CN114054287A - Photoresist suck-back device, photoresist coating equipment and photoresist coating method - Google Patents
Photoresist suck-back device, photoresist coating equipment and photoresist coating method Download PDFInfo
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- CN114054287A CN114054287A CN202010752075.0A CN202010752075A CN114054287A CN 114054287 A CN114054287 A CN 114054287A CN 202010752075 A CN202010752075 A CN 202010752075A CN 114054287 A CN114054287 A CN 114054287A
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- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 327
- 238000000576 coating method Methods 0.000 title claims abstract description 52
- 239000011248 coating agent Substances 0.000 title claims abstract description 38
- 239000007788 liquid Substances 0.000 claims abstract description 43
- 230000007246 mechanism Effects 0.000 claims abstract description 41
- 238000012544 monitoring process Methods 0.000 claims abstract description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 40
- 229910052710 silicon Inorganic materials 0.000 claims description 40
- 239000010703 silicon Substances 0.000 claims description 40
- 239000002904 solvent Substances 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 33
- 238000000034 method Methods 0.000 description 8
- 230000001276 controlling effect Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
- B05C11/1018—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target responsive to distance of target
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
- B05D1/005—Spin coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention discloses a photoresist resorption device, photoresist coating equipment and a photoresist coating method, and relates to the technical field of semiconductor manufacturing, wherein the photoresist resorption device comprises a monitor, an on-off resorption mechanism and a controller, wherein the monitor is arranged on the photoresist coating equipment and is used for monitoring a photoresist liquid column in a photoresist nozzle in the photoresist coating equipment; the on-off resorption mechanism is arranged on a photoresist pipeline of the photoresist coating equipment, and an adjusting component in the on-off resorption mechanism is used for adjusting the resorption amount of photoresist in the photoresist pipeline so as to control the position of a photoresist liquid column in a photoresist nozzle communicated with the photoresist pipeline; the controller is respectively in signal connection with the monitor and the on-off suckback mechanism and is used for receiving the signal fed back by the monitor and controlling the on-off suckback mechanism to be opened and closed. The photoresist suck-back device disclosed by the invention can prevent the photoresist from being condensed or dropped due to the fact that the photoresist is too close to the opening of the photoresist nozzle.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a photoresist resorption device, photoresist coating equipment and a photoresist coating method.
Background
This section provides background information related to the present disclosure only and is not necessarily prior art.
The photoresist coating process is an important process in the manufacturing process of semiconductor silicon wafers, and when the photoresist is coated, the silicon wafer is usually arranged on a clamp firstly, organic solvent similar to the diluent in the photoresist is sprayed on the silicon wafer, and then the photoresist is sprayed on the silicon wafer: the nozzle drips the photoresist on the center position of the upper surface of the silicon wafer, the centrifugal machine is started to drive the silicon wafer to rotate and spin the photoresist, the photoresist liquid is enabled to uniformly flow to cover the upper surface of the whole silicon wafer, then the rotating speed of the centrifugal machine is increased, the liquid is enabled to rapidly flow under the action of centrifugal force rotating at high speed to form a film, after a diluent in the liquid volatilizes, a glue layer with a certain thickness is formed on the silicon wafer, and finally the centrifugal machine is closed.
In the process of rotating and spin-coating the silicon wafer, the photoresist nozzle is positioned above the silicon wafer and is in a work waiting stage, at the moment, the photoresist in the photoresist nozzle has the possibility of condensation or dripping, and the condensation can influence the accuracy of the subsequent glue spraying amount and even block the nozzle; the photoresist in the photoresist nozzle is usually sucked back to form a certain distance between the photoresist and the end of the nozzle, thereby preventing the photoresist in the photoresist nozzle from being coagulated or dripped.
Disclosure of Invention
The invention provides a photoresist resorption device for photoresist coating equipment, which comprises:
the monitor is arranged on the photoresist coating equipment and used for monitoring a photoresist liquid column in a photoresist nozzle in the photoresist coating equipment;
the on-off resorption mechanism is arranged on a photoresist pipeline of the photoresist coating equipment and comprises an resorption component and an adjusting component, the resorption component is used for resorbing photoresist in the photoresist pipeline, and the adjusting component is used for adjusting the resorption amount of the photoresist in the photoresist pipeline so as to control the position of a photoresist liquid column in the photoresist nozzle communicated with the photoresist pipeline;
and the controller is respectively in signal connection with the monitor and the on-off suckback mechanism and is used for receiving the signal fed back by the monitor and controlling the on-off suckback mechanism to be opened and closed.
