TWI723204B - High-purity dispense system - Google Patents
High-purity dispense system Download PDFInfo
- Publication number
- TWI723204B TWI723204B TW106127240A TW106127240A TWI723204B TW I723204 B TWI723204 B TW I723204B TW 106127240 A TW106127240 A TW 106127240A TW 106127240 A TW106127240 A TW 106127240A TW I723204 B TWI723204 B TW I723204B
- Authority
- TW
- Taiwan
- Prior art keywords
- process fluid
- fluid
- dispensing nozzle
- elongated
- dispensing
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0275—Photolithographic processes using lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/081—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to the weight of a reservoir or container for liquid or other fluent material; responsive to level or volume of liquid or other fluent material in a reservoir or container
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/085—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to flow or pressure of liquid or other fluent material to be discharged
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
- B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
- B05B15/557—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids the cleaning fluid being a mixture of gas and liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
- B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
- B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1047—Apparatus or installations for supplying liquid or other fluent material comprising a buffer container or an accumulator between the supply source and the applicator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Reciprocating Pumps (AREA)
Abstract
Description
本揭露內容相關於半導體製造,且尤其相關於膜層分配/塗佈及顯影製程及系統。相關申請案之交互參考 The content of the present disclosure is related to semiconductor manufacturing, and more particularly to film distribution/coating and development processes and systems. Cross-reference of related applications
本申請案主張2016年8月11日申請、名為「High-Purity Dispense Unit」之美國臨時專利申請案第62/373,729號的權利,其係整體併入於此,以供參考。This application claims the rights of U.S. Provisional Patent Application No. 62/373,729 named "High-Purity Dispense Unit" filed on August 11, 2016, which is incorporated herein in its entirety for reference.
利用塗佈機/顯影機工具的諸多微製造製程針對特定設計指定待分配於基板(晶圓)上的不同化學物質。例如,諸多阻劑(光阻)塗佈物可分配至基板表面上。阻劑塗佈物可依據對光化輻射的反應類型(正型/負型)而改變,且亦可依據圖案化之不同階段(產線前段、金屬化等)的組成而改變。此外,可選擇諸多顯影劑及溶劑,以分配於晶圓上。然而,能夠將諸多化學物質分配至晶圓上的挑戰係避免所分配之化學物質中的缺陷。化學物質中的任何小雜質或凝聚可能產生晶圓上的缺陷。當半導體特徵部的尺寸持續減小時,避免及防止所分配之化學物質的缺陷變得越來越重要。Many micro-manufacturing processes using coater/developer tools specify different chemicals to be distributed on the substrate (wafer) for a specific design. For example, many resist (photoresist) coatings can be distributed on the surface of the substrate. The resist coating can be changed according to the type of reaction to actinic radiation (positive type/negative type), and can also be changed according to the composition of different stages of patterning (front stage of the production line, metallization, etc.). In addition, many developers and solvents can be selected to be distributed on the wafer. However, the challenge of being able to distribute many chemicals on the wafer is to avoid defects in the distributed chemicals. Any small impurities or agglomerations in the chemicals may cause defects on the wafer. As the size of semiconductor features continues to decrease, avoiding and preventing defects in the dispensed chemicals becomes more and more important.
用以使分配至基板上之液體避免缺陷的一方式係購買用於塗佈機/顯影機工具中之經預過濾的化學成分。然而,如此之經預過濾的化學成分可能非常昂貴,且雖然進行了預過濾,仍可能於運輸或使用期間在化學成分中發展缺陷。避免缺陷的另一方式係在即將分配於基板上之前於半導體製造工具(例如,塗佈機/顯影機「軌道」工具)處過濾化學物質。在即將分配之前進行過濾(使用過濾的時機) 的一癥結係流速的降低。例如,為了輸送已經充分過濾而滿足純度要求的流體,需要相對細密的過濾器。利用如此之細密過濾器的挑戰係當推動流體化學成分通過該等相對細密的過濾器時,該等過濾器降低給定化學成分的流體流動速率。許多半導體製造製程需要化學成分以遵循特定參數的特定流速(或流速範圍)進行分配。流速在如此之給定特定流速以上或以下的情形可能導致基板上的缺陷、覆蓋不足、及/或過度覆蓋。換言之,難以足夠快地推動流體通過逐漸細密之過濾器以滿足分配流動要求。One way to avoid defects in the liquid dispensed on the substrate is to purchase pre-filtered chemical components used in coater/developer tools. However, such pre-filtered chemical components may be very expensive, and although pre-filtered, defects may develop in the chemical composition during transportation or use. Another way to avoid defects is to filter the chemicals at the semiconductor manufacturing tool (eg, coater/developer "track" tool) immediately before being dispensed on the substrate. One of the crux of filtering (the timing of using filtering) immediately before distribution is the decrease in flow rate. For example, in order to transport fluids that have been sufficiently filtered to meet the purity requirements, relatively fine filters are required. The challenge of using such a fine filter is that when the fluid chemical composition is pushed through the relatively fine filters, the filters reduce the fluid flow rate of a given chemical composition. Many semiconductor manufacturing processes require chemical components to be distributed in accordance with specific flow rates (or flow rate ranges) of specific parameters. Situations where the flow rate is above or below such a given specific flow rate may result in defects, insufficient coverage, and/or excessive coverage on the substrate. In other words, it is difficult to push the fluid through the tapered filter fast enough to meet the distribution flow requirements.
本文中所揭露的技術提供流體輸送系統,其補償相對慢的流體過濾速率,同時利用數位分配控制提供特定的分配速率。換言之,本文中的系統可使經過濾的液體在比過濾速率更快的分配速率下以高純度分配至基板上。The technology disclosed herein provides a fluid delivery system that compensates for a relatively slow fluid filtration rate while using digital distribution control to provide a specific distribution rate. In other words, the system herein allows the filtered liquid to be distributed to the substrate with high purity at a distribution rate faster than the filtration rate.
如此之系統可包含用於流體分配的設備。製程流體導管從製程流體源入口延伸至分配噴嘴。製程流體導管係用以接收製程流體,該製程流體具有足以從製程流體源入口往分配噴嘴作為製程流體流動方向驅動製程流體的壓力。因此,製程流體源係在上游處,且分配噴嘴係在下游處。製程流體閥係定位於沿著製程流體導管之製程流體源入口的下游處。製程流體閥係配置成選擇性地使通過製程流體導管的製程流體流動停止,以及容許製程流體流動通過製程流體導管。製程流體過濾器係定位於沿著製程流體導管之製程流體閥的下游處,且係配置成過濾通過製程流體導管的製程流體。狹長囊體係定位於製程流體過濾器的下游處,且係配置成製程流體導管的一部分或部位。狹長囊體係定位於由液壓流體外殼所定義的腔室內。狹長囊體從腔室入口開口延伸至腔室出口開口。狹長囊體定義介於腔室入口開口及腔室出口開口之間的線性流動路徑。狹長囊體係配置成在腔室內橫向膨脹及橫向收縮,使得當狹長囊體容納一容積之製程流體時,該狹長囊體內之製程流體的容積可增加及減小。控制器係配置成藉由使施加於狹長囊體之外表面上的液壓流體壓力增加而選擇性地使狹長囊體收縮,從而使製程流體從分配噴嘴分配。控制器係配置成藉由使施加於狹長囊體之外表面上的液壓流體壓力降低而選擇性地使狹長囊體膨脹,從而停止製程流體從該分配噴嘴的分配。據此,分配系統在製程流體過濾器之後(製程流體過濾器之下游處)的製程流體線路中不包含閥。Such a system may include equipment for fluid distribution. The process fluid conduit extends from the process fluid source inlet to the dispensing nozzle. The process fluid conduit system is used to receive the process fluid, and the process fluid has a pressure sufficient to drive the process fluid from the inlet of the process fluid source to the dispensing nozzle as the flow direction of the process fluid. Therefore, the source of the process fluid is upstream, and the distribution nozzle is downstream. The process fluid valve is positioned downstream of the process fluid source inlet along the process fluid conduit. The process fluid valve system is configured to selectively stop the flow of process fluid through the process fluid conduit and allow the process fluid to flow through the process fluid conduit. The process fluid filter is positioned downstream of the process fluid valve along the process fluid conduit, and is configured to filter the process fluid passing through the process fluid conduit. The elongated bladder system is positioned downstream of the process fluid filter and is configured as a part or part of the process fluid conduit. The elongated bladder system is positioned in a chamber defined by a hydraulic fluid housing. The elongated balloon extends from the chamber inlet opening to the chamber outlet opening. The elongated capsule defines a linear flow path between the chamber inlet opening and the chamber outlet opening. The long and narrow bladder system is configured to expand and contract laterally in the chamber, so that when the long and narrow bladder contains a volume of process fluid, the volume of the process fluid in the long and narrow bladder can increase and decrease. The controller is configured to selectively contract the elongated balloon by increasing the pressure of the hydraulic fluid applied on the outer surface of the elongated balloon, so that the process fluid is distributed from the dispensing nozzle. The controller is configured to selectively inflate the elongated capsule by reducing the pressure of the hydraulic fluid applied on the outer surface of the elongated capsule, thereby stopping the dispensing of the process fluid from the dispensing nozzle. Accordingly, the distribution system does not include a valve in the process fluid line after the process fluid filter (downstream of the process fluid filter).
如此之技術可降低沉積膜層的缺陷率。膜層缺陷率可能由氣泡、落物微粒、有機殘留物/聚合物、金屬雜質、凝聚微粒等所導致。所有該等缺陷的來源及形成機制受塗佈機/顯影機分配管線設計及配置的強烈影響。氣泡缺陷的一原因或機制可能與待分配之液體化學物質(製程流體)中溶解的氣體有關。溶解氣體然後可能在分配步驟期間進入膜層,成為氣泡缺陷,或者氣泡本身可能作為成核位點(nucleation site),以吸引小微粒成為隨後在分配步驟期間沉積至膜層中的大微粒。微粒產生、有機殘留物、及金屬雜質的一貢獻因素係構成分配管線的部件(泵浦、閥、槽、管路、配合件等)。Such a technique can reduce the defect rate of the deposited film. The film defect rate may be caused by bubbles, falling particles, organic residues/polymers, metal impurities, agglomerated particles, etc. The source and formation mechanism of all these defects are strongly influenced by the design and configuration of the coating machine/developing machine distribution pipeline. A cause or mechanism of the bubble defect may be related to the dissolved gas in the liquid chemical substance (process fluid) to be dispensed. The dissolved gas may then enter the film layer during the dispensing step and become a bubble defect, or the bubbles themselves may act as a nucleation site to attract small particles to become large particles that are subsequently deposited into the film layer during the dispensing step. A contributing factor to the generation of particles, organic residues, and metal impurities is the components (pumps, valves, tanks, pipes, fittings, etc.) that constitute the distribution pipeline.
本文中的技術藉由利用間接分配系統而使導致氣體溶解的缺陷最小化。利用本文中的系統使製程流體對氣體及環境的曝露最小化。再者,本文中的系統藉由使本文中之分配管線中所使用的部件(泵浦、閥、槽、管路、配合件等)最少化而減少其他的缺陷類型(例如,落物微粒、有機殘留物/聚合物、及金屬雜質)。因為每一部件皆增加導致缺陷的潛在性,故吾人可察知減少分配管線中之部件的優勢。使製程流體與部件/硬體之間的盲區(dead space)及表面接觸最小化可透過使化學凝聚所需的成核位點最少化而使流動渦流最小化。The technique in this paper minimizes the defects that cause gas dissolution by using an indirect distribution system. Use the system in this article to minimize the exposure of process fluids to gases and the environment. Furthermore, the system in this paper minimizes other types of defects (e.g., falling particles, particles, etc.) by minimizing the components (pumps, valves, tanks, pipes, fittings, etc.) used in the distribution pipelines herein. Organic residues/polymers, and metal impurities). Because each component increases the potential for defects, we can see the advantages of reducing the components in the distribution pipeline. Minimizing dead space and surface contact between process fluids and components/hardware can minimize flow vortices by minimizing nucleation sites required for chemical aggregation.
