JP7033853B2 - 複合酸化物半導体、およびその作製方法 - Google Patents
複合酸化物半導体、およびその作製方法 Download PDFInfo
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- JP7033853B2 JP7033853B2 JP2017062226A JP2017062226A JP7033853B2 JP 7033853 B2 JP7033853 B2 JP 7033853B2 JP 2017062226 A JP2017062226 A JP 2017062226A JP 2017062226 A JP2017062226 A JP 2017062226A JP 7033853 B2 JP7033853 B2 JP 7033853B2
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- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
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- Thin Film Transistor (AREA)
- Physical Vapour Deposition (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016074493 | 2016-04-01 | ||
| JP2016074493 | 2016-04-01 | ||
| JP2016075853 | 2016-04-05 | ||
| JP2016075853 | 2016-04-05 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019087064A Division JP6656451B2 (ja) | 2016-04-01 | 2019-04-30 | 複合酸化物半導体、半導体装置及び表示装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017188674A JP2017188674A (ja) | 2017-10-12 |
| JP7033853B2 true JP7033853B2 (ja) | 2022-03-11 |
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Family Applications (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017062226A Active JP7033853B2 (ja) | 2016-04-01 | 2017-03-28 | 複合酸化物半導体、およびその作製方法 |
| JP2019087064A Active JP6656451B2 (ja) | 2016-04-01 | 2019-04-30 | 複合酸化物半導体、半導体装置及び表示装置 |
| JP2019229487A Active JP7077294B2 (ja) | 2016-04-01 | 2019-12-19 | 複合酸化物半導体、半導体装置及び表示装置 |
| JP2022081480A Active JP7439163B2 (ja) | 2016-04-01 | 2022-05-18 | 表示装置 |
| JP2024019921A Withdrawn JP2024056861A (ja) | 2016-04-01 | 2024-02-14 | 表示装置 |
| JP2025116691A Pending JP2025142004A (ja) | 2016-04-01 | 2025-07-10 | 複合酸化物半導体 |
Family Applications After (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019087064A Active JP6656451B2 (ja) | 2016-04-01 | 2019-04-30 | 複合酸化物半導体、半導体装置及び表示装置 |
| JP2019229487A Active JP7077294B2 (ja) | 2016-04-01 | 2019-12-19 | 複合酸化物半導体、半導体装置及び表示装置 |
| JP2022081480A Active JP7439163B2 (ja) | 2016-04-01 | 2022-05-18 | 表示装置 |
| JP2024019921A Withdrawn JP2024056861A (ja) | 2016-04-01 | 2024-02-14 | 表示装置 |
| JP2025116691A Pending JP2025142004A (ja) | 2016-04-01 | 2025-07-10 | 複合酸化物半導体 |
Country Status (2)
| Country | Link |
|---|---|
| US (4) | US10388738B2 (https=) |
| JP (6) | JP7033853B2 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6668455B2 (ja) | 2016-04-01 | 2020-03-18 | 株式会社半導体エネルギー研究所 | 酸化物半導体膜の作製方法 |
| US10461197B2 (en) | 2016-06-03 | 2019-10-29 | Semiconductor Energy Laboratory Co., Ltd. | Sputtering target, oxide semiconductor, oxynitride semiconductor, and transistor |
| KR102403389B1 (ko) | 2016-09-12 | 2022-06-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 전자 기기 |
| WO2019226958A1 (en) | 2018-05-24 | 2019-11-28 | The Research Foundation For The State University Of New York | Capacitive sensor |
| TWI777078B (zh) * | 2018-08-01 | 2022-09-11 | 日本商出光興產股份有限公司 | 結晶構造化合物、氧化物燒結體、濺鍍靶材、結晶質氧化物薄膜、非晶質氧化物薄膜、薄膜電晶體、及電子機器 |
| KR102708746B1 (ko) | 2018-12-19 | 2024-09-20 | 엘지디스플레이 주식회사 | 박막 트랜지스터 및 이를 포함하는 표시장치 |
| CN113519065A (zh) * | 2019-03-01 | 2021-10-19 | 株式会社半导体能源研究所 | 半导体装置 |
| JP7461129B2 (ja) * | 2019-10-17 | 2024-04-03 | 株式会社ジャパンディスプレイ | 半導体装置及び半導体装置の製造方法 |
| KR102401939B1 (ko) * | 2020-07-27 | 2022-05-26 | 한양대학교 산학협력단 | 이종 접합 구조의 금속 산화물 반도체층을 갖는 박막 트랜지스터, 이를 포함하는 디스플레이 장치 및 이의 제조방법 |
| CN115117176A (zh) * | 2022-06-30 | 2022-09-27 | 武汉华星光电半导体显示技术有限公司 | 一种薄膜晶体管及其制备方法 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011171727A (ja) | 2010-01-24 | 2011-09-01 | Semiconductor Energy Lab Co Ltd | 表示装置とその作製方法 |
| JP2013009312A (ja) | 2011-05-20 | 2013-01-10 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| JP2013038399A (ja) | 2011-07-08 | 2013-02-21 | Semiconductor Energy Lab Co Ltd | 半導体装置、及び半導体装置の作製方法 |
| JP2014055349A (ja) | 2012-08-10 | 2014-03-27 | Semiconductor Energy Lab Co Ltd | スパッタリングターゲット、およびスパッタリングターゲットの使用方法 |
| JP2014175446A (ja) | 2013-03-08 | 2014-09-22 | Semiconductor Energy Lab Co Ltd | 金属酸化物膜、及び半導体装置 |
| JP2014205902A (ja) | 2012-11-08 | 2014-10-30 | 株式会社半導体エネルギー研究所 | 金属酸化物膜及び金属酸化物膜の成膜方法 |
| JP2015088739A (ja) | 2013-09-25 | 2015-05-07 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US20150243738A1 (en) | 2014-02-21 | 2015-08-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor film, transistor, semiconductor device, display device, and electronic appliance |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009206508A (ja) | 2008-01-31 | 2009-09-10 | Canon Inc | 薄膜トランジスタ及び表示装置 |