A second aspect of the present invention provides a resist coating apparatus, including:
the carrying platform is used for placing and adsorbing a silicon wafer to be coated;
a centrifuge for rotating the silicon wafer;
the photoresist supplying device comprises a mechanical arm, a photoresist pipeline and a photoresist nozzle communicated with the photoresist pipeline, and the photoresist nozzle is mounted on the mechanical arm and can move along with the mechanical arm;
in the photoresist suck-back device provided by the first aspect of the invention, the on-off suck-back mechanism is arranged on the photoresist pipeline.
A third aspect of the present invention provides a resist coating method implemented by the resist coating apparatus set forth in the second aspect of the present invention, the resist coating method including the steps of:
providing a silicon wafer, and placing the silicon wafer on a carrying platform and adsorbing and fixing the silicon wafer;
moving the mechanical arm, moving the photoresist nozzle to the position right above the center of the silicon wafer along with the mechanical arm, and dripping the photoresist at the center of the silicon wafer;
if the photoresist dripping is finished, opening an on-off suckback mechanism, wherein the on-off suckback mechanism comprises a suckback component and an adjusting component, and the suckback component sucks back the photoresist;
the monitor monitors a photoresist liquid column in the photoresist nozzle and calculates the distance L between the bottom end of the photoresist liquid column and the outlet of the photoresist nozzle;
when the distance L is larger than or smaller than a preset value, the monitor transmits a signal to a controller, and the controller controls the adjusting assembly to adjust the suck-back amount of the photoresist;
and when the distance L is equal to a preset value, the controller controls the adjusting assembly to stop working.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like parts are designated by like reference numerals throughout the drawings. In the drawings:
FIG. 1 schematically shows a schematic structural diagram of a photoresist suck-back apparatus according to an embodiment of the present invention;
FIG. 2 schematically illustrates an enlarged view of the photoresist nozzle of FIG. 1;
FIG. 3 schematically shows a partial structural view of a resist coating apparatus according to an embodiment of the present invention;
fig. 4 schematically shows a flow chart of a photoresist coating method according to an embodiment of the present invention.
The reference numbers are as follows:
10. a monitor;
20. an on-off suck-back mechanism;
30. a controller;
40. a stage;
51. a mechanical arm; 52. a photoresist pipeline; 53. a photoresist nozzle; 54. a solvent nozzle;
60. a photoresist liquid column;
70. and (3) a silicon wafer.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
It is to be understood that the terminology used herein is for the purpose of describing particular example embodiments only, and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order described or illustrated, unless specifically identified as an order of performance. It should also be understood that additional or alternative steps may be used.
Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
For convenience of description, spatially relative terms, such as "inner", "outer", "lower", "below", "upper", "above", and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Thus, the example term "below … …" can include both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
As shown in fig. 1 to 3, according to an embodiment of the present invention, the present invention provides a photoresist suck back device, which includes a monitor 10, an on-off suck back mechanism 20, and a controller 30, when the photoresist suck back device is used in a photoresist coating apparatus, the monitor 10 is installed on the photoresist coating apparatus for monitoring a photoresist liquid column 60 in a photoresist nozzle 53 of the photoresist coating apparatus; the on-off suck-back mechanism 20 is arranged on a photoresist pipeline 52 of the photoresist coating equipment, and the on-off suck-back mechanism 20 comprises a suck-back component and an adjusting component, wherein the suck-back component is used for sucking back photoresist in the photoresist pipeline 52, and the adjusting component is used for adjusting the suck-back amount of the photoresist in the photoresist pipeline 52 so as to control the position of a photoresist liquid column 60 in a photoresist nozzle 53 communicated with the photoresist pipeline 52; the controller 30 is respectively in signal connection with the monitor 10 and the on-off suck back mechanism 20, and is used for receiving the signal fed back by the monitor 10 and controlling the on-off suck back mechanism 20 to be opened and closed.
The photoresist resorption device provided by the invention utilizes the monitor 10 to monitor the photoresist in the photoresist nozzle 53 of the photoresist coating equipment, the monitor 10 is in signal connection with the controller 30, the data signal obtained by monitoring is fed back to the controller 30 under the set condition, the controller 30 is in signal connection with the on-off resorption mechanism 20, specifically, the controller 30 is in signal connection with the resorption component and the adjusting component respectively, and the adjusting component is controlled to adjust the resorption amount of the photoresist by the controller 30 after the controller 30 receives the signal.
