KR102462049B1 - 고순도 분배 시스템 - Google Patents

고순도 분배 시스템 Download PDF

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Publication number
KR102462049B1
KR102462049B1 KR1020170102403A KR20170102403A KR102462049B1 KR 102462049 B1 KR102462049 B1 KR 102462049B1 KR 1020170102403 A KR1020170102403 A KR 1020170102403A KR 20170102403 A KR20170102403 A KR 20170102403A KR 102462049 B1 KR102462049 B1 KR 102462049B1
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KR
South Korea
Prior art keywords
process fluid
dispensing
bladder
nozzle
fluid
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KR1020170102403A
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English (en)
Korean (ko)
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KR20180018445A (ko
Inventor
안톤 제이. 데빌리어스
로드니 엘 로비슨
데이비드 트라비스
로날드 나스만
제임즈 그루테고드
노만 에이 주니어 재콥슨
데이비드 헤처
리오 훌리
조슈아 에스 후게
Original Assignee
도쿄엘렉트론가부시키가이샤
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Publication of KR20180018445A publication Critical patent/KR20180018445A/ko
Priority to KR1020220009262A priority Critical patent/KR102485546B1/ko
Application granted granted Critical
Publication of KR102462049B1 publication Critical patent/KR102462049B1/ko
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    • H10P76/2042—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/081—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to the weight of a reservoir or container for liquid or other fluent material; responsive to level or volume of liquid or other fluent material in a reservoir or container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/085—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to flow or pressure of liquid or other fluent material to be discharged
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
    • B05B15/557—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids the cleaning fluid being a mixture of gas and liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1047—Apparatus or installations for supplying liquid or other fluent material comprising a buffer container or an accumulator between the supply source and the applicator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H10P14/683—
    • H10P72/0402—
    • H10P72/0404—
    • H10P72/0448—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Reciprocating Pumps (AREA)
  • Optics & Photonics (AREA)
KR1020170102403A 2016-08-11 2017-08-11 고순도 분배 시스템 Active KR102462049B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020220009262A KR102485546B1 (ko) 2016-08-11 2022-01-21 고순도 분배 시스템

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662373729P 2016-08-11 2016-08-11
US62/373,729 2016-08-11

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020220009262A Division KR102485546B1 (ko) 2016-08-11 2022-01-21 고순도 분배 시스템

Publications (2)

Publication Number Publication Date
KR20180018445A KR20180018445A (ko) 2018-02-21
KR102462049B1 true KR102462049B1 (ko) 2022-11-02

Family

ID=61159327

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020170102403A Active KR102462049B1 (ko) 2016-08-11 2017-08-11 고순도 분배 시스템
KR1020220009262A Active KR102485546B1 (ko) 2016-08-11 2022-01-21 고순도 분배 시스템

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020220009262A Active KR102485546B1 (ko) 2016-08-11 2022-01-21 고순도 분배 시스템

Country Status (5)