當然,如本文中所描述之不同步驟的討論順序已為清楚起見而呈現。一般來講,該等步驟及技術可按照任何適當的順序執行。此外,儘管本文中不同特徵、技術、配置等的每一者可於本揭露內容的不同位置處討論,但意欲使該等概念的每一者可相互獨立地、或相互結合地加以實施。據此,本發明可以許多不同的方式實施及考量。Of course, the order of discussion of the different steps as described herein has been presented for clarity. Generally speaking, these steps and techniques can be performed in any suitable order. In addition, although each of the different features, technologies, configurations, etc. herein can be discussed at different positions in the present disclosure, it is intended that each of these concepts can be implemented independently or in combination with each other. Accordingly, the present invention can be implemented and considered in many different ways.
注意到,本發明內容部分不具體說明本揭露內容或所請發明的每一實施例及/或漸增新穎的實施態樣。反而,本發明內容僅提供不同實施例的初步討論、以及優於習知技術之新穎性的對應點。對於本發明及實施例的額外細節及/或可能觀點,引導讀者至如以下進一步討論之本揭露內容的實施方式部分及對應圖式。It is noted that the content of the present invention does not specifically describe each embodiment of the disclosure or the claimed invention and/or incrementally novel implementation aspects. On the contrary, the summary of the present invention only provides a preliminary discussion of different embodiments and corresponding points of novelty superior to the conventional technology. For additional details and/or possible viewpoints of the present invention and the embodiments, the reader is directed to the implementation mode part of the present disclosure and the corresponding drawings as discussed further below.
本文中的技術可實施為使用狹長囊體的基於囊體之分配系統。此分配系統補償通常伴隨微製造之流體過濾的過濾器滯後(filter-lag)。此分配系統亦提供高純度且高精確度的分配單元。本文中之此分配系統更降低缺陷產生的機會。習知的流體輸送系統通常具有懸掛於流體管線的「盲管(dead leg)」。此盲管可為從(例如用於壓力量測裝置或貯器之)流體管線分出的分支。習知的流體輸送系統可能具有其他的不連續部分(包含諸多閥),其導致在流體中產生缺陷的顯著機會。流體連接器係設計成減少流體導管壁(內壁)上的瑕疵。任何粗糙的連接器或轉折皆可能導致產生流體可能發生再循環、減速、或以其他方式停止(可能造成凝聚)的位置。因此,製程流體導管設有活塞、檔板、或側裝式貯器的情形可能產生許多不樂見的交叉流,並產生流體阻塞或減速的位置。如此之交叉流及減速位置點可能在流體內導致產生微粒。然後,如此之微粒在被分配於給定基板上時(例如,分配光阻於矽晶圓上)變成缺陷。The technology herein can be implemented as a capsule-based dispensing system using elongated capsules. This distribution system compensates for the filter-lag that usually accompanies micro-manufacturing fluid filtration. This distribution system also provides high-purity and high-precision distribution units. The distribution system in this article reduces the chance of defects. Conventional fluid delivery systems usually have "dead legs" suspended from fluid lines. The dead pipe can be a branch from a fluid line (for example, for a pressure measuring device or a reservoir). Conventional fluid delivery systems may have other discontinuities (including many valves), which lead to significant opportunities for defects in the fluid. The fluid connector system is designed to reduce defects on the fluid conduit wall (inner wall). Any rough connectors or twists may result in a location where the fluid may recirculate, slow down, or stop in other ways (which may cause agglomeration). Therefore, when the process fluid conduit is equipped with a piston, baffle plate, or side-mounted reservoir, many undesirable cross-flows may be generated, and a position where the fluid is blocked or decelerated may be generated. Such cross flow and deceleration points may cause particles to be generated in the fluid. Then, such particles become defects when they are distributed on a given substrate (for example, when a photoresist is distributed on a silicon wafer).
據此,本文中之系統包含使用間接壓力/容積控制的狹長囊體設備,以分配製程流體、且使製程流體中的氣體溶解最少化、且減少分配系統所使用的總體部件。當將此狹長囊體配置成提供與上游及下游導管之橫剖面類似的橫剖面(用於流體流動)時, 達成較佳的流體分配結果。如此之配置有助於防止製程流體產生交叉流或製程流體流動減速的情形。當流體進入或穿過狹長囊體時,具有平滑且漸進的加寬過程,以維持層流(laminar flow)。在分配關閉階段期間(亦即,當流體不從對應噴嘴分配至基板上時),在製程流體被推動通過細密過濾器(微過濾器)後,該等製程流體可聚集於此囊體中(成為膨脹囊體)。在一實施例中,此狹長囊體充當用於分配的流體儲存器(fluid capacitor),其係配置成利用(在分配關閉階段期間已於上游處、或已於即將進入狹長囊體之前進行過濾之)製程流體加以填充。在一些例示性分配應用中,給定流體係以預定流速(例如,每秒0.4至1.4立方釐米)進行分配,且該流體係分配(至基板上)持續相對短暫的時間。例如,給定分配時間可持續約一秒,且然後可不再使用流體分配系統,直到休止期間過後。該休止期間可為從約15秒至60秒的任何時間,或者就一些製造流程而言為更久的時間。Accordingly, the system herein includes a long and narrow balloon device using indirect pressure/volume control to distribute the process fluid, minimize the dissolution of gas in the process fluid, and reduce the overall components used in the distribution system. When the elongated balloon is configured to provide a cross section similar to the cross section of the upstream and downstream ducts (for fluid flow), a better fluid distribution result is achieved. Such a configuration helps prevent the process fluid from cross-flowing or decelerating the process fluid flow. When fluid enters or passes through the elongated capsule, it has a smooth and gradual widening process to maintain laminar flow. During the dispensing off phase (that is, when the fluid is not dispensed from the corresponding nozzle onto the substrate), after the process fluid is pushed through the fine filter (microfilter), the process fluid can accumulate in the capsule ( Become an inflated balloon). In one embodiment, this elongated capsule acts as a fluid capacitor for dispensing, which is configured to use (already upstream during the dispensing closure phase, or has been filtered just before entering the elongated capsule)之) Process fluid is filled. In some exemplary distribution applications, a given flow system is distributed at a predetermined flow rate (for example, 0.4 to 1.4 cubic centimeters per second), and the flow system is distributed (to the substrate) for a relatively short period of time. For example, a given dispense time can last for about one second, and then the fluid dispensing system can no longer be used until after the rest period. The rest period can be any time from about 15 seconds to 60 seconds, or a longer time for some manufacturing processes.
當從噴嘴再次開始分配時,狹長囊體單元從聚集製程流體的狀態轉變為排出製程流體的狀態。換言之,該狹長囊體具有以下能力:膨脹,以聚集一注入量的製程流體;以及隨後選擇性壓縮以藉由將所聚集之注入量的流體(其在即將進入狹長囊體之前已穿過微過濾器)釋放而協助維持特定的製程流體流動速率。因此,如此配置提供具有分配儲存器的系統,其包含配置成膨脹以接收一注入量之流體、且收縮以輔助排出所累積之注入量之流體、且皆同時維持通過狹長囊體之製程流體之實質上線性的流動路徑的囊體或可膨脹構件。When the dispensing is restarted from the nozzle, the long and narrow capsule unit changes from a state where the process fluid is collected to a state where the process fluid is discharged. In other words, the elongated capsule has the ability to expand to collect an injected amount of process fluid; and then selectively compress to collect the injected amount of fluid (which has passed through the microcapsule just before entering the elongated capsule). The filter) is released to help maintain a specific process fluid flow rate. Therefore, such a configuration provides a system with a distribution reservoir, which includes a system configured to expand to receive an injected amount of fluid, and contract to assist in expelling the accumulated injected amount of fluid, while maintaining the process fluid passing through the elongated capsule. A balloon or inflatable member with a substantially linear flow path.
狹長囊體的膨脹及收縮可經由耦接的液壓系統(或者氣壓系統)而完成,該液壓系統(或者氣壓系統)控制與狹長囊體之外表面接觸的液壓流體。狹長囊體可具有不同的橫剖面形狀,例如,圓形、方形、及橢圓形。為便於描述本文中之實施例,本揭露內容將主要聚焦於具有近似橢圓形或圓形形狀的囊體。使斜角錐形末端連接至製程流體輸入導管及製程流體輸出導管可有利於平緩地從製程流體導管過渡至特定的狹長囊體形狀。不同的橫剖面形狀提供不同的優勢。使用具有長圓形橫剖面形狀之囊體的優勢係具有兩個相對平坦的對向表面,該等表面可為用於膨脹及收縮的主撓曲表面。在實質上均勻或對稱之橫剖面形狀(例如,圓形橫剖面)的情形中,所有的側壁表面將皆能夠大致上均勻地膨脹及收縮,且此形狀亦可提供複數優點。The expansion and contraction of the elongated bladder can be accomplished through a coupled hydraulic system (or pneumatic system) that controls the hydraulic fluid in contact with the outer surface of the elongated bladder. The elongated capsule can have different cross-sectional shapes, for example, round, square, and elliptical. To facilitate the description of the embodiments herein, the present disclosure will mainly focus on a capsule having an approximately elliptical or circular shape. Connecting the oblique pyramidal end to the process fluid input conduit and the process fluid output conduit can facilitate a smooth transition from the process fluid conduit to a specific long and narrow balloon shape. Different cross-sectional shapes provide different advantages. The advantage of using a capsule with an oblong cross-sectional shape is that it has two relatively flat facing surfaces, which can be the main flexure surfaces for expansion and contraction. In the case of a substantially uniform or symmetrical cross-sectional shape (for example, a circular cross-section), all the sidewall surfaces will be able to expand and contract substantially uniformly, and this shape can also provide multiple advantages.
在常見的操作中,當狹長囊體的內側及外側上具有相等壓力時,該狹長囊體具有初始形狀或橫剖面。狹長囊體實質上膨脹超過該初始形狀至膨脹狀態(大至抵達囊體膨脹限制的某膨脹狀態),以收集一注入量的製程流體且/或停止分配動作。然後,狹長囊體可從膨脹狀態收縮至初始狀態,在一些實施例中,就特定的分配操作而言,狹長囊體可收縮至比初始狀態更小,但避免實質上超過初始狀態的收縮以防止缺陷。實際上,系統可配置成防止製程流體被狹長囊體夾緊。若對向內壁彼此接觸而夾緊狹長囊體,則此動作可能類似於實體且徹底地阻隔製程流體流動的閥在製程流體中產生缺陷。系統可配置成防止狹長囊體對製程流體的任何夾緊。因此,除了製程流體過濾器之上游處的製程流體閥以外,系統在製程流體過濾器及分配噴嘴之間不包含(能夠將通過製程流體導管之製程流體流動徹底阻隔的)任何閥。In a common operation, when there are equal pressures on the inside and outside of the elongated capsule, the elongated capsule has an initial shape or cross-section. The elongated balloon substantially expands beyond the initial shape to an expanded state (up to a certain expanded state that reaches the expansion limit of the balloon) to collect an injected amount of process fluid and/or stop the dispensing action. Then, the elongated balloon can be contracted from the expanded state to the initial state. In some embodiments, for a specific dispensing operation, the elongated balloon can contract to be smaller than the initial state, but avoid contraction that substantially exceeds the initial state. Prevent defects. In fact, the system can be configured to prevent the process fluid from being clamped by the elongated capsule. If the opposing inner walls contact each other to clamp the elongated capsule, this action may be similar to a valve that physically and completely obstructs the flow of the process fluid, causing defects in the process fluid. The system can be configured to prevent any clamping of the process fluid by the elongated capsule. Therefore, with the exception of the process fluid valve upstream of the process fluid filter, the system does not include any valve (that can completely block the flow of the process fluid through the process fluid conduit) between the process fluid filter and the distribution nozzle.