Specifically, the monitor 10 mainly monitors the position of the photoresist in the photoresist nozzle 53, and it should be noted that, as shown in fig. 1 and fig. 2, the photoresist forms a liquid column to be dropped in the photoresist nozzle 53, and the monitor 10 can monitor the distance between the bottom end of the photoresist liquid column 60 and the opening of the photoresist nozzle 53, where the bottom end refers to one end of the photoresist liquid column 60 close to the opening of the photoresist nozzle 53; that is, when the photoresist is sucked back, an air section is formed between the bottom end of the photoresist liquid column 60 and the opening of the photoresist nozzle 53, and the monitor 10 can monitor the length of the air section.
In addition, the monitor 10 may also directly monitor the height of the photoresist liquid column 60 in the photoresist nozzle 53, and determine the distance between the bottom end of the photoresist liquid column 60 and the opening of the photoresist nozzle 53 according to the height.
The monitor 10 may be configured as an apparatus capable of detecting the photoresist content in the photoresist nozzle 53, such as an infrared sensor, a camera, etc., and the monitor 10 is configured as an infrared sensor, for example, the setting conditions in the above embodiment may be configured as: the infrared sensor monitors the photoresist liquid column 60 in the photoresist nozzle 53 in real time, and when the distance between the bottom end of the photoresist liquid column 60 and the opening of the photoresist nozzle 53 is greater than or less than 3mm, the infrared sensor transmits a signal for controlling the operation of the adjusting component in the on-off suck-back mechanism 20 to the controller 30.
As shown in fig. 1 and fig. 2, the on-off suck-back mechanism 20 is installed on the photoresist pipe 52, the suck-back component in the on-off suck-back mechanism 20 is used for sucking back photoresist, and the adjusting component is used for adjusting the suck-back amount of photoresist in the photoresist pipe 52, so that the photoresist in the photoresist nozzle 53 flows, and the distance between the bottom end of the photoresist liquid column 60 and the opening of the photoresist nozzle 53 is changed.
For example, the suck-back assembly may include a solenoid valve, and an overflow valve and a throttle valve connected in series, when the photoresist needs to be sucked back after the dropping process, the internal piston moves upwards after the throttle valve is acted by the pre-tension force of the spring, the internal pressure is reduced, so as to generate a suck-back force to suck back the photoresist in the photoresist pipeline 52. On the basis, when the controller 30 controls the electromagnetic valve to be opened, the suck-back component sucks back the photoresist according to the process; the regulating assembly may be configured as an Automatic suction Valve (Automatic suction Valve).
In summary, the photoresist suck back device provided by the invention is provided with the controller 30, the monitor 10 in signal connection with the controller 30, and the on-off suck back mechanism 20, the monitor 10 is used for monitoring the photoresist in the photoresist nozzle 53, the monitored signal is fed back to the controller 30 under the set condition, and the controller 30 controls the adjusting component in the on-off suck back mechanism 20 to adjust the suck back amount of the photoresist after receiving the signal, so that the suck back amount of the photoresist is accurately controlled, the photoresist is prevented from being condensed or dropped due to the fact that the photoresist is too close to the opening of the photoresist nozzle 53, and the efficiency of the photoresist coating process is improved.
Further, in some possible embodiments, the monitor 10 includes a vision camera capable of photographing, storing and analyzing the object, in this embodiment, the vision camera is disposed near the photoresist nozzle 53, and photographs, stores and analyzes the photoresist liquid column 60 in the photoresist nozzle 53; on the basis, the vision camera is in signal connection with the controller 30, after the vision camera acquires the position image of the photoresist in the photoresist nozzle 53, the image is analyzed and processed, the distance between the bottom end of the photoresist liquid column 60 and the outlet of the photoresist nozzle 53 is calculated, the vision camera can also judge whether the distance meets the set condition that the photoresist needs to be sucked back, and if the distance meets the set condition, a signal is transmitted to the controller 30, so that the controller 30 controls the on-off of the adjusting component in the suck-back mechanism 20 to work.