Country Link
US (1) US10403501B2 (enExample)
JP (1) JP7038505B2 (enExample)
KR (2) KR102462049B1 (enExample)
CN (1) CN107728432A (enExample)
TW (1) TWI723204B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9987655B2 (en) * 2015-06-26 2018-06-05 Tokyo Electron Limited Inline dispense capacitor system
WO2018031896A1 (en) 2016-08-12 2018-02-15 Inpria Corporation Methods of reducing metal residue in edge bead region from metal-containing resists
US10682663B2 (en) * 2018-10-31 2020-06-16 The Boeing Company Methods for dispensing flowable materials
US11383211B2 (en) * 2019-04-29 2022-07-12 Tokyo Electron Limited Point-of-use dynamic concentration delivery system with high flow and high uniformity
KR102768474B1 (ko) * 2019-07-29 2025-02-17 엑스티피엘 에스.에이. 노즐로부터 기재 상으로 금속 나노입자 조성물을 분배하는 방법
AU2020405535A1 (en) * 2019-12-17 2022-08-11 Johnson & Johnson Surgical Vision, Inc. Rotary valve configuration for a surgical cassette
US11666932B2 (en) 2020-03-27 2023-06-06 Wagner Spray Tech Corporation Fluid applicator
JP7603311B2 (ja) * 2020-05-08 2024-12-20 兵神装備株式会社 流動物吐出システム
CN114054287A (zh) * 2020-07-30 2022-02-18 中国科学院微电子研究所 光刻胶回吸装置、光刻胶涂布设备及光刻胶涂布方法
US12216400B2 (en) 2021-01-22 2025-02-04 Tokyo Electron Limited Directed self-assembly
US12533771B2 (en) * 2021-10-21 2026-01-27 Applied Materials, Inc. Polishing slurry dispense nozzle
CN114311949B (zh) * 2022-01-17 2022-08-16 浙江华基环保科技有限公司 一种钢铁厂抗氧化防静电针刺毡的生产方法
TWI792883B (zh) * 2022-01-24 2023-02-11 高科晶捷自動化股份有限公司 塗佈裝置的流體控制結構
KR20240102710A (ko) 2022-12-26 2024-07-03 삼성전자주식회사 포토레지스트 코팅 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101391070B1 (ko) * 2010-09-28 2014-04-30 가부시키가이샤 고가네이 약액 공급 장치
KR101485618B1 (ko) * 2009-07-02 2015-01-22 도쿄엘렉트론가부시키가이샤 도포 장치
US20150209818A1 (en) * 2014-01-26 2015-07-30 Tokyo Electron Limited Inline Dispense Capacitor
JP2016063205A (ja) * 2014-09-22 2016-04-25 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2467150A (en) 1943-11-12 1949-04-12 Carl H Nordell Valve
US2517820A (en) 1948-08-10 1950-08-08 American Cyanamid Co Fluid-pressure controller
BE491946A (enExample) 1949-01-04 1900-01-01
US4195810A (en) 1978-03-31 1980-04-01 Lavin Aaron M Pinch valve
US4442954A (en) 1982-07-30 1984-04-17 National Instrument Company, Inc. Self-pressurizing pinch valve
JPS62121669A (ja) * 1985-11-19 1987-06-02 Toshiba Corp 塗布装置
US5002008A (en) * 1988-05-27 1991-03-26 Tokyo Electron Limited Coating apparatus and method for applying a liquid to a semiconductor wafer, including selecting a nozzle in a stand-by state
JPH01304074A (ja) * 1988-05-31 1989-12-07 Hitachi Electron Eng Co Ltd 高粘度液塗布装置
FR2651552B1 (fr) 1989-09-01 1991-12-06 Cit Alcatel Vanne et dispositifs utilisant ladite vanne.
JPH11186143A (ja) * 1997-12-25 1999-07-09 Nec Corp 塗布装置、滴下装置及び塗布方法
US6478547B1 (en) 1999-10-18 2002-11-12 Integrated Designs L.P. Method and apparatus for dispensing fluids
WO2001097983A1 (en) * 2000-06-19 2001-12-27 Mykrolis Corporation Process and system for determining acceptability of a fluid dispense
JP2002231668A (ja) 2001-01-31 2002-08-16 Mitsubishi Materials Silicon Corp スラリー移送装置
US6568416B2 (en) 2001-02-28 2003-05-27 Brian L. Andersen Fluid flow control system, fluid delivery and control system for a fluid delivery line, and method for controlling pressure oscillations within fluid of a fluid delivery line
CN1561313A (zh) 2001-10-01 2005-01-05 Fsi国际公司 流体分配装置
US7335003B2 (en) 2004-07-09 2008-02-26 Saint-Gobain Performance Plastics Corporation Precision dispense pump
KR100643494B1 (ko) * 2004-10-13 2006-11-10 삼성전자주식회사 반도체 제조용 포토레지스트의 디스펜싱장치
KR20060065188A (ko) 2004-12-10 2006-06-14 삼성전자주식회사 반도체 코팅설비의 포토레지스트 분사장치
US20060174656A1 (en) 2005-02-08 2006-08-10 Owens-Brockway Glass Container Inc. Glassware forming machine with bladder-operated cooling wind valve
JP2006248130A (ja) * 2005-03-14 2006-09-21 Seiko Epson Corp 液滴吐出装置および液滴吐出装置の微振動印加制御方法
JP4606234B2 (ja) * 2005-04-15 2011-01-05 東京エレクトロン株式会社 液処理方法及び液処理装置
JP2006336574A (ja) 2005-06-03 2006-12-14 Anest Iwata Corp 不活性ガス昇圧送給方法および装置
US20080169230A1 (en) 2007-01-12 2008-07-17 Toshiba America Electronic Components, Inc. Pumping and Dispensing System for Coating Semiconductor Wafers
JP5672204B2 (ja) * 2011-09-13 2015-02-18 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
EP2662137A1 (en) * 2012-05-08 2013-11-13 Roche Diagniostics GmbH Dispensing assembly
CN106463357B (zh) * 2014-05-15 2019-06-28 东京毅力科创株式会社 增加光致抗蚀剂分配系统中再循环和过滤的方法和设备
US9987655B2 (en) * 2015-06-26 2018-06-05 Tokyo Electron Limited Inline dispense capacitor system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101485618B1 (ko) * 2009-07-02 2015-01-22 도쿄엘렉트론가부시키가이샤 도포 장치
KR101391070B1 (ko) * 2010-09-28 2014-04-30 가부시키가이샤 고가네이 약액 공급 장치
US20150209818A1 (en) * 2014-01-26 2015-07-30 Tokyo Electron Limited Inline Dispense Capacitor
JP2016063205A (ja) * 2014-09-22 2016-04-25 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置

Also Published As

Publication number Publication date
KR102485546B1 (ko) 2023-01-05
KR20180018445A (ko) 2018-02-21
US20180047562A1 (en) 2018-02-15
TW201816958A (zh) 2018-05-01
TWI723204B (zh) 2021-04-01
JP2018040349A (ja) 2018-03-15
CN107728432A (zh) 2018-02-23
JP7038505B2 (ja) 2022-03-18
US10403501B2 (en) 2019-09-03
KR20220016252A (ko) 2022-02-08

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