間接壓力分配可藉由以下動作執行:在不於源容器中之製程流體上使用直接氣體(氣體壓力)的情況下,將製程流體從化學物質瓶或製程流體源容器拉出/推出進入分配系統。如此之系統可利用具有內部襯墊的供應瓶,該內部襯墊將用於擠壓/折疊內袋的氣體隔離。或者,習知的流體容納瓶可與拉動裝置一起使用,該拉動裝置在不使用與製程流體接觸之氣體的情況下,將製程流體從來源瓶拉出。另一方式係使用包含虹吸機構的重力饋送系統。Indirect pressure distribution can be performed by the following actions: without using direct gas (gas pressure) on the process fluid in the source container, pull/push the process fluid out of the chemical substance bottle or the process fluid source container into the distribution system . Such a system can utilize a supply bottle with an internal liner that insulates the gas used to squeeze/fold the inner bag. Alternatively, a conventional fluid containment bottle can be used with a pulling device that pulls the process fluid from the source bottle without using gas in contact with the process fluid. Another way is to use a gravity feed system that includes a siphon mechanism.
本文中之實施例的另一實施態樣包含相較於習知的光阻分配系統減少分配系統中總體部件。本文中的實施例包含從製程流體過濾器之後(亦即,製程流體過濾器之下游)的分配管線移除諸多的部件及閥。製程流體中的微粒大部分可利用製程流體過濾器移除,但產生於製程流體過濾器後的微粒可能在基板上產生缺陷,而該缺陷係在所沉積的膜層中。Another implementation aspect of the embodiments herein includes reducing the overall components in the distribution system compared to the conventional photoresist distribution system. The embodiments herein include removing many components and valves from the distribution line after the process fluid filter (that is, downstream of the process fluid filter). Most of the particles in the process fluid can be removed by the process fluid filter, but the particles generated after the process fluid filter may cause defects on the substrate, and the defects are in the deposited film.
在一些實施例中,在通過製程流體過濾器後,沒有與製程流體直接接觸的移動部件。亦即,除了囊體壁本身以外,別無移動部件,但囊體壁的移動係分散且相對均勻的,且沒有與習知移動部件有關的尖銳接觸部或邊緣(其產生製程流體缺陷)。此實施例可包含在製程流體過濾器後沒有閥的情形。因此,本文中的技術免除了分配閥及相關泵浦,其中系統在沒有用以驅動製程流體通過系統以及至基板上之泵浦的情況下運作。In some embodiments, after passing through the process fluid filter, there are no moving parts that directly contact the process fluid. That is, there are no moving parts other than the capsule wall itself, but the movement of the capsule wall is dispersed and relatively uniform, and there is no sharp contact portion or edge (which produces process fluid defects) related to the conventional moving parts. This embodiment may include the case where there is no valve after the process fluid filter. Therefore, the technology in this paper eliminates the dispensing valve and related pumps, where the system operates without pumps used to drive the process fluid through the system and onto the substrate.
本文中的分配系統可劃分成兩區域或部分。例如,具有「淨空部分(clean zone)」區域,其包含從製程流體源至製程流體過濾器的分配系統管線及元件。亦具有「超淨空部分(super clean zone)」,其包含從製程流體過濾器至分配噴嘴的分配管線。淨空部分區域(從製程流體過濾器起的上游處) 涵蓋例如閥、槽、貯器等的所有移動部件。超淨空部分區域(從製程流體過濾器起的下游處)沒有與製程流體(液體)接觸的移動部件。The distribution system in this article can be divided into two areas or parts. For example, there is a "clean zone" area, which contains the distribution system pipelines and components from the process fluid source to the process fluid filter. It also has a "super clean zone", which contains the distribution pipeline from the process fluid filter to the distribution nozzle. The headroom area (upstream from the process fluid filter) covers all moving parts such as valves, tanks, and reservoirs. There are no moving parts in contact with the process fluid (liquid) in the ultra-clear area (downstream from the process fluid filter).
技術包含具有用於膨脹及收縮之狹長囊體(其係由液壓流體圍繞)的分配單元,其具有可插入液壓流體中的活塞及/或桿部,用於液壓流體的容積控制,且藉由延伸而用於狹長囊體的容積控制。本文中的分配單元提供高純度且高精確度的分配系統。這可包含分配操作期間通過分配噴嘴之製程流體的量的電子(數位)控制。又,分配單元可提供於分配後操作期間被拉回至分配噴嘴中之製程流體的量的電子控制,這亦稱為回吸控制(suck-back control)。作為回吸控制的一部分,系統可將製程流體吸回,使得彎液面留置在分配噴嘴內的預定位置處,且然後在囊體的再填充期間可將該彎液面保持於該位置處。因此,本文中的技術提供精確的數位回吸控制及彎液面控制。精確的分配及回吸係部分地藉由精確的活塞及/或桿部、及相關馬達而達成。精確的容積控制及狹長囊體達成了製程流體過濾器之下游處的無閥系統(valve-less system)。The technology includes a distribution unit with a long and narrow balloon (which is surrounded by hydraulic fluid) for expansion and contraction, which has a piston and/or rod that can be inserted into the hydraulic fluid, for volume control of the hydraulic fluid, and by The extension is used for volume control of the long and narrow capsule. The distribution unit in this article provides a high-purity and high-precision distribution system. This may include electronic (digital) control of the amount of process fluid passing through the dispensing nozzle during dispensing operation. In addition, the dispensing unit can provide electronic control of the amount of process fluid that is drawn back into the dispensing nozzle during the post-dispensing operation, which is also called suck-back control. As part of the suckback control, the system can suck the process fluid back so that the meniscus remains at a predetermined position in the dispensing nozzle, and then the meniscus can be maintained at that position during the refilling of the capsule. Therefore, the technology in this article provides accurate digital suction control and meniscus control. Precise dispensing and sucking back are partly achieved by precise pistons and/or rods, and related motors. Precise volume control and long and narrow capsules achieve a valve-less system downstream of the process fluid filter.
技術包含具有精確流體位準偵測器的分配噴嘴。系統可偵測及控制分配噴嘴中之彎液面的位置。彎液面感測器將分配噴嘴中之液體彎液面位置的連續回饋提供至狹長囊體單元,以連續調整囊體容積,而將彎液面維持於期望位置處。系統可包含具有遮蔽裝置或護罩的噴嘴系統,該遮蔽裝置或護罩藉由在分配噴嘴周圍流動溶劑氣體而在噴嘴周圍產生有利的微環境,以防止分配噴嘴中製程流體(例如,光阻)的乾燥。當製程流體中的溶劑蒸發時(由於沒有閥,故在曝露至空氣的分配噴嘴處),蒸發可能留下乾燥微粒,其可輕易地在後續分配操作中被轉移至基板。本文中之如此的遮蔽裝置在不使用可能造成缺陷之閥的情況下,消除了製程流體在噴嘴中乾燥的情形。The technology includes a dispensing nozzle with a precise fluid level detector. The system can detect and control the position of the meniscus in the dispensing nozzle. The meniscus sensor provides continuous feedback of the position of the liquid meniscus in the dispensing nozzle to the elongated capsule unit to continuously adjust the capsule volume and maintain the meniscus at a desired position. The system may include a nozzle system with a shielding device or a shield that creates a favorable micro-environment around the nozzle by flowing solvent gas around the dispensing nozzle to prevent the process fluid (e.g., photoresist) in the dispensing nozzle ) Of drying. When the solvent in the process fluid evaporates (because there is no valve, at the dispensing nozzle exposed to the air), the evaporation may leave dry particles, which can be easily transferred to the substrate in subsequent dispensing operations. The shielding device in this paper eliminates the drying of the process fluid in the nozzle without using a valve that may cause defects.
現在,本文中的實施例將更詳細地加以描述。現在參考圖1~3,其描繪可用於流體輸送的分配單元100。如此之分配單元100可包含界定腔室(或囊體腔室)的液壓流體外殼111,狹長囊體係定位於該腔室(或囊體腔室)中。包含液壓流體腔室的活塞桿部外殼113係附接至液壓流體外殼111,該液壓流體腔室係與該液壓流體外殼111流體連接。活塞桿部外殼113可用以精確地控制狹長囊體單元內的液壓流體壓力。致動器114可用以移動及控制活塞桿部。排放閥118可用以輔助空氣從液壓系統的移除。可將本文中的分配單元配置成操作為獨立式液壓系統(self-contained hydraulic system)—實施例不需要延伸至分配單元的液壓管路或連接器。實施例可為緊湊的,且以低液壓容積運作。Now, the embodiments herein will be described in more detail. Reference is now made to Figures 1 to 3, which depict a
現在參考圖4及5,其描繪例示性基於囊體之分配單元的橫剖面側視圖。狹長囊體115從腔室入口開口116延伸至腔室出口開口117。腔室119係定尺寸成容許狹長囊體115膨脹至預定容積且防止其膨脹超過該預定容積。狹長囊體定義在腔室入口開口116及腔室出口開口117之間呈線性的流體流動路徑。狹長囊體係配置成在腔室119內橫向膨脹及收縮,使得當狹長囊體容納製程流體時,狹長囊體內之製程流體的容積可增加及減小。Reference is now made to Figures 4 and 5, which depict a cross-sectional side view of an exemplary capsule-based dispensing unit. The
此實施例包含附接至腔室119的活塞桿部外殼113。活塞桿部外殼包含配置成在位移腔室內移動的活塞124。例如步進馬達128的馬達可用以移動活塞124。位移腔室127係與腔室119流體連接。據此,藉由移動活塞124,當液壓流體填充腔室及位移腔室時,施加於狹長囊體115之外表面上的壓力可增加及減小。抗反衝機構129可用以移除液壓流體的作用,以增加狹長囊體內之製程流體容積的精確度及控制。DIN軌道安裝部148可用以將基於囊體之分配單元固定於得益於液體之精確受控分配的塗佈機-顯影機工具或其他分配系統內。This embodiment includes a
因此,本文中的技術可實施為閉合迴路內的單一卡匣型腔室分配單元。液壓位移銷(或桿部、或活塞、或複數銷)可能影響液壓流體。此液壓流體係與彈性狹長囊體的(複數)外表面接觸。囊體收縮的控制係銷(或(複數)活塞、或(複數)桿部、或(複數)柱塞)插入液壓流體中之遠近的函數。同樣地,囊體膨脹的控制係銷從液壓流體移除或拉回之程度的函數。據此,達成狹長囊體膨脹或收縮的極精確控制。液壓流體的進一步控制係受所使用之銷的數目、及尺寸、及其組合的影響。舉例而言,具有填充整個液壓流體通道之相對大型銷的情形可賦予相對較大的容積變化。密封件可在進入液壓流體腔室的開口處用於活塞/桿部周圍,以防止液壓流體的損失。利用具有相對小橫剖面的桿部或銷可有助於容積的漸進及小幅變化,這可有利於分配相對小量的流體。或者,實施例可包含使用複數桿部(例如,具有不同尺寸的桿部)以造成不同的容積變化。Therefore, the technology herein can be implemented as a single cassette-type chamber distribution unit in a closed loop. The hydraulic displacement pin (or rod, or piston, or plural pins) may affect the hydraulic fluid. This hydraulic fluid system is in contact with the (plural) outer surface of the elastic long and narrow capsule. The control of balloon contraction is a function of how far the pin (or (plural) piston, or (plural)) rod, or (plural) plunger) is inserted into the hydraulic fluid. Likewise, the control of balloon inflation is a function of the degree to which the pin is removed or pulled back from the hydraulic fluid. Accordingly, extremely precise control of the expansion or contraction of the long and narrow balloon is achieved. Further control of the hydraulic fluid is affected by the number, size, and combination of pins used. For example, a situation with a relatively large pin filling the entire hydraulic fluid channel can impart a relatively large volume change. Seals can be used around the piston/rod at the opening into the hydraulic fluid chamber to prevent the loss of hydraulic fluid. Utilizing a rod or pin with a relatively small cross-section can facilitate gradual and small changes in volume, which can facilitate the distribution of relatively small amounts of fluid. Alternatively, embodiments may include using a plurality of rods (e.g., rods with different sizes) to cause different volume changes.