Specifically, when the distance between the bottom end of the photoresist liquid column 60 and the outlet of the photoresist nozzle 53 is smaller than a preset value, the vision camera transmits a signal to the controller 30, so that the controller 30 controls the operation of the adjusting assembly, and the adjusting assembly increases the suck-back amount of the photoresist until the distance is equal to the preset value; when the distance between the bottom end of the photoresist liquid column 60 and the outlet of the photoresist nozzle 53 is greater than a preset value, the vision camera transmits a signal to the controller 30 so that the controller 30 controls the operation of the adjusting component, and the adjusting component reduces the suck-back amount of the photoresist until the distance is equal to the preset value; the preset value can be set according to actual requirements, for example, the preset value can be set to be 3 mm.
Illustratively, the vision camera performs real-time photographing monitoring on the photoresist liquid column 60 in the photoresist nozzle 53, and performs processing calculation on a position image of the photoresist liquid column 60, and when the distance between the bottom end of the photoresist liquid column 60 and the outlet of the photoresist nozzle 53 is greater than or less than 3mm, the vision camera transmits a signal for controlling the operation of an adjusting component in the on-off suck-back mechanism 20 to the controller 30; accordingly, when the distance between the bottom end of the photoresist liquid column 60 and the outlet of the photoresist nozzle 53 is equal to 3mm, the vision camera transmits a signal for controlling the stopping of the operation of the adjusting component in the on-off suck-back mechanism 20 to the controller 30. From this, the vision camera can realize the real-time supervision to the photoresist in the photoresist nozzle 53 to whether the distance between the bottom of in time discovery photoresist liquid column 60 and the photoresist nozzle 53 opening satisfies the settlement condition, guaranteed that follow-up adjusting part can in time adjust the resorption of photoresist.
Further, the adjusting component in the on-off suck-back mechanism 20 adjusts the suck-back range of the photoresist to be 0-6 mm. It should be noted that the range of the photoresist suck back refers to a range in which the adjusting component can control the movement of the photoresist in the photoresist pipeline 52 when the suck back component in the on-off suck back mechanism 20 sucks back the photoresist, and exemplarily, the photoresist is in a liquid column form in the photoresist pipeline 52, the bottom end of the photoresist liquid column 60 (located in the photoresist nozzle 53 or located in the photoresist pipeline 52) is taken as a reference point, and when the adjusting component adjusts the suck back amount of the photoresist, the distance range in which the reference point moves in the photoresist nozzle 53 is 0-6 mm. Therefore, the adjusting assembly can effectively control the suck-back amount of the photoresist, and the photoresist suck-back effect is guaranteed.
The invention also provides photoresist coating equipment, as shown in fig. 3, the photoresist coating equipment comprises a carrying platform 40, a centrifuge, a photoresist supply device and the photoresist suck-back device, wherein the carrying platform 40 is used for placing and adsorbing and fixing a silicon wafer 70 to be coated; the centrifuge is used for rotating the silicon wafer 70, and in some possible embodiments, the centrifuge is connected to the stage 40 so as to drive the silicon wafer 70 to rotate; the photoresist supply device is used for dripping photoresist on the silicon wafer 70 to be coated, the photoresist supply device comprises a mechanical arm 51, a photoresist pipeline 52 and a photoresist nozzle 53, the photoresist nozzle 53 is communicated with the photoresist pipeline 52, the photoresist nozzle 53 is arranged on the mechanical arm 51, the photoresist nozzle moves above the carrying platform 40 under the driving of the mechanical arm 51, and the photoresist nozzle 53 to be dripped can move right above the center of the silicon wafer 70 along with the mechanical arm 51.
The photoresist resorption device is installed in the photoresist coating equipment, specifically, the monitor 10 in the photoresist resorption device can also be installed on the mechanical arm 51 and is arranged close to the photoresist nozzle 53, and the monitor 10 can be connected to the mechanical arm 51 in a sliding way or fixedly connected to the mechanical arm 51; the on-off suck-back mechanism 20 is disposed on the photoresist pipe 52 and is communicated with the photoresist pipe 52 to adjust the flow rate of photoresist in the photoresist pipe 52.
Further, in the photoresist coating apparatus, the number of the photoresist nozzles 53 is equal to that of the photoresist pipelines 52, a plurality of photoresist nozzles 53 are provided, correspondingly, the number of the photoresist pipelines 52 is also provided, each photoresist nozzle 53 is correspondingly communicated with one photoresist pipeline 52, and each photoresist pipeline 52 is provided with one on-off suck-back mechanism 20 for controlling the flow rate of the photoresist in the photoresist pipeline 52, so that the position of the photoresist in each photoresist nozzle 53 is conveniently controlled.
