JP7038505B2 - 高純度分配システム - Google Patents

高純度分配システム Download PDF

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Publication number
JP7038505B2
JP7038505B2 JP2017156616A JP2017156616A JP7038505B2 JP 7038505 B2 JP7038505 B2 JP 7038505B2 JP 2017156616 A JP2017156616 A JP 2017156616A JP 2017156616 A JP2017156616 A JP 2017156616A JP 7038505 B2 JP7038505 B2 JP 7038505B2
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JP
Japan
Prior art keywords
process fluid
distribution
bladder
distribution nozzle
elongated bladder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017156616A
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English (en)
Japanese (ja)
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JP2018040349A5 (enExample
JP2018040349A (ja
Inventor
ジェイ．デヴィリアーズ アントン
エル．ロビンソン ロドニー
トラヴィス デイヴィッド
ナスマン ロナルド
グルーテグード ジェイムズ
エー．ジェイコブソン ジュニア ノーマン
ヘッツァー デイヴィッド
フリ リオール
エス．フーゲ ジョシュア
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of JP2018040349A publication Critical patent/JP2018040349A/ja
Publication of JP2018040349A5 publication Critical patent/JP2018040349A5/ja
Application granted granted Critical
Publication of JP7038505B2 publication Critical patent/JP7038505B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H10P76/2042—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/081—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to the weight of a reservoir or container for liquid or other fluent material; responsive to level or volume of liquid or other fluent material in a reservoir or container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/085—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to flow or pressure of liquid or other fluent material to be discharged
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
    • B05B15/557—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids the cleaning fluid being a mixture of gas and liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1047—Apparatus or installations for supplying liquid or other fluent material comprising a buffer container or an accumulator between the supply source and the applicator
    • H10P14/683—
    • H10P72/0402—
    • H10P72/0404—
    • H10P72/0448—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Reciprocating Pumps (AREA)
  • Optics & Photonics (AREA)
JP2017156616A 2016-08-11 2017-08-14 高純度分配システム Active JP7038505B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662373729P 2016-08-11 2016-08-11
US62/373,729 2016-08-11

Publications (3)

Publication Number Publication Date
JP2018040349A JP2018040349A (ja) 2018-03-15
JP2018040349A5 JP2018040349A5 (enExample) 2020-04-30
JP7038505B2 true JP7038505B2 (ja) 2022-03-18

Family

ID=61159327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017156616A Active JP7038505B2 (ja) 2016-08-11 2017-08-14 高純度分配システム

Country Status (5)

Country Link
US (1) US10403501B2 (enExample)
JP (1) JP7038505B2 (enExample)
KR (2) KR102462049B1 (enExample)
CN (1) CN107728432A (enExample)
TW (1) TWI723204B (enExample)

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US9987655B2 (en) * 2015-06-26 2018-06-05 Tokyo Electron Limited Inline dispense capacitor system
WO2018031896A1 (en) 2016-08-12 2018-02-15 Inpria Corporation Methods of reducing metal residue in edge bead region from metal-containing resists
US10682663B2 (en) * 2018-10-31 2020-06-16 The Boeing Company Methods for dispensing flowable materials
US11383211B2 (en) * 2019-04-29 2022-07-12 Tokyo Electron Limited Point-of-use dynamic concentration delivery system with high flow and high uniformity
KR102768474B1 (ko) * 2019-07-29 2025-02-17 엑스티피엘 에스.에이. 노즐로부터 기재 상으로 금속 나노입자 조성물을 분배하는 방법
AU2020405535A1 (en) * 2019-12-17 2022-08-11 Johnson & Johnson Surgical Vision, Inc. Rotary valve configuration for a surgical cassette
US11666932B2 (en) 2020-03-27 2023-06-06 Wagner Spray Tech Corporation Fluid applicator
JP7603311B2 (ja) * 2020-05-08 2024-12-20 兵神装備株式会社 流動物吐出システム
CN114054287A (zh) * 2020-07-30 2022-02-18 中国科学院微电子研究所 光刻胶回吸装置、光刻胶涂布设备及光刻胶涂布方法
US12216400B2 (en) 2021-01-22 2025-02-04 Tokyo Electron Limited Directed self-assembly
US12533771B2 (en) * 2021-10-21 2026-01-27 Applied Materials, Inc. Polishing slurry dispense nozzle
CN114311949B (zh) * 2022-01-17 2022-08-16 浙江华基环保科技有限公司 一种钢铁厂抗氧化防静电针刺毡的生产方法
TWI792883B (zh) * 2022-01-24 2023-02-11 高科晶捷自動化股份有限公司 塗佈裝置的流體控制結構
KR20240102710A (ko) 2022-12-26 2024-07-03 삼성전자주식회사 포토레지스트 코팅 장치

Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2003536265A (ja) 2000-06-19 2003-12-02 マイクロリス・コーポレイシヨン 流体分与の許容性を決定するためのプロセスおよびシステム
JP2006248130A (ja) 2005-03-14 2006-09-21 Seiko Epson Corp 液滴吐出装置および液滴吐出装置の微振動印加制御方法
JP2012071230A (ja) 2010-09-28 2012-04-12 Koganei Corp 薬液供給装置
US20150209818A1 (en) 2014-01-26 2015-07-30 Tokyo Electron Limited Inline Dispense Capacitor

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US2517820A (en) 1948-08-10 1950-08-08 American Cyanamid Co Fluid-pressure controller
BE491946A (enExample) 1949-01-04 1900-01-01
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US4442954A (en) 1982-07-30 1984-04-17 National Instrument Company, Inc. Self-pressurizing pinch valve
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KR20060065188A (ko) 2004-12-10 2006-06-14 삼성전자주식회사 반도체 코팅설비의 포토레지스트 분사장치
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CN106463357B (zh) * 2014-05-15 2019-06-28 东京毅力科创株式会社 增加光致抗蚀剂分配系统中再循环和过滤的方法和设备
JP6420604B2 (ja) * 2014-09-22 2018-11-07 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003536265A (ja) 2000-06-19 2003-12-02 マイクロリス・コーポレイシヨン 流体分与の許容性を決定するためのプロセスおよびシステム
JP2006248130A (ja) 2005-03-14 2006-09-21 Seiko Epson Corp 液滴吐出装置および液滴吐出装置の微振動印加制御方法
JP2012071230A (ja) 2010-09-28 2012-04-12 Koganei Corp 薬液供給装置
US20150209818A1 (en) 2014-01-26 2015-07-30 Tokyo Electron Limited Inline Dispense Capacitor

Also Published As

Publication number Publication date
KR102485546B1 (ko) 2023-01-05
KR20180018445A (ko) 2018-02-21
US20180047562A1 (en) 2018-02-15
TW201816958A (zh) 2018-05-01
TWI723204B (zh) 2021-04-01
JP2018040349A (ja) 2018-03-15
KR102462049B1 (ko) 2022-11-02
CN107728432A (zh) 2018-02-23
US10403501B2 (en) 2019-09-03
KR20220016252A (ko) 2022-02-08

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