致動器可用以推動活塞或桿部。致動器可為步進馬達、DC馬達、伺服馬達、或其他機構。液壓控制機構的選擇可基於特定的分配要求。例如,給定系統可設計成從噴嘴以0.3~1.0 mL/s的速率進行分配。以非限制性範例為例,用於將光阻分配至半導體晶圓上的常見設計考量包含足夠快地進行分配以避免滴液,但又足夠慢地進行分配以防止飛濺至晶圓上。分配速度亦可係以下者的函數:待分配之特定製程流體的粘稠度。因為輸送速率係致動器速度的函數,故特定致動器的選擇可基於給定系統所期望的分配參數。The actuator can be used to push the piston or rod. The actuator can be a stepper motor, a DC motor, a servo motor, or other mechanisms. The choice of hydraulic control mechanism can be based on specific distribution requirements. For example, a given system can be designed to dispense from the nozzle at a rate of 0.3 to 1.0 mL/s. Taking a non-limiting example as an example, common design considerations for dispensing photoresist on semiconductor wafers include dispensing quickly enough to avoid dripping, but dispensing slowly enough to prevent splashing onto the wafer. The dispensing speed can also be a function of: the viscosity of the particular process fluid to be dispensed. Because the delivery rate is a function of actuator speed, the selection of a particular actuator can be based on the distribution parameters desired for a given system.
本文中的分配單元可在超過特定程度時受約束或實體受限制,使得狹長囊部可過度加壓、或過度回壓。換言之,將囊體加壓至特定程度(增加囊體容積)後,該囊體接觸壁部且不再膨脹,類似於在桶中使氣球膨脹。在特定程度時,狹長囊體接觸腔室壁或囊體膨脹限制部,且不再膨脹。圖6及7係描繪此特徵的示意性橫剖面視圖。在圖6中,狹長囊體115係描繪成定位於腔室119內。狹長囊體115係處於中等膨脹狀態中,且係顯示成具有均勻的橫剖面(製程流體正流過該橫剖面)。囊體膨脹限制部145係定位於狹長囊體115周圍。注意到,液壓流體126填充狹長囊體115及囊體膨脹限制部145之間的間隙。亦注意到,囊體膨脹限制部145可包含孔洞、或間隙、或穿孔,以提供液壓流體的進出。因此,在一實施例中,囊體膨脹限制部145可配置成界定複數開口的剛性套筒,或者,可使用剛性網孔套筒。The distribution unit herein can be restricted or physically restricted when it exceeds a certain degree, so that the elongated bladder can be over-pressurized or over-back-pressurized. In other words, after the balloon is pressurized to a certain degree (increase the volume of the balloon), the balloon contacts the wall and no longer expands, similar to expanding a balloon in a barrel. At a certain level, the elongated balloon contacts the chamber wall or the balloon expansion restriction portion, and no longer expands. Figures 6 and 7 are schematic cross-sectional views depicting this feature. In FIG. 6, the
當施加於狹長囊體上的液壓流體壓力降低時(例如,藉由使活塞124從腔室(或位移腔室)縮回),製程流體的流體壓力可使狹長囊體膨脹並收集一注入量的流體。此膨脹狀態係在圖7中描繪。狹長囊體的膨脹可持續進行,直到囊體完全接觸囊體膨脹限制部為止。此時,避免狹長囊體再使內直徑膨脹。如此之實體限制部避免了源自狹長囊體之彈性材料的遲滯問題,藉此消除持續再校準的需要。圖8描繪一實施例,其中腔室119係定尺寸成足夠小,以充當囊體膨脹限制部。圖8亦描繪使用兩位移構件(其可包括活塞124及桿部125)的實施例。這樣可提供兩層級的控制。活塞124可提供較大的位移,用於較粗略的控制,而較小的桿部125提供較精細的位移控制。圖9描繪給定的實施例,其中位移構件行進至狹長囊體115所定位於其中的同一腔室中。When the pressure of the hydraulic fluid applied to the elongated balloon decreases (for example, by retracting the
利用本文中的分配單元實施例,當與空氣活塞抗反衝預負載一起使用時,不總是需要額外的液壓流體。空氣活塞可避免容積改變中的「剎車鬆軟」或鬆弛,使得腔室不需要具有複數銷來精確地調整容積。空氣活塞可施加壓力於整個系統,以消除任何殘餘的變形潛在性或鬆軟。例如,空氣活塞可用以消除線性致動器中的反衝。本文中的反衝包含螺釘改變方向時的空轉、及隨後之螺母或滾珠軸承從螺釘一壁變換接觸至另一壁。藉由在軸上施加恆定力,元件與螺釘一側保持接觸。針對容納液壓流體之區域的排放閥可用以移除系統內的空氣。With the distribution unit embodiment herein, when used with an air piston anti-recoil preload, additional hydraulic fluid is not always required. The air piston can avoid "brake softness" or slack in the volume change, so that the chamber does not need to have multiple pins to accurately adjust the volume. The air piston can apply pressure to the entire system to eliminate any residual deformation potential or softness. For example, air pistons can be used to eliminate recoil in linear actuators. The backlash in this paper includes the idling when the screw changes direction, and the subsequent change of the nut or ball bearing from one wall of the screw to the other. By applying a constant force on the shaft, the component remains in contact with the screw side. Drain valves for areas containing hydraulic fluid can be used to remove air from the system.
系統可包含用作限制開關的光學中斷開關。或者,可採用簧片或霍爾效應感測器而使用位於桿部安裝部的基部處之磁鐵。舉例而言,利用彎液面位置感測器,可將線性編碼器可選地用於閉合迴路控制、或用於資料收集。The system can include an optical interrupt switch that acts as a limit switch. Alternatively, a reed or a Hall effect sensor can be used and a magnet located at the base of the rod mounting part can be used. For example, using a meniscus position sensor, a linear encoder can optionally be used for closed loop control or for data collection.
本文中的分配系統使用注入物累積及分配囊體,以在製程流體過濾之後提供無閥分配系統。圖10係例示性分配系統的示意圖。製程流體係從製程流體源150往閥152供應或輸送。例如,製程流體源可為一瓶光阻、顯影劑等。閥152係完全閉合閥,且因此可使進入較大分配系統的流動開始或停止。製程流體從閥152流向且穿過可為高純度過濾器的過濾器154,以移除微粒及/或其他污染物。製程流體從過濾器154流向包含狹長囊體之基於囊體的分配單元100。The distribution system herein uses infusion accumulation and distribution capsules to provide a valveless distribution system after the process fluid is filtered. Figure 10 is a schematic diagram of an exemplary distribution system. The process flow system is supplied or delivered from the
分配單元可使狹長囊體的容積膨脹,以收集一注入量的製程流體。當將製程流體分配至基板上時,分配單元可使狹長囊體收縮,這導致經過濾的製程流體流向分配噴嘴137且從分配噴嘴向基板105流出。注意到,製程流體通過過濾器154之後,在分配管線中沒有閥。這包含沒有分配噴嘴閥的情形。據此,在過濾器154的下游,系統係開放管設計(open-tube design)。通常,在開放管系統的情形中,當閥開放時,製程流體將連續地從分配噴嘴流出。但本文中的系統利用可膨脹囊體以回吸製程流體,且收集一注入量的製程流體,以防止流體在不期望的時間進行分配。再注入速率可依據特定的分配循環進行調整。例如,給定系統可需要每30秒、或每45秒、或每60秒在不同基板上沉積製程流體。基於分配循環及製程流體過濾,可設定特定的再注入速率。就分配操作之間之較長時段而言,當狹長囊體不應無限制地收集注入物時,可關閉閥152。The distribution unit can expand the volume of the long and narrow capsule to collect an injected amount of process fluid. When the processing fluid is distributed on the substrate, the distribution unit can shrink the elongated capsule, which causes the filtered processing fluid to flow to the
在製程流體過濾器之後沒有閥的情形意味著缺陷產生的較小機會。一些液體組成物具有較高的自聚集傾向(例如,某些含矽抗反射塗層),且自聚集問題隨更多的實體接觸部(閥、分洩部(bleed off)等)而增加,且因此通常可能在一製造批次開始時、或當變更流體時,排除一加侖的如此材料。本文中的分配單元及分配系統不提供如此材料的聚集機會,且因此增加材料的使用率。習知的系統通常包含許多試圖防止缺陷的機械元件(包含增強閥、注入前腔室、分洩螺釘(bleed screw)、吐出位置(purge location)、粗針閥及細針閥、緩衝槽、起泡器等),但所有的該等特徵本身可能產生缺陷。據此,如本文中所揭露,於過濾之後沒有接觸製程流體的機械元件的情形提供高純度的分配,且分配單元之精準的馬達控制提供高精確度的分配。The absence of a valve after the process fluid filter means a smaller chance of defects. Some liquid compositions have a higher tendency to self-aggregate (for example, some anti-reflective coatings containing silicon), and the self-aggregation problem increases with more physical contact parts (valves, bleed off, etc.). And therefore it is usually possible to exclude one gallon of such material at the beginning of a manufacturing batch, or when changing fluids. The distribution unit and distribution system herein do not provide an opportunity for gathering such materials, and therefore increase the usage rate of the materials. Conventional systems usually contain many mechanical components that try to prevent defects (including booster valves, pre-injection chambers, bleed screws, purge locations, thick and fine needle valves, buffer tanks, etc.) Bubbles, etc.), but all of these features themselves may produce defects. Accordingly, as disclosed in this document, the case where there is no mechanical element contacting the process fluid after filtration provides high-purity distribution, and the precise motor control of the distribution unit provides high-precision distribution.