Further, the resist supply apparatus further includes a solvent nozzle 54, the solvent nozzle 54 being used to contain and spray an organic solvent similar to the thinner component in the photoresist, thereby assisting the flow of the photoresist on the silicon wafer 70; in the present embodiment, the number of the solvent nozzles 54 is one or more, and the solvent nozzles 54 are mounted on the robot arm 51 and can move along with the robot arm 51.
Illustratively, as shown in FIG. 3, the number of solvent nozzles 54 is two, the number of photoresist nozzles 53 is ten, two solvent nozzles 54 are located in the middle of ten photoresist nozzles 53, and during operation, the solvent nozzles 54 and the photoresist nozzles 53 move with the robot arm 51 over the stage 40 on which the silicon wafer 70 is placed.
In addition, please refer to the prior art for other structures of the photoresist coating apparatus provided in the embodiment of the present invention, and the photoresist coating apparatus has the same advantages as the photoresist suck-back device, and is not described herein again.
As shown in fig. 4, the present invention further provides a photoresist coating method, which is implemented by the above photoresist coating apparatus, the photoresist coating method comprising the steps of:
providing a silicon wafer 70, and placing the silicon wafer 70 on the carrying platform 40 and adsorbing and fixing; specifically, the silicon wafer 70 may be fixed on the stage 40 by vacuum suction.
Moving the mechanical arm 51, and dripping the photoresist from the center of the silicon wafer 70 by the photoresist nozzle 53 moving the mechanical arm 51 to the position right above the center of the silicon wafer 70;
if the glue dripping is finished, the on-off suck-back mechanism 20 is opened, the on-off suck-back mechanism 20 comprises a suck-back component and an adjusting component, and the photoresist is sucked back after the suck-back component is opened; as shown in fig. 2, after dropping the photoresist, the photoresist is sucked back by the sucking back assembly, and the bottom end of the photoresist liquid column 60 in the photoresist nozzle 53 moves away from the opening of the photoresist nozzle 53, so as to form an air segment in the photoresist nozzle, that is, a distance L is generated between the bottom end of the photoresist liquid column 60 and the outlet of the photoresist nozzle 53.
The monitor 10 monitors the photoresist liquid column 60 in the photoresist nozzle 53, and calculates the distance L between the bottom end of the photoresist liquid column 60 and the outlet of the photoresist nozzle 53; illustratively, monitor 10 is configured as a vision camera that captures and calculates the distance between the bottom end of the photoresist liquid column 60 within the photoresist nozzle 53 and the exit of the photoresist nozzle 53.
When the monitor 10 monitors that the distance L is greater than or less than a preset value, the monitor 10 transmits a signal to the controller 30, the controller 30 controls an adjusting component in the on-off suckback mechanism 20 to start working, the adjusting component adjusts the suckback amount of the photoresist, and further, the adjusting component adjusts the distance L to the preset value; in this step, the preset value can be set according to actual requirements, and the photoresist in the photoresist nozzle 53 can be prevented from being coagulated or dripping. Illustratively, the preset value may be set to 3 mm.
Illustratively, when the distance L is greater than 3mm, the adjustment assembly reduces the amount of photoresist suck back, causing the photoresist in the photoresist nozzle 53 to move toward the nozzle outlet until the distance L equals 3 mm; when the distance L is less than 3mm, the adjusting assembly increases the suck-back amount of the photoresist, so that the photoresist in the photoresist nozzle 53 moves towards the direction far away from the nozzle outlet until the distance L is equal to 3 mm;
when the distance L is equal to a preset value, the controller 30 controls the adjustment assembly to stop working; it should be noted that, in the present embodiment, the adjusting assembly can not only adjust the suck-back amount of the photoresist in the photoresist pipe 52 and the photoresist nozzle 53, but also adjust the suck-back speed of the photoresist.
After the photoresist is dripped, a centrifugal machine in the photoresist coating equipment is started, the centrifugal machine drives the silicon wafer 70 to rotate, so that the photoresist on the silicon wafer 70 is uniformly diffused to the upper surface of the silicon wafer 70, and the photoresist coating is completed.
According to the photoresist coating method provided by the invention, the monitor 10, the controller 30 and the on-off suck-back mechanism 20 are arranged on the photoresist coating equipment, so that the flow of the photoresist in the photoresist pipeline 52 can be monitored and controlled in real time, the photoresist in the photoresist nozzle 53 is controlled, and the photoresist is prevented from being condensed or dripped.
