JP7057337B2 - 基板剥離装置、基板処理装置、及び基板剥離方法 - Google Patents
基板剥離装置、基板処理装置、及び基板剥離方法 Download PDFInfo
- Publication number
- JP7057337B2 JP7057337B2 JP2019196797A JP2019196797A JP7057337B2 JP 7057337 B2 JP7057337 B2 JP 7057337B2 JP 2019196797 A JP2019196797 A JP 2019196797A JP 2019196797 A JP2019196797 A JP 2019196797A JP 7057337 B2 JP7057337 B2 JP 7057337B2
- Authority
- JP
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- Prior art keywords
- substrate
- peeling
- adhesive
- shaft portion
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019196797A JP7057337B2 (ja) | 2019-10-29 | 2019-10-29 | 基板剥離装置、基板処理装置、及び基板剥離方法 |
KR1020200136959A KR102501606B1 (ko) | 2019-10-29 | 2020-10-21 | 기판 박리 장치, 기판 처리 장치, 및 기판 박리 방법 |
CN202011178179.1A CN112750745B (zh) | 2019-10-29 | 2020-10-29 | 基板剥离装置、基板处理装置以及基板剥离方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019196797A JP7057337B2 (ja) | 2019-10-29 | 2019-10-29 | 基板剥離装置、基板処理装置、及び基板剥離方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021072323A JP2021072323A (ja) | 2021-05-06 |
JP7057337B2 true JP7057337B2 (ja) | 2022-04-19 |
Family
ID=75648805
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019196797A Active JP7057337B2 (ja) | 2019-10-29 | 2019-10-29 | 基板剥離装置、基板処理装置、及び基板剥離方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7057337B2 (zh) |
KR (1) | KR102501606B1 (zh) |
CN (1) | CN112750745B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7465859B2 (ja) | 2021-11-25 | 2024-04-11 | キヤノントッキ株式会社 | 基板キャリア、基板剥離装置、成膜装置、及び基板剥離方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003075343A1 (en) | 2002-03-05 | 2003-09-12 | Sharp Kabushiki Kaisha | Method for holding substrate in vacuum, method for manufacturing liquid crystal display device, and device for holding substrate |
JP2006108133A (ja) | 2004-09-30 | 2006-04-20 | Tokyo Electron Ltd | 基板搬送装置 |
WO2010113485A1 (ja) | 2009-03-31 | 2010-10-07 | 株式会社アルバック | 保持装置、搬送装置及び回転伝達装置 |
WO2012147725A1 (ja) | 2011-04-28 | 2012-11-01 | 東レエンジニアリング株式会社 | 半導体チップのピックアップ装置 |
JP2015216364A (ja) | 2014-04-23 | 2015-12-03 | 株式会社アルバック | 保持装置、真空処理装置 |
JP2016039185A (ja) | 2014-08-05 | 2016-03-22 | 株式会社アルバック | 基板ホルダおよび基板着脱方法 |
JP2016119337A (ja) | 2014-12-18 | 2016-06-30 | 東京エレクトロン株式会社 | 基板保持ステージ |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08294889A (ja) * | 1995-04-28 | 1996-11-12 | Murata Mfg Co Ltd | 物品移載装置 |
JP5054933B2 (ja) * | 2006-05-23 | 2012-10-24 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP2013055093A (ja) * | 2011-09-01 | 2013-03-21 | Creative Technology:Kk | 粘着チャック装置及びワークの粘着保持方法 |
JP2016021560A (ja) * | 2014-06-20 | 2016-02-04 | 株式会社半導体エネルギー研究所 | 剥離装置 |
JP6354945B2 (ja) * | 2014-07-11 | 2018-07-11 | 旭硝子株式会社 | 積層体の剥離装置及び剥離方法並びに電子デバイスの製造方法 |
CN108605397B (zh) * | 2015-12-29 | 2020-05-05 | 鸿海精密工业股份有限公司 | 树脂薄膜的剥离方法及装置、电子装置的制造方法及有机el显示装置的制造方法 |
KR102527366B1 (ko) * | 2016-10-19 | 2023-05-02 | 삼성디스플레이 주식회사 | 표시 모듈의 박리 방법 및 표시 모듈의 제조 방법 |
KR102010158B1 (ko) * | 2017-12-26 | 2019-08-12 | 캐논 톡키 가부시키가이샤 | 성막장치, 성막방법 및 이를 사용한 유기 el 표시 장치의 제조방법 |
-
2019
- 2019-10-29 JP JP2019196797A patent/JP7057337B2/ja active Active
-
2020
- 2020-10-21 KR KR1020200136959A patent/KR102501606B1/ko active IP Right Grant
- 2020-10-29 CN CN202011178179.1A patent/CN112750745B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003075343A1 (en) | 2002-03-05 | 2003-09-12 | Sharp Kabushiki Kaisha | Method for holding substrate in vacuum, method for manufacturing liquid crystal display device, and device for holding substrate |
JP2006108133A (ja) | 2004-09-30 | 2006-04-20 | Tokyo Electron Ltd | 基板搬送装置 |
WO2010113485A1 (ja) | 2009-03-31 | 2010-10-07 | 株式会社アルバック | 保持装置、搬送装置及び回転伝達装置 |
WO2012147725A1 (ja) | 2011-04-28 | 2012-11-01 | 東レエンジニアリング株式会社 | 半導体チップのピックアップ装置 |
JP2015216364A (ja) | 2014-04-23 | 2015-12-03 | 株式会社アルバック | 保持装置、真空処理装置 |
JP2016039185A (ja) | 2014-08-05 | 2016-03-22 | 株式会社アルバック | 基板ホルダおよび基板着脱方法 |
JP2016119337A (ja) | 2014-12-18 | 2016-06-30 | 東京エレクトロン株式会社 | 基板保持ステージ |
Also Published As
Publication number | Publication date |
---|---|
CN112750745A (zh) | 2021-05-04 |
JP2021072323A (ja) | 2021-05-06 |
CN112750745B (zh) | 2023-07-25 |
KR20210052265A (ko) | 2021-05-10 |
KR102501606B1 (ko) | 2023-02-17 |
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