本文中之分配系統的配置實質上將製程流體管線分隔成兩區域或部分。再次參考圖10,部分171可稱為「淨空」部分,而部分172可稱為「超淨空」部分。注意到,閥152及製程流體源150係位於製程流體過濾器之上游側的淨空部分中。淨空部分可視為次級重要區域(相較於超淨空部分),因為製程流體尚未穿過分配之前的最終過濾器。又,閥152可具有柔性開合及電子控制。在過濾器154(最終過濾器)之後,沒有撞擊或聚集位置,且分配管線(導管)係從過濾器154貫通至分配噴嘴137。因此,在超淨空部分中,除了平順膨脹及收縮的狹長囊體以外,沒有接觸製程流體的機械移動部件。The configuration of the distribution system in this article essentially divides the process fluid pipeline into two regions or sections. Referring again to FIG. 10, the
本文中之分配系統的實施例亦可包含利用連續監控及回饋的彎液面控制。彎液面感測器138可以相對高的取樣速率(每秒十或更多的循環)監控分配噴嘴137處的彎液面位置,並將彎液面位置資料(包含彎液面位置改變)傳輸至控制狹長囊體膨脹及收縮的控制器142。據此,在分配操作之間,彎液面位置可在分配噴嘴137內維持於預定位置處。這包含在製程流體分配之後,利用狹長囊體之膨脹的回吸控制。The embodiment of the distribution system herein may also include meniscus control using continuous monitoring and feedback. The
本文中的技術可部分地藉由以下方式提供數位回吸(digital suck back):具有足夠的來回容積變換,以使彎液面維持運作。彎液面可停止於分配管線上,且然後維持於系統之噴嘴區域內的位置。在習知系統的情況中,不可能使用開放管系統。然而,利用本文中之使用狹長囊體的技術,如此之控制係可能的。分配單元可配置成以小幅延遲回應彎液面位置回饋。例如,彎液面位置感測器(例如,光學感測器)藉由監控彎液面位置而識別彎液面的位置及彎液面的變化(人眼通常無法察覺)。然後,PID控制迴路係用以立即地作出單向或反向的容積囊體變化。例如,一回應為快速地使狹長囊體膨脹,以吸收即將撞擊彎液面之壓力脈衝的容積變化。此回應的結果為製程流體留在噴嘴中,而不分配至基板上。The technology in this article can provide digital suck back in part by the following: having enough back-and-forth volume conversion to keep the meniscus in operation. The meniscus can stop on the distribution line and then maintain its position in the nozzle area of the system. In the case of the conventional system, it is impossible to use an open tube system. However, using the technique of using long and narrow capsules in this article, such control is possible. The distribution unit can be configured to respond to the meniscus position feedback with a small delay. For example, a meniscus position sensor (such as an optical sensor) monitors the position of the meniscus to identify the position of the meniscus and the change of the meniscus (which the human eye usually cannot detect). Then, the PID control loop is used to make one-way or reverse volume changes immediately. For example, one response is to rapidly expand the long and narrow balloon to absorb the volume change of the pressure pulse about to hit the meniscus. The result of this response is that the process fluid remains in the nozzle and is not distributed on the substrate.
可使用能進行以下動作的任何感測器:在足夠的時間內監控噴嘴區域中之彎液面的位置並偵測位置的變化,以傳遞位置的變化,所以分配單元可作出容積調整,以使彎液面維持於預定位置範圍內。現在參考圖11,在一實施例中,光學感測器係與分配噴嘴137一起使用。電子光感測器168(例如,線性光二極體陣列(PDA, photodiode array)感測器、或電荷耦合元件(CCD, charge-coupled device)感測器)係定位於分配噴嘴137上或噴嘴區域。噴嘴區域可包含噴嘴、噴嘴的漸縮部分(tapered portion)、或噴嘴及緊接分配噴嘴137之前之預定長度的導管。例如發光二極體(LED)的光源167係面對光感測器而安裝以提供光照。電子光感測器168然後可用以偵測彎液面位置169。控制迴路回應時間可配置成小於十毫秒。或者,可使用具有光擴散器的表面安裝LED。或者,可使用電容感測器、視覺照相機系統、時域反射計(time-domain reflectometer)、或超音波感測器。步進馬達可涵蓋於控制迴路中,且可作出快速改變,以將彎液面維持於預定保持位置處。據此,即使在分配噴嘴137處沒有閥,且不管對於系統之任何實體衝擊動作、或通過製程流體過濾器之變數流速,本文的系統仍可將彎液面保持於彎液面位置。彎液面位置的監控提供數位的回吸控制。在分配操作期間,狹長囊體可利用液壓流體進行收縮或壓縮。此動作有助於使製程流體離開分配噴嘴至基板上。可從製程流體源提供額外的流動。在分配操作完成之後,系統可使狹長囊體膨脹,直至將製程流體的彎液面回吸至噴嘴區域內的預定位置。彎液面監控感測器可直接地定位於噴嘴本身上,或可考量噴嘴而定位。Any sensor that can perform the following actions can be used: monitor the position of the meniscus in the nozzle area in sufficient time and detect the change in position to transmit the change in position, so the distribution unit can make volume adjustments to make The meniscus is maintained within a predetermined position range. Referring now to FIG. 11, in one embodiment, an optical sensor is used with the dispensing
實施例可包含在不進行分配時,防止製程流體彎液面蒸發的技術,以防止缺陷。如已描述,本文中的系統在噴嘴處沒有閥的情形下運作。在噴嘴處,製程流體係在彎液面曝露至空氣的情況下維持於噴嘴內或噴嘴區域內。當製程流體中的溶劑蒸發時,該蒸發可能留下乾燥的微粒,其在後續的分配操作中可輕易地被轉移至基板。現在參考圖12,實施例可包含利用蒸發屏障178及/或溶劑氣體供應器177。蒸發屏障178可提供噴嘴的護罩、部分式外殼、或完整式外殼(封裝部),以防止或減少蒸發。具有完整式外殼的屏障裝置可在不觸及噴嘴的情況下將噴嘴的末端包住。因此,在微粒產生方面,沒有機械部件接觸彎液面。蒸發屏障178可配置成取決於分配動作而打開及閉合,從而在閉合時容納蒸發物,且然後打開而容許分配動作。可供應氣體基溶劑至噴嘴,來取代屏障裝置、或附加於屏障裝置。藉由充滿與製程流體彎液面接觸的空氣,製程流體的溶劑具有降低的機會從製程流體蒸發而留下較高濃度之固體。據此,如此之技術可在沒有實體接觸製程流體彎液面之機械部件的情況下,防止或減少彎液面處的蒸發。The embodiment may include a technique to prevent the meniscus of the process fluid from evaporating when the dispensing is not performed, so as to prevent defects. As already described, the system in this document operates without a valve at the nozzle. At the nozzle, the process flow system is maintained in the nozzle or nozzle area when the meniscus is exposed to air. When the solvent in the process fluid evaporates, the evaporation may leave dry particles, which can be easily transferred to the substrate in subsequent dispensing operations. Referring now to FIG. 12, embodiments may include the use of an
本文中的系統包含若干操作狀態。一操作狀態係保持彎液面位置的操作狀態。在分配之前、或在閒置期間,利用來自彎液面位置感測器的回饋,狹長囊體係用以將製程流體彎液面維持於噴嘴或噴嘴區域內的特定位置處。另一操作狀態係分配流體的操作狀態。若製程流體彎液面不處於期望位置處,則使用囊體來將彎液面調整至定位。然後,囊體可以期望的速率將期望的製程流體容積分配至例如半導體晶圓的基板上,且然後停止分配操作,並將彎液面回吸至保持位置。注意到,在分配操作期間,沒有閥運作,亦即在製程流體過濾器的下游處沒有閥。另一操作狀態係再注入狹長囊體的操作狀態。閥(在過濾器的上游側)係打開的,以容許製程流體流入狹長囊體中。使狹長囊體膨脹,以再填充流體注入體積,並管理彎液面保持位置。當囊體已進行再填充,且不需要後續分配時,則可將閥閉合。The system in this article contains several operating states. An operating state is an operating state that maintains the position of the meniscus. Before dispensing or during the idle period, using feedback from the meniscus position sensor, the elongated bladder system is used to maintain the meniscus of the process fluid at a specific position in the nozzle or nozzle area. The other operating state is the operating state of the dispensing fluid. If the meniscus of the process fluid is not at the desired position, the bladder is used to adjust the meniscus to position. Then, the capsule can dispense a desired volume of process fluid to a substrate such as a semiconductor wafer at a desired rate, and then stop the dispensing operation and suck the meniscus back to the holding position. Note that during the dispensing operation, there is no valve operation, that is, there is no valve downstream of the process fluid filter. The other operating state is the operating state of reinjecting the long and narrow capsule. The valve (on the upstream side of the filter) is open to allow process fluid to flow into the elongated capsule. The elongated balloon is expanded to refill the fluid injection volume and manage the meniscus to maintain its position. When the capsule has been refilled and subsequent dispensing is not required, the valve can be closed.
本文中的系統可基於像素移動而保持彎液面位置。當偵測大於(例如)5像素的像素移動時,系統可作出容積調整。據此,利用本文中的技術,可將彎液面保持於設定位置之+/-1毫米以內的特定保持位置處。本文中的系統可配置成在約1秒內分配約0.5ml。在一例示性再注入流程中,將閥打開,以容許製程流體流過過濾器及進入狹長囊體。可利用PID控制啟動分配單元容積控制馬達,以將彎液面維持於保持位置。當階段位置抵達再注入設定點時,可將閥152閉合。可在可選的延遲之後停止馬達,以容許額外的流體從過濾器分洩。然後,可使用比例控制器將彎液面定位於保持位置處。取決於系統參數及尺寸,經過濾之製程流體在囊體中的再注入可花費5-30秒。因此,本文中的系統可具有小於約20秒的基板循環時間。本文中的系統可提供具有高度可重複性、及約1毫米以內之彎液面控制的無閥分配系統。The system in this paper can maintain the meniscus position based on pixel movement. When detecting pixel movement larger than, for example, 5 pixels, the system can make volume adjustments. Accordingly, using the technology in this article, the meniscus can be maintained at a specific holding position within +/- 1 mm of the set position. The system herein can be configured to dispense about 0.5 ml in about 1 second. In an exemplary reinjection process, the valve is opened to allow the process fluid to flow through the filter and into the elongated capsule. PID control can be used to start the volume control motor of the distribution unit to maintain the meniscus in the holding position. When the stage position reaches the refill set point,
用以保持彎液面位置的其他實施例包含將分配噴嘴及/或噴嘴區域配置成利用毛細管作用。毛細管作用可用以產生具有壓差的部分,而不使用囊體來移動製程流體。在一實施例中,實質壓差係藉由利用噴嘴中的特徵而產生於噴嘴範圍內。例如,篩板可定位於噴嘴內緊鄰噴嘴開口之前(或細密過濾器、篩網等)。以非限制性實施例為例,就利用導管(其具有約1mm的噴嘴開口)的光阻分配而言,可使用具有複數微米級開口的板件。在製程流體穿過篩件之後,製程流體可輕易地落在定位於噴嘴下方的基板上。在降低製程流體的壓力之後,製程流體被保持於篩件的導管側。然後,在製程流體能離開噴嘴前,需要具備臨界壓力以克服篩板的毛細管作用。據此,源自篩板的毛細管作用可將製程流體的彎液面保持於噴嘴區域內。Other embodiments for maintaining the position of the meniscus include configuring the dispensing nozzle and/or nozzle area to utilize capillary action. Capillary action can be used to create a portion with a pressure difference without using a capsule to move the process fluid. In one embodiment, the substantial pressure difference is generated within the nozzle range by using features in the nozzle. For example, the screen can be positioned in the nozzle immediately before the nozzle opening (or fine filter, screen, etc.). Taking a non-limiting example as an example, in terms of photoresist distribution using a duct (which has a nozzle opening of about 1 mm), a plate with a plurality of micron-level openings can be used. After the process fluid passes through the screen, the process fluid can easily fall on the substrate positioned under the nozzle. After reducing the pressure of the process fluid, the process fluid is held on the duct side of the screen. Then, before the process fluid can leave the nozzle, it needs to have a critical pressure to overcome the capillary action of the sieve plate. Accordingly, the capillary action from the sieve plate can maintain the meniscus of the process fluid in the nozzle area.
