JP7038131B2 - 駆動回路基板、及びそれを備える表示装置 - Google Patents
駆動回路基板、及びそれを備える表示装置 Download PDFInfo
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- JP7038131B2 JP7038131B2 JP2019544611A JP2019544611A JP7038131B2 JP 7038131 B2 JP7038131 B2 JP 7038131B2 JP 2019544611 A JP2019544611 A JP 2019544611A JP 2019544611 A JP2019544611 A JP 2019544611A JP 7038131 B2 JP7038131 B2 JP 7038131B2
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- 239000011241 protective layer Substances 0.000 claims description 87
- 238000007689 inspection Methods 0.000 claims description 83
- 239000000758 substrate Substances 0.000 claims description 25
- 239000010409 thin film Substances 0.000 claims description 22
- 239000010410 layer Substances 0.000 claims description 10
- 239000011368 organic material Substances 0.000 claims description 9
- 239000011147 inorganic material Substances 0.000 claims description 6
- 229910010272 inorganic material Inorganic materials 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 230000006378 damage Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
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- 238000002788 crimping Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
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- 239000012790 adhesive layer Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical group 0.000 description 1
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- 229920002457 flexible plastic Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
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- 238000001459 lithography Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/70—Testing, e.g. accelerated lifetime tests
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2825—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere in household appliances or professional audio/video equipment
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
- H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
Description
Claims (8)
- 表示装置(30)に設置される駆動回路基板であって、
基板(100)と、
前記基板(100)に設置される検測回路(200)と、
前記検測回路(200)を覆うように前記検測回路(200)の上面に設置される保護層(300)と、
を含み
前記保護層(300)の上面は、粗い表面領域と、前記粗い表面領域に囲まれ前記上面の中央領域に位置する平坦領域(301)を含み、
前記粗い表面領域は、密集で排列した溝であることを特徴とする駆動回路基板。 - 前記保護層(300)は有機材料で形成されていることを特徴とする請求項1に記載の駆動回路基板。
- 前記基板(100)に設置され平坦層を有する表示領域薄膜トランジスタアレイ(410)をさらに含み、前記保護層(300)が当該表示領域薄膜トランジスタアレイ(410)の平坦層と、一体的に形成されることを特徴とする請求項1又は2に記載の駆動回路基板。
- 前記保護層(300)は無機材料で形成され、及び/又は、前記基板(100)に、少なくとも一つの前記検測回路(200)に隣接する接続ユニット(210)が設置されることを特徴とする請求項1に記載の駆動回路基板。
- 前記基板(100)に、前記保護層(300)を挟んで両側に二つの接続ユニット(210)が設置されていることを特徴とする請求項2又は請求項4に記載の駆動回路基板。
- 前記二つの前記接続ユニット(210)は前記保護層(300)を挟んで両側に対称的に設置されていることを特徴とする請求項5に記載の駆動回路基板。
- 前記基板(100)は、非表示領域(600)及び表示領域(500)を含み、
前記検測回路(200)と接続ユニット(210)は前記非表示領域(600)に配置され、
前記接続ユニット(210)は、前記保護層(300)を挟んで両側に配置されており、
前記二つの接続ユニット(210)から前記保護層(300)の相応する縁までの距離が相等することを特徴とする請求項2又は請求項4に記載の駆動回路基板。 - 非表示領域(600)及び表示領域(500)を含む基板(100)と、
前記基板(100)の前記非表示領域(600)に設置される検測回路(200)と、
前記検測回路(200)を覆うように前記検測回路(200)の上面に設置される保護層(300)と、
前記表示領域(500)に設置される表示領域薄膜トランジスタアレイ(410)と、を備える駆動回路基板を含み、
前記保護層(300)の上面は、粗い表面領域と、前記粗い表面領域に囲まれ前記上面の中央領域に位置する平坦領域(301)を含み、
前記粗い表面領域は、密集で排列した溝であり、
前記検測回路(200)が前記表示領域薄膜トランジスタアレイ(410)に電気的に接続されることを特徴とする表示装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710471810.9A CN109102772B (zh) | 2017-06-20 | 2017-06-20 | 驱动电路板和显示装置 |
CN201710471810.9 | 2017-06-20 | ||
PCT/CN2018/084519 WO2018233374A1 (zh) | 2017-06-20 | 2018-04-25 | 驱动电路板和显示装置 |
Publications (2)
Publication Number | Publication Date |
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JP2020509406A JP2020509406A (ja) | 2020-03-26 |
JP7038131B2 true JP7038131B2 (ja) | 2022-03-17 |
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ID=63960403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2019544611A Active JP7038131B2 (ja) | 2017-06-20 | 2018-04-25 | 駆動回路基板、及びそれを備える表示装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20200105800A1 (ja) |
EP (1) | EP3573046B1 (ja) |
JP (1) | JP7038131B2 (ja) |
KR (1) | KR102230486B1 (ja) |
CN (1) | CN109102772B (ja) |
TW (1) | TWI652829B (ja) |
WO (1) | WO2018233374A1 (ja) |
Cited By (1)
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US8474084B2 (en) | 2007-10-01 | 2013-07-02 | Electronics And Telecommunications Research Institute | System for cleaning surface of solar cell panel |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111180464B (zh) * | 2020-01-03 | 2021-12-03 | 京东方科技集团股份有限公司 | 阵列基板及其制备方法、显示面板和显示装置 |
CN111508399A (zh) * | 2020-05-28 | 2020-08-07 | 霸州市云谷电子科技有限公司 | 一种显示面板及显示装置 |
CN112562512A (zh) * | 2020-12-14 | 2021-03-26 | 信利(惠州)智能显示有限公司 | 显示模组和显示装置 |
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-
2017
- 2017-06-20 CN CN201710471810.9A patent/CN109102772B/zh active Active
-
2018
- 2018-04-25 US US16/326,912 patent/US20200105800A1/en not_active Abandoned
- 2018-04-25 JP JP2019544611A patent/JP7038131B2/ja active Active
- 2018-04-25 WO PCT/CN2018/084519 patent/WO2018233374A1/zh unknown
- 2018-04-25 KR KR1020197024331A patent/KR102230486B1/ko active IP Right Grant
- 2018-04-25 EP EP18819669.5A patent/EP3573046B1/en active Active
- 2018-05-11 TW TW107116048A patent/TWI652829B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000294896A (ja) | 1998-12-21 | 2000-10-20 | Seiko Epson Corp | 回路基板ならびにそれを用いた表示装置および電子機器 |
US20160379906A1 (en) | 2015-06-24 | 2016-12-29 | Lg Display Co., Ltd. | Display device and method of testing the same |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8474084B2 (en) | 2007-10-01 | 2013-07-02 | Electronics And Telecommunications Research Institute | System for cleaning surface of solar cell panel |
Also Published As
Publication number | Publication date |
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JP2020509406A (ja) | 2020-03-26 |
KR20190104417A (ko) | 2019-09-09 |
US20200105800A1 (en) | 2020-04-02 |
TWI652829B (zh) | 2019-03-01 |
CN109102772A (zh) | 2018-12-28 |
TW201830710A (zh) | 2018-08-16 |
KR102230486B1 (ko) | 2021-03-22 |
EP3573046A4 (en) | 2020-04-15 |
EP3573046A1 (en) | 2019-11-27 |
EP3573046B1 (en) | 2022-09-07 |
WO2018233374A1 (zh) | 2018-12-27 |
CN109102772B (zh) | 2023-11-21 |
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