TWI723204B - 高純度分配系統 - Google Patents

高純度分配系統 Download PDF

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Publication number
TWI723204B
TWI723204B TW106127240A TW106127240A TWI723204B TW I723204 B TWI723204 B TW I723204B TW 106127240 A TW106127240 A TW 106127240A TW 106127240 A TW106127240 A TW 106127240A TW I723204 B TWI723204 B TW I723204B
Authority
TW
Taiwan
Prior art keywords
process fluid
fluid
dispensing nozzle
elongated
dispensing
Prior art date
Application number
TW106127240A
Other languages
English (en)
Chinese (zh)
Other versions
TW201816958A (zh
Inventor
安東 Ｊ 德維利耶
羅德尼 Ｌ 羅賓森
大衛 特維斯
羅那得 納斯曼
詹姆士 古魯特戈易
小諾曼 Ａ 雅各布森
大衛 海哲
里歐 修里
約書亞 Ｓ 豪格
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW201816958A publication Critical patent/TW201816958A/zh
Application granted granted Critical
Publication of TWI723204B publication Critical patent/TWI723204B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H10P76/2042—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/081—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to the weight of a reservoir or container for liquid or other fluent material; responsive to level or volume of liquid or other fluent material in a reservoir or container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/085—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to flow or pressure of liquid or other fluent material to be discharged
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
    • B05B15/557—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids the cleaning fluid being a mixture of gas and liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1047—Apparatus or installations for supplying liquid or other fluent material comprising a buffer container or an accumulator between the supply source and the applicator
    • H10P14/683—
    • H10P72/0402—
    • H10P72/0404—
    • H10P72/0448—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Reciprocating Pumps (AREA)
  • Optics & Photonics (AREA)
TW106127240A 2016-08-11 2017-08-11 高純度分配系統 TWI723204B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662373729P 2016-08-11 2016-08-11
US62/373,729 2016-08-11

Publications (2)

Publication Number Publication Date
TW201816958A TW201816958A (zh) 2018-05-01
TWI723204B true TWI723204B (zh) 2021-04-01

Family

ID=61159327

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106127240A TWI723204B (zh) 2016-08-11 2017-08-11 高純度分配系統

Country Status (5)

Country Link
US (1) US10403501B2 (enExample)
JP (1) JP7038505B2 (enExample)
KR (2) KR102462049B1 (enExample)
CN (1) CN107728432A (enExample)
TW (1) TWI723204B (enExample)

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US9987655B2 (en) * 2015-06-26 2018-06-05 Tokyo Electron Limited Inline dispense capacitor system
WO2018031896A1 (en) 2016-08-12 2018-02-15 Inpria Corporation Methods of reducing metal residue in edge bead region from metal-containing resists
US10682663B2 (en) * 2018-10-31 2020-06-16 The Boeing Company Methods for dispensing flowable materials
US11383211B2 (en) * 2019-04-29 2022-07-12 Tokyo Electron Limited Point-of-use dynamic concentration delivery system with high flow and high uniformity
KR102768474B1 (ko) * 2019-07-29 2025-02-17 엑스티피엘 에스.에이. 노즐로부터 기재 상으로 금속 나노입자 조성물을 분배하는 방법
AU2020405535A1 (en) * 2019-12-17 2022-08-11 Johnson & Johnson Surgical Vision, Inc. Rotary valve configuration for a surgical cassette
US11666932B2 (en) 2020-03-27 2023-06-06 Wagner Spray Tech Corporation Fluid applicator
JP7603311B2 (ja) * 2020-05-08 2024-12-20 兵神装備株式会社 流動物吐出システム
CN114054287A (zh) * 2020-07-30 2022-02-18 中国科学院微电子研究所 光刻胶回吸装置、光刻胶涂布设备及光刻胶涂布方法
US12216400B2 (en) 2021-01-22 2025-02-04 Tokyo Electron Limited Directed self-assembly
US12533771B2 (en) * 2021-10-21 2026-01-27 Applied Materials, Inc. Polishing slurry dispense nozzle
CN114311949B (zh) * 2022-01-17 2022-08-16 浙江华基环保科技有限公司 一种钢铁厂抗氧化防静电针刺毡的生产方法
TWI792883B (zh) * 2022-01-24 2023-02-11 高科晶捷自動化股份有限公司 塗佈裝置的流體控制結構
KR20240102710A (ko) 2022-12-26 2024-07-03 삼성전자주식회사 포토레지스트 코팅 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060075965A1 (en) * 2004-10-13 2006-04-13 Jong-Haw Lee Method of and apparatus for dispensing photoresist in manufacturing semiconductor devices or the like
US20150209818A1 (en) * 2014-01-26 2015-07-30 Tokyo Electron Limited Inline Dispense Capacitor
TW201606442A (zh) * 2014-05-15 2016-02-16 東京威力科創股份有限公司 用以在光阻分配系統中增進再循環及過濾的方法及設備

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060075965A1 (en) * 2004-10-13 2006-04-13 Jong-Haw Lee Method of and apparatus for dispensing photoresist in manufacturing semiconductor devices or the like
US20150209818A1 (en) * 2014-01-26 2015-07-30 Tokyo Electron Limited Inline Dispense Capacitor
TW201606442A (zh) * 2014-05-15 2016-02-16 東京威力科創股份有限公司 用以在光阻分配系統中增進再循環及過濾的方法及設備

Also Published As

Publication number Publication date
KR102485546B1 (ko) 2023-01-05
KR20180018445A (ko) 2018-02-21
US20180047562A1 (en) 2018-02-15
TW201816958A (zh) 2018-05-01
JP2018040349A (ja) 2018-03-15
KR102462049B1 (ko) 2022-11-02
CN107728432A (zh) 2018-02-23
JP7038505B2 (ja) 2022-03-18
US10403501B2 (en) 2019-09-03
KR20220016252A (ko) 2022-02-08

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