另一實施例可包含在緊鄰分配噴嘴之前使用縮窄的流體導管。當管路的直徑縮窄時,毛細管力增加,且液體及管路之間的粘著力可增加。因此,利用定位於分配噴嘴附近、或定位於緊接離開分配噴嘴前的縮窄開口,此部分中的流體粘著力可增加。若使製程流體導管中的製程流體壓力充分地降低,則已穿過此縮窄部分的製程流體被切斷並離開分配噴嘴,剩下的製程流體由於粘著力而被保持於縮窄導管內。然後需要大於零的某臨界壓力來重新啟動分配製程流體。否則,製程流體可能被保持於開放的分配噴嘴內,而不從分配噴嘴滴出。以非限制性範例為例,若製程流體導管具有1mm的直徑,且分配噴嘴具有0.8mm的直徑,則緊接分配噴嘴之前的導管的長度可具有約0.5mm的直徑。如此之實施例可在具有彎液面感測器或沒有彎液面感測器的情況下運作,且可在具有蒸發防止機構或沒有蒸發防止機構的情況下運作。Another embodiment may include the use of a narrowed fluid conduit immediately before the dispensing nozzle. When the diameter of the pipe narrows, the capillary force increases, and the adhesion between the liquid and the pipe can increase. Therefore, by using the narrowed opening positioned near the dispensing nozzle or positioned immediately before leaving the dispensing nozzle, the fluid adhesion force in this portion can be increased. If the pressure of the process fluid in the process fluid conduit is sufficiently reduced, the process fluid that has passed through the narrowed portion is cut off and leaves the dispensing nozzle, and the remaining process fluid is held in the narrowed conduit due to adhesive force. Then a certain critical pressure greater than zero is required to restart the dispensing process fluid. Otherwise, the process fluid may be held in the open dispensing nozzle instead of dripping from the dispensing nozzle. Taking a non-limiting example as an example, if the process fluid conduit has a diameter of 1 mm and the dispensing nozzle has a diameter of 0.8 mm, the length of the conduit immediately before the dispensing nozzle may have a diameter of about 0.5 mm. Such an embodiment can operate with or without a meniscus sensor, and can operate with or without an evaporation prevention mechanism.
據此,本文中的實施例提供流體輸送系統。如此之系統可包含用於流體分配的設備,其可包含從製程流體源入口延伸至分配噴嘴的製程流體導管。該導管可包含用於液體化學成分輸送的管道或管路。製程流體源入口係用以接收製程流體,其中該製程流體具有足以從製程流體入口往分配噴嘴作為製程流體流動方向驅動製程流體的壓力。例如,製程流體源入口可配置成附接至光阻的容器。製程流體源係在上游處,且分配噴嘴係在下游處。Accordingly, the embodiments herein provide a fluid delivery system. Such a system may include a device for fluid distribution, which may include a process fluid conduit extending from an inlet of a process fluid source to a dispensing nozzle. The conduit may include pipes or piping for the transportation of liquid chemical components. The process fluid source inlet is used to receive the process fluid, wherein the process fluid has a pressure sufficient to drive the process fluid from the process fluid inlet to the dispensing nozzle as the flow direction of the process fluid. For example, the process fluid source inlet may be configured to be attached to a photoresist container. The source of the process fluid is upstream, and the distribution nozzle is downstream.
舉例而言,製程流體源可為容納給定製程流體的化學成分供應瓶。製程流體閥係定位於沿著製程流體導管之製程流體源入口的下游處。製程流體閥係配置成選擇性地使通過製程流體導管的製程流體流動停止、以及容許製程流體流動通過製程流體導管。製程流體過濾器係定位於沿著該製程流體導管之製程流體閥的下游處,且係配置成過濾通過製程流體導管的製程流體。例如,光阻在被推動通過製程流體過濾器時受到過濾。因此,系統係配置成使製程流體從製程流體源入口流至製程流體閥,且然後流至製程流體過濾器。在分配操作期間,製程流體供應壓力應足夠將製程流體推動通過過濾器,且進入狹長囊體,並且防止通過製程過濾器的回流。For example, the source of the process fluid may be a supply bottle containing chemical components for the customized process fluid. The process fluid valve is positioned downstream of the process fluid source inlet along the process fluid conduit. The process fluid valve system is configured to selectively stop the flow of the process fluid through the process fluid conduit and allow the process fluid to flow through the process fluid conduit. The process fluid filter is positioned downstream of the process fluid valve along the process fluid conduit, and is configured to filter the process fluid passing through the process fluid conduit. For example, the photoresist is filtered when it is pushed through the process fluid filter. Therefore, the system is configured to flow the process fluid from the process fluid source inlet to the process fluid valve, and then to the process fluid filter. During the dispensing operation, the process fluid supply pressure should be sufficient to push the process fluid through the filter and into the elongated capsule, and prevent backflow through the process filter.
狹長囊體係定位於製程流體過濾器的下游處,且係配置成製程流體導管的一部分。換言之,狹長囊體用作或充當連續製程流體導管的一部位。狹長囊體係定位於由液壓流體外殼所定義的腔室內,且可實施為能視需要加以移除及更換的模組單元。狹長囊體從腔室入口延伸至腔室出口。狹長囊體在腔室入口開口及腔室出口開口之間定義線性流動路徑。狹長囊體係配置成在腔室內橫向膨脹及橫向收縮,使得當狹長囊體容納一容積之製程流體時,該狹長囊體內之製程流體的容積可增加及減小。狹長囊體可具有圓形、橢圓形、或長圓形橫剖面形狀。狹長囊體具有比狹長囊體之橫剖面高度更大的長度。在一些實施例中,狹長囊體的長度可比橫剖面高度大四倍。The elongated bladder system is positioned downstream of the process fluid filter and is configured as a part of the process fluid conduit. In other words, the long and narrow balloon serves as or serves as a part of a continuous process fluid conduit. The long and narrow bladder system is positioned in the cavity defined by the hydraulic fluid housing, and can be implemented as a modular unit that can be removed and replaced as needed. The elongated capsule extends from the chamber entrance to the chamber exit. The elongated capsule defines a linear flow path between the chamber inlet opening and the chamber outlet opening. The long and narrow bladder system is configured to expand and contract laterally in the chamber, so that when the long and narrow bladder contains a volume of process fluid, the volume of the process fluid in the long and narrow bladder can increase and decrease. The elongated capsule may have a circular, elliptical, or oblong cross-sectional shape. The elongated capsule has a length greater than the height of the cross-section of the elongated capsule. In some embodiments, the length of the elongated capsule may be four times greater than the height of the cross-section.
控制器係配置成透過使施加於狹長囊體之外表面(或複數外表面)上的液壓流體壓力增加,藉此選擇性地使狹長囊體收縮,從而使製程流體從分配噴嘴分配。控制器係配置成透過使施加於狹長囊體之外表面上的液壓流體壓力降低,藉此選擇性地使狹長囊體膨脹,從而停止製程流體從分配噴嘴的分配。The controller is configured to increase the pressure of the hydraulic fluid applied to the outer surface (or a plurality of outer surfaces) of the elongated capsule, thereby selectively contracting the elongated capsule, so that the process fluid is distributed from the dispensing nozzle. The controller is configured to selectively inflate the elongated balloon by reducing the pressure of the hydraulic fluid applied on the outer surface of the elongated balloon, thereby stopping the dispensing of the process fluid from the dispensing nozzle.
設備可配置成當該製程流體閥為開放狀態時,啟動從分配噴嘴的給定分配,以及停止從分配噴嘴的給定分配。注意到,在分配噴嘴處沒有閥。製程流體導管在製程流體過濾器及分配噴嘴之間沒有閥。因此,實施例包含沒有閥定位於製程流體過濾器下游之製程流體導管上的情形。亦即,製程流體導管在製程流體過濾器及分配噴嘴之間沒有(能夠將通過製程流體導管之製程流體流動完全阻隔的)閥。The device can be configured to start a given dispensing from the dispensing nozzle and stop a given dispensing from the dispensing nozzle when the process fluid valve is in an open state. Note that there is no valve at the dispensing nozzle. The process fluid conduit has no valve between the process fluid filter and the dispensing nozzle. Therefore, the embodiments include situations where no valve is positioned on the process fluid conduit downstream of the process fluid filter. That is, the process fluid conduit does not have a valve (that can completely block the flow of the process fluid through the process fluid conduit) between the process fluid filter and the dispensing nozzle.
狹長囊體係配置成在沒有製程流體正從分配噴嘴進行分配時膨脹並收集一注入量的製程流體。狹長囊體可選擇成彈性材料或撓性材料。流體導管可具有在狹長囊體的每一末端處連接至該狹長囊體的斜角連接部。設備可定位於用以在半導體晶圓上沉積及顯影膜層的塗佈機-顯影機工具內。The elongated bladder system is configured to expand and collect an injected amount of process fluid when no process fluid is being dispensed from the dispensing nozzle. The elongated capsule can be selected as an elastic material or a flexible material. The fluid conduit may have an oblique connection to the elongated balloon at each end of the elongated balloon. The equipment can be positioned in a coater-developer tool for depositing and developing film layers on semiconductor wafers.
液壓流體外殼包含定位於該液壓流體外殼內、且定尺寸成容許狹長囊體膨脹至預定容積並防止其膨脹超過預定容積的囊體膨脹限制部。位移構件可插入液壓流體外殼,以增加液壓流體壓力,並且可從液壓流體外殼縮回,以降低液壓流體壓力。The hydraulic fluid housing includes a balloon expansion restricting portion positioned in the hydraulic fluid housing and sized to allow the elongated balloon to expand to a predetermined volume and prevent it from expanding beyond the predetermined volume. The displacement member can be inserted into the hydraulic fluid housing to increase the hydraulic fluid pressure, and can be retracted from the hydraulic fluid housing to reduce the hydraulic fluid pressure.
實施例可包含定位於分配噴嘴處、且配置成將分配噴嘴(或噴嘴區域)中之製程流體的彎液面位置傳輸至控制器的彎液面感測器。如此之彎液面感測器可為光學型、電容型、超音波型等。控制器可配置成接收保持彎液面位置的命令,且然後藉由調整狹長囊體中的容積而選擇性地將分配噴嘴內的彎液面位置保持於預定公差以內。Embodiments may include a meniscus sensor positioned at the dispensing nozzle and configured to transmit the meniscus position of the process fluid in the dispensing nozzle (or nozzle area) to the controller. Such a meniscus sensor can be optical, capacitive, ultrasonic, etc. The controller may be configured to receive a command to maintain the position of the meniscus, and then selectively maintain the position of the meniscus in the dispensing nozzle within a predetermined tolerance by adjusting the volume in the elongated capsule.
在一些實施例中,蒸發防止裝置係定位成部分地或完全地包圍分配噴嘴,而不接觸分配噴嘴內的製程流體。換言之,護罩或罩蓋係用以包圍分配噴嘴尖端,或用以減少分配噴嘴尖端對空氣的曝露,而實際上不接觸分配噴嘴尖端。溶劑輸送單元亦可定位且配置成將呈氣相的溶劑輸送至分配噴嘴的開放區域,使得溶劑可流動成與製程流體的彎液面接觸。換言之,可使(與製程流體相容之)氣相溶劑往分配噴嘴開口泵抽或流動。藉由將空氣封入分配噴嘴尖端處而使氣相溶劑與製程流體彎液面接觸,可降低或防止製程流體的蒸發,從而減少製程流體中潛在的缺陷。In some embodiments, the evaporation prevention device is positioned to partially or completely surround the dispensing nozzle without contacting the process fluid in the dispensing nozzle. In other words, the shield or cover is used to surround the tip of the dispensing nozzle, or to reduce the exposure of the tip of the dispensing nozzle to air, without actually touching the tip of the dispensing nozzle. The solvent delivery unit can also be positioned and configured to deliver the solvent in the gas phase to the open area of the dispensing nozzle, so that the solvent can flow into contact with the meniscus of the process fluid. In other words, the gas phase solvent (compatible with the process fluid) can be pumped or flowed to the opening of the dispensing nozzle. By enclosing the air at the tip of the dispensing nozzle so that the vapor phase solvent contacts the meniscus of the process fluid, the evaporation of the process fluid can be reduced or prevented, thereby reducing potential defects in the process fluid.
