JP7059031B2 - 撮像装置、撮像システム、移動体 - Google Patents

撮像装置、撮像システム、移動体 Download PDF

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Publication number
JP7059031B2
JP7059031B2 JP2018022402A JP2018022402A JP7059031B2 JP 7059031 B2 JP7059031 B2 JP 7059031B2 JP 2018022402 A JP2018022402 A JP 2018022402A JP 2018022402 A JP2018022402 A JP 2018022402A JP 7059031 B2 JP7059031 B2 JP 7059031B2
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transistor
signal
image pickup
unit
pickup apparatus
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JP2018022402A
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English (en)
Japanese (ja)
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JP2019140533A5 (fr
JP2019140533A (ja
Inventor
秀央 小林
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2018022402A priority Critical patent/JP7059031B2/ja
Priority to CN201910108215.8A priority patent/CN110139049B/zh
Priority to US16/267,178 priority patent/US10687009B2/en
Priority to EP19155772.7A priority patent/EP3525451A3/fr
Publication of JP2019140533A publication Critical patent/JP2019140533A/ja
Priority to US16/862,935 priority patent/US11064145B2/en
Publication of JP2019140533A5 publication Critical patent/JP2019140533A5/ja
Priority to US17/346,883 priority patent/US11509849B2/en
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Publication of JP7059031B2 publication Critical patent/JP7059031B2/ja
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/772—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H01L27/1461—Pixel-elements with integrated switching, control, storage or amplification elements characterised by the photosensitive area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/617—Noise processing, e.g. detecting, correcting, reducing or removing noise for reducing electromagnetic interference, e.g. clocking noise
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/779—Circuitry for scanning or addressing the pixel array
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Picture Signal Circuits (AREA)
JP2018022402A 2018-02-09 2018-02-09 撮像装置、撮像システム、移動体 Active JP7059031B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2018022402A JP7059031B2 (ja) 2018-02-09 2018-02-09 撮像装置、撮像システム、移動体
CN201910108215.8A CN110139049B (zh) 2018-02-09 2019-02-03 成像装置、成像系统和移动体
US16/267,178 US10687009B2 (en) 2018-02-09 2019-02-04 Imaging device, imaging system, and moving body
EP19155772.7A EP3525451A3 (fr) 2018-02-09 2019-02-06 Dispositif d'imagerie présentant un bruit de recul réduit et véhicule comprenant ledit dispositif d'imagerie
US16/862,935 US11064145B2 (en) 2018-02-09 2020-04-30 Imaging device, imaging system, and moving body
US17/346,883 US11509849B2 (en) 2018-02-09 2021-06-14 Imaging device, imaging system, and moving body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018022402A JP7059031B2 (ja) 2018-02-09 2018-02-09 撮像装置、撮像システム、移動体

Publications (3)

Publication Number Publication Date
JP2019140533A JP2019140533A (ja) 2019-08-22
JP2019140533A5 JP2019140533A5 (fr) 2021-04-08
JP7059031B2 true JP7059031B2 (ja) 2022-04-25

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JP2018022402A Active JP7059031B2 (ja) 2018-02-09 2018-02-09 撮像装置、撮像システム、移動体

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US (3) US10687009B2 (fr)
EP (1) EP3525451A3 (fr)
JP (1) JP7059031B2 (fr)
CN (1) CN110139049B (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11624653B2 (en) * 2020-12-03 2023-04-11 Artilux, Inc. Multi-application optical sensing apparatus and method thereof

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JP2016092661A (ja) 2014-11-07 2016-05-23 ソニー株式会社 撮像素子および駆動方法、並びに電子機器
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Publication number Publication date
US11509849B2 (en) 2022-11-22
US11064145B2 (en) 2021-07-13
JP2019140533A (ja) 2019-08-22
EP3525451A3 (fr) 2019-10-16
CN110139049A (zh) 2019-08-16
CN110139049B (zh) 2022-10-21
US20200260044A1 (en) 2020-08-13
US10687009B2 (en) 2020-06-16
EP3525451A2 (fr) 2019-08-14
US20210306589A1 (en) 2021-09-30
US20190253658A1 (en) 2019-08-15

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