In the above description, the technical details of patterning, etching, and the like of each layer are not described in detail. It will be appreciated by those skilled in the art that layers, regions, etc. of the desired shape may be formed by various technical means. In addition, in order to form the same structure, those skilled in the art can also design a method which is not exactly the same as the method described above. In addition, although the embodiments are described separately above, this does not mean that the measures in the embodiments cannot be used in advantageous combination.
The embodiments of the present disclosure have been described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. The scope of the disclosure is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of the present disclosure, and such alternatives and modifications are intended to be within the scope of the present disclosure.
Claims (10)
1. A photoresist resorption device for a photoresist coating apparatus, the photoresist resorption device comprising:
the monitor is arranged on the photoresist coating equipment and used for monitoring a photoresist liquid column in a photoresist nozzle in the photoresist coating equipment;
the on-off resorption mechanism is arranged on a photoresist pipeline of the photoresist coating equipment and comprises an resorption component and an adjusting component, the resorption component is used for resorbing photoresist in the photoresist pipeline, and the adjusting component is used for adjusting the resorption amount of the photoresist in the photoresist pipeline so as to control the position of a photoresist liquid column in the photoresist nozzle communicated with the photoresist pipeline;
and the controller is respectively in signal connection with the monitor and the on-off suckback mechanism and is used for receiving the signal fed back by the monitor and controlling the on-off suckback mechanism to be opened and closed.
2. The photoresist suck back device of claim 1, wherein the monitor comprises a vision camera disposed proximate to the photoresist nozzle to capture images of the location of the photoresist within the photoresist nozzle and to calculate the distance between the bottom end of the photoresist liquid column and the outlet of the photoresist nozzle.
3. The photoresist suck-back device of claim 2, wherein the vision camera is in signal connection with the controller, and when the distance between the bottom end of the photoresist liquid column and the outlet of the photoresist nozzle is not equal to a preset value, the vision camera transmits a signal to the controller so that the controller controls the adjusting assembly to adjust the suck-back amount of the photoresist.
4. The photoresist suck back device of claim 1 or 3, wherein the adjusting assembly adjusts the photoresist suck back range to be 0-6 mm.
5. A photoresist coating apparatus, comprising:
the carrying platform is used for placing and adsorbing a silicon wafer to be coated;
a centrifuge for rotating the silicon wafer;
the photoresist supplying device comprises a mechanical arm, a photoresist pipeline and a photoresist nozzle communicated with the photoresist pipeline, and the photoresist nozzle is mounted on the mechanical arm and can move along with the mechanical arm;
the photoresist suck back device of any of claims 1-4, wherein the on-off suck back mechanism is disposed on the photoresist conduit.
6. The photoresist coating apparatus according to claim 5, wherein the number of the photoresist nozzles and the photoresist pipelines is plural, each of the photoresist nozzles is correspondingly communicated with one of the photoresist pipelines, and one of the on-off suck-back mechanisms is disposed on each of the photoresist pipelines.
7. The photoresist coating apparatus of claim 6, wherein the glue supply further comprises at least one solvent nozzle mounted on and movable with the robotic arm.
8. The photoresist coating apparatus of claim 7, wherein the number of the solvent nozzles is two and the number of the photoresist nozzles is ten.
9. A photoresist coating method implemented by the photoresist coating apparatus according to any one of claims 5 to 8, characterized by comprising the steps of:
providing a silicon wafer, and placing the silicon wafer on a carrying platform and adsorbing and fixing the silicon wafer;
moving the mechanical arm, moving the photoresist nozzle to the position right above the center of the silicon wafer along with the mechanical arm, and dripping the photoresist at the center of the silicon wafer;
if the photoresist dripping is finished, opening an on-off suckback mechanism, wherein the on-off suckback mechanism comprises a suckback component and an adjusting component, and the suckback component sucks back the photoresist;
the monitor monitors a photoresist liquid column in the photoresist nozzle and calculates the distance L between the bottom end of the photoresist liquid column and the outlet of the photoresist nozzle;
when the distance L is larger than or smaller than a preset value, the monitor transmits a signal to a controller, and the controller controls the adjusting assembly to adjust the suck-back amount of the photoresist;
and when the distance L is equal to a preset value, the controller controls the adjusting assembly to stop working.
10. The photoresist coating method according to claim 9, wherein the preset value is 3 mm.
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