另一實施例包含用於流體分配的設備。該設備包含從製程流體閥延伸至分配噴嘴的製程流體導管。製程流體閥係配置成選擇性地使通過製程流體導管的製程流體流動停止,以及容許製程流體流動通過製程流體導管往分配噴嘴(例如,總背壓)。製程流體過濾器係定位於製程流體閥及分配噴嘴之間的製程流體導管中。Another embodiment includes a device for fluid distribution. The device includes a process fluid conduit extending from a process fluid valve to a dispensing nozzle. The process fluid valve is configured to selectively stop the flow of process fluid through the process fluid conduit, and allow the process fluid to flow through the process fluid conduit to the dispensing nozzle (eg, total back pressure). The process fluid filter is positioned in the process fluid conduit between the process fluid valve and the distribution nozzle.
狹長囊體係定位於製程流體過濾器及分配噴嘴之間。狹長囊體係配置成製程流體導管的一部位。狹長囊體係定位於液壓流體外殼內。狹長囊體從液壓流體外殼的腔室入口開口延伸至腔室出口開口。狹長囊體定義介於腔室入口開口及腔室出口開口之間的線性流動路徑。狹長囊體係配置成在液壓流體外殼內橫向膨脹及橫向收縮,使得當狹長囊體容納一容積之製程流體時,該狹長囊體內之製程流體的容積可增加及減小。The long and narrow bladder system is positioned between the process fluid filter and the dispensing nozzle. The long and narrow balloon system is configured as a part of the process fluid conduit. The elongated bladder system is positioned in the hydraulic fluid housing. The elongated bladder extends from the chamber inlet opening of the hydraulic fluid housing to the chamber outlet opening. The elongated capsule defines a linear flow path between the chamber inlet opening and the chamber outlet opening. The long and narrow bladder system is configured to expand and contract laterally in the hydraulic fluid housing, so that when the long and narrow bladder contains a volume of process fluid, the volume of the process fluid in the long and narrow bladder can increase and decrease.
在其他實施例中,能夠使流體導管完全閉合的製程流體閥在流體分配系統中完全不存在。例示性製程閥包含球形閥、蝶形閥、閘閥、針閥等,其基本上包括任何的非彈性閥。因此,從製程流體源入口至分配噴嘴,沒有閥或沒有剛性(非彈性)閥。本實施例係部分地藉由操控流體源的供應壓力而執行。藉由在系統範圍內將製程流體源的供應壓力降低至零,在製程流體導管內有足夠的流體摩擦,以阻止製程流體的流動。然後可增加供應流體壓力,以產生流動而克服所產生的壓力降低。例如,常見的光阻供應源可為瓶、或容器內的袋。瓶可具有流體出口及用於增加光阻表面上之空氣壓力的入口。此情形亦可利用位於袋中的光阻達成,其中空氣壓力係施加於袋的外表面。這使得光阻流動通過分配系統,且可藉由控制器而啟動、停止、暫停、及調整。因此,在如此之實施例中,製程流體導管從製程流體源入口延伸至分配噴嘴。製程流體源可附接至製程流體源入口,以接收製程流體。製程流體源可具有從零壓力至增加壓力可進行選擇的供應壓力,該增加壓力係至少足以將製程流體從製程流體源入口往分配噴嘴驅動,以作為製程流體流動方向,其中製程流體源係在上游處且分配噴嘴係在下游處。如此之系統可如前文所述以其他方式進行配置,惟製程流體導管在製程流體源入口與分配噴嘴之間沒有閥。該閥是指能夠將通過製程流體導管的製程流體流動完全阻隔的閥,如球形閥、或針閥。控制器亦可配置成控制製程流體源的供應壓力,以對供應壓力作出連續調整。In other embodiments, the process fluid valve capable of completely closing the fluid conduit does not exist in the fluid distribution system. Exemplary process valves include spherical valves, butterfly valves, gate valves, needle valves, etc., which basically include any inelastic valve. Therefore, there is no valve or no rigid (inelastic) valve from the inlet of the process fluid source to the dispensing nozzle. This embodiment is implemented in part by manipulating the supply pressure of the fluid source. By reducing the supply pressure of the process fluid source to zero within the system, there is sufficient fluid friction in the process fluid conduit to prevent the flow of the process fluid. The supply fluid pressure can then be increased to generate flow to overcome the resulting pressure drop. For example, a common photoresist supply source can be a bottle or a bag in a container. The bottle may have a fluid outlet and an inlet for increasing the air pressure on the photoresist surface. This situation can also be achieved with a photoresist located in the bag, where air pressure is applied to the outer surface of the bag. This allows the photoresist to flow through the distribution system and can be started, stopped, paused, and adjusted by the controller. Therefore, in such an embodiment, the process fluid conduit extends from the process fluid source inlet to the dispensing nozzle. The process fluid source may be attached to the process fluid source inlet to receive the process fluid. The process fluid source may have a selectable supply pressure from zero pressure to an increased pressure, and the increased pressure is at least sufficient to drive the process fluid from the process fluid source inlet to the dispensing nozzle as the process fluid flow direction, where the process fluid source is The distribution nozzle is upstream and downstream. Such a system can be configured in other ways as described above, but the process fluid conduit does not have a valve between the process fluid source inlet and the dispensing nozzle. The valve refers to a valve that can completely block the flow of the process fluid passing through the process fluid conduit, such as a ball valve or a needle valve. The controller can also be configured to control the supply pressure of the process fluid source to continuously adjust the supply pressure.
控制器係配置成透過使施加於狹長囊體之外表面上的液壓流體壓力增加,藉此選擇性地使狹長囊體收縮,從而使製程流體從分配噴嘴分配。控制器係配置成透過使施加於狹長囊體之外表面上的液壓流體壓力降低,藉此選擇性地使狹長囊體膨脹,從而當製程流體閥為打開狀態時,停止製程流體從分配噴嘴的分配。製程流體導管在製程流體過濾器及分配噴嘴之間可沒有閥。狹長囊體係配置成在沒有製程流體正從分配噴嘴進行分配時膨脹並收集一注入量的製程流體。設備係定位於用以在半導體晶圓上沉積及顯影膜層的塗布機-顯影機工具內。The controller is configured to increase the pressure of the hydraulic fluid applied to the outer surface of the elongated capsule, thereby selectively contracting the elongated capsule, so that the process fluid is distributed from the dispensing nozzle. The controller is configured to selectively inflate the elongated balloon by reducing the pressure of the hydraulic fluid applied to the outer surface of the elongated balloon, thereby stopping the flow of the processing fluid from the dispensing nozzle when the processing fluid valve is open. distribution. The process fluid conduit may have no valve between the process fluid filter and the dispensing nozzle. The elongated bladder system is configured to expand and collect an injected amount of process fluid when no process fluid is being dispensed from the dispensing nozzle. The equipment is positioned in a coater-developer tool for depositing and developing film layers on semiconductor wafers.
據此,提供高純度、高精確度、無閥的分配系統。Accordingly, a high-purity, high-precision, valveless distribution system is provided.
在前述說明內容中,已提出如處理系統之特定幾何結構、及其中所用諸多元件及製程之說明的特定細節。然而,吾人應理解,本文中之技術可在背離該等特定細節的其他實施例中實施、以及如此之細節係用於解釋且非限制的目的。本文中所揭露之實施例已參照隨附圖式加以描述。類似地,針對解釋的目的,已提出特定的數目、材料、及配置,以提供透徹的理解。然而,實施例可在沒有如此之特定細節的情形中實施。具有實質上相同功能性結構的元件係以相似參考符號表示,且由此可省略任何重複的描述。In the foregoing description, specific details such as the specific geometric structure of the processing system and the description of many elements and processes used therein have been proposed. However, we should understand that the technology in this document can be implemented in other embodiments that deviate from these specific details, and such details are for explanatory and non-limiting purposes. The embodiments disclosed herein have been described with reference to the accompanying drawings. Similarly, for the purpose of explanation, specific numbers, materials, and configurations have been proposed to provide a thorough understanding. However, the embodiments can be implemented without such specific details. Elements having substantially the same functional structure are denoted by similar reference signs, and thus any repetitive description may be omitted.
各種不同的技術已描述為複數的分離操作,以幫助理解各種不同的實施例。描述的順序不應被視為暗示該等操作必須順序相依。實際上,該等操作不必以所呈現之順序執行。所描述之操作可按照不同於所述實施例的順序執行。在額外的實施例中,可執行諸多額外的操作、且/或可省略所述操作。Various different techniques have been described as plural separation operations to help understand the various embodiments. The order of description should not be taken as implying that these operations must be sequence dependent. In fact, these operations need not be performed in the order presented. The described operations can be performed in a different order than the described embodiment. In additional embodiments, many additional operations may be performed, and/or the operations may be omitted.
依據本發明,本文中所使用之「基板」或「目標基板」一般是指受處理的物體。基板可包含元件(特別是半導體或其他電子元件)的任何材料部分或結構,且舉例而言,可為基礎基板結構,如半導體晶圓、倍縮遮罩、或基礎基板結構上或覆蓋該基礎基板結構的覆層(如薄膜)。因此,基板不受限於任何特定的基礎結構、下方層或上方層、圖案化或非圖案化,反而基板被認為包含任何的如此之覆層或基礎結構、以及覆層及/或基礎結構的任何組合。描述內容可參照特定類型的基板,但其僅為說明性的目的。According to the present invention, the "substrate" or "target substrate" used herein generally refers to the object to be processed. The substrate may include any material part or structure of a device (especially a semiconductor or other electronic device), and for example, may be a basic substrate structure, such as a semiconductor wafer, a shrinking mask, or a basic substrate structure on or covering the foundation Substrate structure coating (such as film). Therefore, the substrate is not limited to any specific basic structure, lower or upper layer, patterned or unpatterned, but the substrate is considered to include any such cladding or basic structure, and the cladding and/or basic structure. Any combination. The description can refer to a specific type of substrate, but it is for illustrative purposes only.
熟習該領域技術者亦將理解,針對以上所解釋之技術的操作可作出諸多不同變化,而仍達成本發明之同樣的目標。如此之變化意在涵蓋於本揭露內容的範疇中。因此,本發明之實施例的前述內容不意圖為限制性。反而,對於本發明之實施例的任何限制係呈現於以下申請專利範圍中。Those skilled in the art will also understand that many different changes can be made to the operation of the technology explained above, while still achieving the same goal of the invention. Such changes are intended to be included in the scope of this disclosure. Therefore, the foregoing contents of the embodiments of the present invention are not intended to be limiting. Instead, any limitations on the embodiments of the present invention are presented in the scope of the following patent applications.
100‧‧‧分配單元105‧‧‧基板111‧‧‧液壓流體外殼113‧‧‧活塞桿部外殼114‧‧‧致動器115‧‧‧狹長囊體116‧‧‧腔室入口開口117‧‧‧腔室出口開口118‧‧‧排放閥119‧‧‧腔室124‧‧‧活塞125‧‧‧桿部126‧‧‧液壓流體127‧‧‧位移腔室128‧‧‧馬達129‧‧‧抗反衝機構137‧‧‧分配噴嘴138‧‧‧彎液面感測器142‧‧‧控制器145‧‧‧囊體膨脹限制部148‧‧‧DIN軌道安裝部150‧‧‧製程流體源152‧‧‧閥154‧‧‧過濾器167‧‧‧光源168‧‧‧電子光感測器169‧‧‧彎液面位置171‧‧‧部分172‧‧‧部分177‧‧‧溶劑氣體供應器178‧‧‧蒸發屏障100‧‧‧
參照以下連同隨附圖式一併考量的實施方式,對本發明之諸多實施例及其許多伴隨優點的較完整認知將變得顯而易見。該等圖式未必按比例繪製,而是要強調說明特徵、原理、及概念。With reference to the following implementations considered together with the accompanying drawings, a more complete understanding of the many embodiments of the present invention and many accompanying advantages will become apparent. These diagrams are not necessarily drawn to scale, but to emphasize the characteristics, principles, and concepts.
