (1) | CN217062469U (ja) |
WO (1) | WO2021065883A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117255148A (zh) * | 2021-05-21 | 2023-12-19 | 荣耀终端有限公司 | 传输组件及可折叠电子设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010050627A (ja) * | 2008-08-20 | 2010-03-04 | Toshiba Corp | 高周波多層基板及び高周波多層基板の製造方法 |
JP2013026601A (ja) * | 2011-07-26 | 2013-02-04 | Mitsubishi Electric Corp | プリント配線板、プリント配線板モジュール、光通信モジュール、光通信装置、および演算処理装置 |
WO2016163436A1 (ja) * | 2015-04-09 | 2016-10-13 | 株式会社村田製作所 | 複合伝送線路および電子機器 |
WO2017199930A1 (ja) * | 2016-05-17 | 2017-11-23 | 株式会社村田製作所 | 多層基板、および、電子機器 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4462758B2 (ja) * | 2000-12-27 | 2010-05-12 | 京セラ株式会社 | 高周波用配線基板 |
-
2020
- 2020-09-29 CN CN202090000823.3U patent/CN217062469U/zh active Active
- 2020-09-29 JP JP2021551298A patent/JP7060171B2/ja active Active
- 2020-09-29 WO PCT/JP2020/036831 patent/WO2021065883A1/ja active Application Filing
-
2022
- 2022-03-15 US US17/694,794 patent/US20220200118A1/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010050627A (ja) * | 2008-08-20 | 2010-03-04 | Toshiba Corp | 高周波多層基板及び高周波多層基板の製造方法 |
JP2013026601A (ja) * | 2011-07-26 | 2013-02-04 | Mitsubishi Electric Corp | プリント配線板、プリント配線板モジュール、光通信モジュール、光通信装置、および演算処理装置 |
WO2016163436A1 (ja) * | 2015-04-09 | 2016-10-13 | 株式会社村田製作所 | 複合伝送線路および電子機器 |
WO2017199930A1 (ja) * | 2016-05-17 | 2017-11-23 | 株式会社村田製作所 | 多層基板、および、電子機器 |
Also Published As
Publication number | Publication date |
---|---|
WO2021065883A1 (ja) | 2021-04-08 |
JP7060171B2 (ja) | 2022-04-26 |
US20220200118A1 (en) | 2022-06-23 |
CN217062469U (zh) | 2022-07-26 |
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