CN107728432A - 高纯度分配系统 - Google Patents

高纯度分配系统 Download PDF

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Publication number
CN107728432A
CN107728432A CN201710687322.1A CN201710687322A CN107728432A CN 107728432 A CN107728432 A CN 107728432A CN 201710687322 A CN201710687322 A CN 201710687322A CN 107728432 A CN107728432 A CN 107728432A
Authority
CN
China
Prior art keywords
process fluid
elongated
cryptomere portion
cryptomere
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710687322.1A
Other languages
English (en)
Chinese (zh)
Inventor
安东·J·德维利耶
罗德尼·L·罗宾森
大卫·特拉维斯
罗纳德·纳斯曼
詹姆斯·格罗特格德
小诺曼·A·雅各布森
大卫·黑策
利奥尔·胡利
乔舒亚·S·霍格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN107728432A publication Critical patent/CN107728432A/zh
Pending legal-status Critical Current

Links

Classifications

    • H10P76/2042
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/081Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to the weight of a reservoir or container for liquid or other fluent material; responsive to level or volume of liquid or other fluent material in a reservoir or container
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/085Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to flow or pressure of liquid or other fluent material to be discharged
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B05B15/55Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
    • B05B15/557Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids the cleaning fluid being a mixture of gas and liquid
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B05B9/04Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1047Apparatus or installations for supplying liquid or other fluent material comprising a buffer container or an accumulator between the supply source and the applicator
    • H10P14/683
    • H10P72/0402
    • H10P72/0404
    • H10P72/0448
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Reciprocating Pumps (AREA)
  • Optics & Photonics (AREA)
CN201710687322.1A 2016-08-11 2017-08-11 高纯度分配系统 Pending CN107728432A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662373729P 2016-08-11 2016-08-11
US62/373,729 2016-08-11

Publications (1)

Publication Number Publication Date
CN107728432A true CN107728432A (zh) 2018-02-23

Family

ID=61159327

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710687322.1A Pending CN107728432A (zh) 2016-08-11 2017-08-11 高纯度分配系统

Country Status (5)

Country Link
US (1) US10403501B2 (enExample)
JP (1) JP7038505B2 (enExample)
KR (2) KR102462049B1 (enExample)
CN (1) CN107728432A (enExample)
TW (1) TWI723204B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111112010A (zh) * 2018-10-31 2020-05-08 波音公司 用于分配可流动材料的设备和方法
CN113767338A (zh) * 2019-04-29 2021-12-07 东京毅力科创株式会社 具有高流量和高均匀性的使用点动态浓度输送系统
CN114054287A (zh) * 2020-07-30 2022-02-18 中国科学院微电子研究所 光刻胶回吸装置、光刻胶涂布设备及光刻胶涂布方法

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US9987655B2 (en) * 2015-06-26 2018-06-05 Tokyo Electron Limited Inline dispense capacitor system
WO2018031896A1 (en) 2016-08-12 2018-02-15 Inpria Corporation Methods of reducing metal residue in edge bead region from metal-containing resists
KR102768474B1 (ko) * 2019-07-29 2025-02-17 엑스티피엘 에스.에이. 노즐로부터 기재 상으로 금속 나노입자 조성물을 분배하는 방법
AU2020405535A1 (en) * 2019-12-17 2022-08-11 Johnson & Johnson Surgical Vision, Inc. Rotary valve configuration for a surgical cassette
US11666932B2 (en) 2020-03-27 2023-06-06 Wagner Spray Tech Corporation Fluid applicator
JP7603311B2 (ja) * 2020-05-08 2024-12-20 兵神装備株式会社 流動物吐出システム
US12216400B2 (en) 2021-01-22 2025-02-04 Tokyo Electron Limited Directed self-assembly
US12533771B2 (en) * 2021-10-21 2026-01-27 Applied Materials, Inc. Polishing slurry dispense nozzle
CN114311949B (zh) * 2022-01-17 2022-08-16 浙江华基环保科技有限公司 一种钢铁厂抗氧化防静电针刺毡的生产方法
TWI792883B (zh) * 2022-01-24 2023-02-11 高科晶捷自動化股份有限公司 塗佈裝置的流體控制結構
KR20240102710A (ko) 2022-12-26 2024-07-03 삼성전자주식회사 포토레지스트 코팅 장치

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JPS62121669A (ja) * 1985-11-19 1987-06-02 Toshiba Corp 塗布装置
JP2012071230A (ja) * 2010-09-28 2012-04-12 Koganei Corp 薬液供給装置
JP2013062330A (ja) * 2011-09-13 2013-04-04 Tokyo Electron Ltd 液処理装置、液処理方法及び記憶媒体
US20150209818A1 (en) * 2014-01-26 2015-07-30 Tokyo Electron Limited Inline Dispense Capacitor

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CN106463357B (zh) * 2014-05-15 2019-06-28 东京毅力科创株式会社 增加光致抗蚀剂分配系统中再循环和过滤的方法和设备
JP6420604B2 (ja) * 2014-09-22 2018-11-07 株式会社Screenホールディングス 塗布装置
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Publication number Priority date Publication date Assignee Title
JPS62121669A (ja) * 1985-11-19 1987-06-02 Toshiba Corp 塗布装置
JP2012071230A (ja) * 2010-09-28 2012-04-12 Koganei Corp 薬液供給装置
JP2013062330A (ja) * 2011-09-13 2013-04-04 Tokyo Electron Ltd 液処理装置、液処理方法及び記憶媒体
US20150209818A1 (en) * 2014-01-26 2015-07-30 Tokyo Electron Limited Inline Dispense Capacitor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111112010A (zh) * 2018-10-31 2020-05-08 波音公司 用于分配可流动材料的设备和方法
CN113767338A (zh) * 2019-04-29 2021-12-07 东京毅力科创株式会社 具有高流量和高均匀性的使用点动态浓度输送系统
CN113767338B (zh) * 2019-04-29 2025-03-04 东京毅力科创株式会社 具有高流量和高均匀性的使用点动态浓度输送系统
CN114054287A (zh) * 2020-07-30 2022-02-18 中国科学院微电子研究所 光刻胶回吸装置、光刻胶涂布设备及光刻胶涂布方法

Also Published As

Publication number Publication date
KR102485546B1 (ko) 2023-01-05
KR20180018445A (ko) 2018-02-21
US20180047562A1 (en) 2018-02-15
TW201816958A (zh) 2018-05-01
TWI723204B (zh) 2021-04-01
JP2018040349A (ja) 2018-03-15
KR102462049B1 (ko) 2022-11-02
JP7038505B2 (ja) 2022-03-18
US10403501B2 (en) 2019-09-03
KR20220016252A (ko) 2022-02-08

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PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
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Application publication date: 20180223