圖1為如本文中所述之基於囊體之分配單元的立體圖。Figure 1 is a perspective view of a capsule-based dispensing unit as described herein.
圖2為如本文中所述之基於囊體之分配單元的側視圖。Figure 2 is a side view of a capsule-based dispensing unit as described herein.
圖3為如本文中所述之基於囊體之分配單元的正面圖。Figure 3 is a front view of the capsule-based dispensing unit as described herein.
圖4為如本文中所述之基於囊體之分配單元的橫剖面側視圖。Figure 4 is a cross-sectional side view of a capsule-based dispensing unit as described herein.
圖5為如本文中所述之基於囊體之分配單元的橫剖面側視圖。Figure 5 is a cross-sectional side view of a capsule-based dispensing unit as described herein.
圖6為如本文中所述之基於囊體之分配單元的橫剖面示意側視圖。Figure 6 is a cross-sectional schematic side view of a capsule-based dispensing unit as described herein.
圖7為如本文中所述之基於囊體之分配單元的橫剖面示意側視圖。Figure 7 is a cross-sectional schematic side view of a capsule-based dispensing unit as described herein.
圖8為如本文中所述之基於囊體之分配單元的橫剖面示意側視圖。Figure 8 is a cross-sectional schematic side view of a capsule-based dispensing unit as described herein.
圖9為如本文中所述之基於囊體之分配單元的橫剖面示意側視圖。Figure 9 is a cross-sectional schematic side view of a capsule-based dispensing unit as described herein.
圖10為如本文中所述之分配系統的示意圖。Figure 10 is a schematic diagram of a distribution system as described herein.
圖11為如本文中所述之噴嘴及彎液面感測器(meniscus sensor)的橫剖面示意圖。Figure 11 is a schematic cross-sectional view of a nozzle and a meniscus sensor as described herein.
圖12為如本文中所述之噴嘴及彎液面感測器的橫剖面示意圖。Figure 12 is a schematic cross-sectional view of a nozzle and a meniscus sensor as described herein.
100‧‧‧分配單元 100‧‧‧Distribution unit
105‧‧‧基板 105‧‧‧Substrate
137‧‧‧分配噴嘴 137‧‧‧Distribution nozzle
138‧‧‧彎液面感測器 138‧‧‧ Meniscus Sensor
142‧‧‧控制器 142‧‧‧controller
150‧‧‧製程流體源 150‧‧‧Processing fluid source
152‧‧‧閥 152‧‧‧valve
154‧‧‧過濾器 154‧‧‧Filter
171‧‧‧部分 Part 171‧‧‧
172‧‧‧部分 Part 172‧‧‧
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662373729P | 2016-08-11 | 2016-08-11 | |
US62/373,729 | 2016-08-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201816958A TW201816958A (en) | 2018-05-01 |
TWI723204B true TWI723204B (en) | 2021-04-01 |
Family
ID=61159327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106127240A TWI723204B (en) | 2016-08-11 | 2017-08-11 | High-purity dispense system |
Country Status (5)
Country | Link |
---|---|
US (1) | US10403501B2 (en) |
JP (1) | JP7038505B2 (en) |
KR (2) | KR102462049B1 (en) |
CN (1) | CN107728432A (en) |
TW (1) | TWI723204B (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9987655B2 (en) * | 2015-06-26 | 2018-06-05 | Tokyo Electron Limited | Inline dispense capacitor system |
TWI759147B (en) | 2016-08-12 | 2022-03-21 | 美商因普利亞公司 | Methods of reducing metal residue in edge bead region from metal-containing resists |
US10682663B2 (en) * | 2018-10-31 | 2020-06-16 | The Boeing Company | Methods for dispensing flowable materials |
US11383211B2 (en) * | 2019-04-29 | 2022-07-12 | Tokyo Electron Limited | Point-of-use dynamic concentration delivery system with high flow and high uniformity |
KR20220038102A (en) * | 2019-07-29 | 2022-03-25 | 엑스티피엘 에스.에이. | Method of Dispensing a Metal Nanoparticle Composition from a Nozzle onto a Substrate |
US11666932B2 (en) * | 2020-03-27 | 2023-06-06 | Wagner Spray Tech Corporation | Fluid applicator |
CN114054287A (en) * | 2020-07-30 | 2022-02-18 | 中国科学院微电子研究所 | Photoresist suck-back device, photoresist coating equipment and photoresist coating method |
US20230130235A1 (en) * | 2021-10-21 | 2023-04-27 | Applied Materials, Inc. | Polishing slurry dispense nozzle |
CN114311949B (en) * | 2022-01-17 | 2022-08-16 | 浙江华基环保科技有限公司 | Production method of antioxidant antistatic needled felt for steel plant |
TWI792883B (en) * | 2022-01-24 | 2023-02-11 | 高科晶捷自動化股份有限公司 | Fluid control structure of dispensing apparatus |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060075965A1 (en) * | 2004-10-13 | 2006-04-13 | Jong-Haw Lee | Method of and apparatus for dispensing photoresist in manufacturing semiconductor devices or the like |
US20150209818A1 (en) * | 2014-01-26 | 2015-07-30 | Tokyo Electron Limited | Inline Dispense Capacitor |
TW201606442A (en) * | 2014-05-15 | 2016-02-16 | 東京威力科創股份有限公司 | Method and apparatus for increased recirculation and filtration in a photoresist dispense system |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2467150A (en) | 1943-11-12 | 1949-04-12 | Carl H Nordell | Valve |
US2517820A (en) | 1948-08-10 | 1950-08-08 | American Cyanamid Co | Fluid-pressure controller |
BE491946A (en) | 1949-01-04 | 1900-01-01 | ||
US4195810A (en) | 1978-03-31 | 1980-04-01 | Lavin Aaron M | Pinch valve |
US4442954A (en) | 1982-07-30 | 1984-04-17 | National Instrument Company, Inc. | Self-pressurizing pinch valve |
JPS62121669A (en) * | 1985-11-19 | 1987-06-02 | Toshiba Corp | Coating apparatus |
US5002008A (en) * | 1988-05-27 | 1991-03-26 | Tokyo Electron Limited | Coating apparatus and method for applying a liquid to a semiconductor wafer, including selecting a nozzle in a stand-by state |
JPH01304074A (en) * | 1988-05-31 | 1989-12-07 | Hitachi Electron Eng Co Ltd | High viscosity liquid applying device |
FR2651552B1 (en) | 1989-09-01 | 1991-12-06 | Cit Alcatel | VALVE AND DEVICES USING THE SAME. |
JPH11186143A (en) * | 1997-12-25 | 1999-07-09 | Nec Corp | Application device, dropping device and application method |
JP3958926B2 (en) | 1999-10-18 | 2007-08-15 | インテグレイテッド・デザインズ・リミテッド・パートナーシップ | Apparatus and method for dispensing fluids |
WO2001097983A1 (en) | 2000-06-19 | 2001-12-27 | Mykrolis Corporation | Process and system for determining acceptability of a fluid dispense |
JP2002231668A (en) | 2001-01-31 | 2002-08-16 | Mitsubishi Materials Silicon Corp | Slurry transfer device |
US6568416B2 (en) | 2001-02-28 | 2003-05-27 | Brian L. Andersen | Fluid flow control system, fluid delivery and control system for a fluid delivery line, and method for controlling pressure oscillations within fluid of a fluid delivery line |
EP1432639A1 (en) | 2001-10-01 | 2004-06-30 | Fsi International, Inc. | Fluid dispensing apparatus |
US7335003B2 (en) | 2004-07-09 | 2008-02-26 | Saint-Gobain Performance Plastics Corporation | Precision dispense pump |
KR20060065188A (en) | 2004-12-10 | 2006-06-14 | 삼성전자주식회사 | Photo resist dispense equipment of semiconductor coating device |
US20060174656A1 (en) | 2005-02-08 | 2006-08-10 | Owens-Brockway Glass Container Inc. | Glassware forming machine with bladder-operated cooling wind valve |
JP2006248130A (en) | 2005-03-14 | 2006-09-21 | Seiko Epson Corp | Liquid drop ejector and method for controlling application of micro oscillation |
JP4606234B2 (en) * | 2005-04-15 | 2011-01-05 | 東京エレクトロン株式会社 | Liquid processing method and liquid processing apparatus |
JP2006336574A (en) | 2005-06-03 | 2006-12-14 | Anest Iwata Corp | Method and device for raising pressure of inert gas and feeding inert gas |
US20080169230A1 (en) | 2007-01-12 | 2008-07-17 | Toshiba America Electronic Components, Inc. | Pumping and Dispensing System for Coating Semiconductor Wafers |
JP4824792B2 (en) * | 2009-07-02 | 2011-11-30 | 東京エレクトロン株式会社 | Coating device |
JP5416672B2 (en) * | 2010-09-28 | 2014-02-12 | 株式会社コガネイ | Chemical supply device |
JP5672204B2 (en) * | 2011-09-13 | 2015-02-18 | 東京エレクトロン株式会社 | Liquid processing apparatus, liquid processing method, and storage medium |
EP2662137A1 (en) * | 2012-05-08 | 2013-11-13 | Roche Diagniostics GmbH | Dispensing assembly |
JP6420604B2 (en) * | 2014-09-22 | 2018-11-07 | 株式会社Screenホールディングス | Coating device |
US9987655B2 (en) * | 2015-06-26 | 2018-06-05 | Tokyo Electron Limited | Inline dispense capacitor system |
-
2017
- 2017-08-11 US US15/675,383 patent/US10403501B2/en active Active
- 2017-08-11 TW TW106127240A patent/TWI723204B/en active
- 2017-08-11 CN CN201710687322.1A patent/CN107728432A/en active Pending
- 2017-08-11 KR KR1020170102403A patent/KR102462049B1/en active IP Right Grant
- 2017-08-14 JP JP2017156616A patent/JP7038505B2/en active Active
-
2022
- 2022-01-21 KR KR1020220009262A patent/KR102485546B1/en active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060075965A1 (en) * | 2004-10-13 | 2006-04-13 | Jong-Haw Lee | Method of and apparatus for dispensing photoresist in manufacturing semiconductor devices or the like |
US20150209818A1 (en) * | 2014-01-26 | 2015-07-30 | Tokyo Electron Limited | Inline Dispense Capacitor |
TW201606442A (en) * | 2014-05-15 | 2016-02-16 | 東京威力科創股份有限公司 | Method and apparatus for increased recirculation and filtration in a photoresist dispense system |
Also Published As
Publication number | Publication date |
---|---|
TW201816958A (en) | 2018-05-01 |
KR20180018445A (en) | 2018-02-21 |
JP7038505B2 (en) | 2022-03-18 |
CN107728432A (en) | 2018-02-23 |
US10403501B2 (en) | 2019-09-03 |
KR102462049B1 (en) | 2022-11-02 |
JP2018040349A (en) | 2018-03-15 |
KR102485546B1 (en) | 2023-01-05 |
US20180047562A1 (en) | 2018-02-15 |
KR20220016252A (en) | 2022-02-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI723204B (en) | High-purity dispense system | |
TWI760354B (en) | High-purity dispense unit | |
TWI629740B (en) | Inline dispense capacitor | |
TWI623357B (en) | Apparatus for fluid delivery | |
KR20220087407A (en) | High-precision dispense system with meniscus control | |
US20220048063A1 (en) | Plural material dispensing system | |
JP2016195237A (en) | Process liquid supply method, readable computer storage medium and process liquid supply device | |
KR102710984B1 (en) | Substrate processing apparatus and supplying valve | |
TWI857404B (en) | Processing liquid supply method and substrate processing device | |
JP2023117145A (en) | Processing liquid supply method and substrate processing apparatus |