| TWI495108B (zh) * | 2008-07-31 | 2015-08-01 | 半導體能源研究所股份有限公司 | 半導體裝置的製造方法 |
| JP2010153802A (ja) | 2008-11-20 | 2010-07-08 | Semiconductor Energy Lab Co Ltd | 半導体装置及び半導体装置の作製方法 |
| JP5328414B2 (ja) | 2009-02-25 | 2013-10-30 | 富士フイルム株式会社 | トップゲート型の電界効果型トランジスタ及びその製造方法並びにそれを備えた表示装置 |
| WO2011043218A1 (en) | 2009-10-09 | 2011-04-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR102220606B1 (ko) * | 2009-11-06 | 2021-03-02 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| KR20140074404A (ko) | 2009-11-20 | 2014-06-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 트랜지스터 |
| CN102668028B (zh) * | 2009-11-28 | 2015-09-02 | 株式会社半导体能源研究所 | 层叠的氧化物材料、半导体器件、以及用于制造该半导体器件的方法 |
| TWI615920B (zh) * | 2010-08-06 | 2018-02-21 | 半導體能源研究所股份有限公司 | 半導體裝置及其製造方法 |
| US8912536B2 (en) * | 2010-11-19 | 2014-12-16 | Samsung Electronics Co., Ltd. | Transistors, methods of manufacturing the same and electronic devices including transistors |
| KR20200052993A (ko) | 2010-12-03 | 2020-05-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 산화물 반도체막 및 반도체 장치 |
| JP5750063B2 (ja) | 2011-02-10 | 2015-07-15 | 株式会社コベルコ科研 | 酸化物焼結体およびスパッタリングターゲット |
| US20140021038A1 (en) * | 2011-03-01 | 2014-01-23 | Sharp Kabushiki Kaisha | Sputtering target, method for manufacturing the same, and method for manufacturing thin film transistor |
| JP6257900B2 (ja) * | 2012-02-23 | 2018-01-10 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP6051960B2 (ja) * | 2012-03-19 | 2016-12-27 | 株式会社リコー | 導電性薄膜、導電性薄膜形成用塗布液、電界効果型トランジスタ、及び電界効果型トランジスタの製造方法 |
| CN107591316B (zh) | 2012-05-31 | 2021-06-08 | 株式会社半导体能源研究所 | 半导体装置 |
| JP5972065B2 (ja) | 2012-06-20 | 2016-08-17 | 富士フイルム株式会社 | 薄膜トランジスタの製造方法 |
| TWI605593B (zh) * | 2012-11-15 | 2017-11-11 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| TWI618252B (zh) | 2013-02-12 | 2018-03-11 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| US9190527B2 (en) | 2013-02-13 | 2015-11-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of semiconductor device |
| US9496330B2 (en) * | 2013-08-02 | 2016-11-15 | Semiconductor Energy Laboratory Co., Ltd. | Oxide semiconductor film and semiconductor device |
| WO2015132697A1 (en) | 2014-03-07 | 2015-09-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP6166207B2 (ja) | 2014-03-28 | 2017-07-19 | 出光興産株式会社 | 酸化物焼結体及びスパッタリングターゲット |
| JP2016100585A (ja) * | 2014-11-26 | 2016-05-30 | 株式会社Joled | 半導体装置およびその製造方法、ならびに表示装置および電子機器 |
| US10684500B2 (en) | 2015-05-27 | 2020-06-16 | Semiconductor Energy Laboratory Co., Ltd. | Touch panel |
| US10139663B2 (en) | 2015-05-29 | 2018-11-27 | Semiconductor Energy Laboratory Co., Ltd. | Input/output device and electronic device |
| KR20160144314A (ko) | 2015-06-08 | 2016-12-16 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 촬상 장치 및 그 동작 방법, 및 전자 기기 |
| JP2017003976A (ja) | 2015-06-15 | 2017-01-05 | 株式会社半導体エネルギー研究所 | 表示装置 |
| WO2016203354A1 (en) | 2015-06-19 | 2016-12-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, manufacturing method thereof, and electronic device |
| US9860465B2 (en) | 2015-06-23 | 2018-01-02 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device and electronic device |
| WO2017149413A1 (en) | 2016-03-04 | 2017-09-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| KR102734238B1 (ko) | 2016-03-04 | 2024-11-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 그 제작 방법, 및 상기 반도체 장치를 포함하는 표시 장치 |
| KR102721654B1 (ko) | 2016-03-11 | 2024-10-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 복합체 및 트랜지스터 |
| US9905579B2 (en) | 2016-03-18 | 2018-02-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the semiconductor device |
| KR102448587B1 (ko) * | 2016-03-22 | 2022-09-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 및 상기 반도체 장치를 포함하는 표시 장치 |
-
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-
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Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011171727A (ja) | 2010-01-24 | 2011-09-01 | Semiconductor Energy Lab Co Ltd | 表示装置とその作製方法 |
| JP2013009312A (ja) | 2011-05-20 | 2013-01-10 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| JP2013038399A (ja) | 2011-07-08 | 2013-02-21 | Semiconductor Energy Lab Co Ltd | 半導体装置、及び半導体装置の作製方法 |
| JP2014055349A (ja) | 2012-08-10 | 2014-03-27 | Semiconductor Energy Lab Co Ltd | スパッタリングターゲット、およびスパッタリングターゲットの使用方法 |
| JP2014205902A (ja) | 2012-11-08 | 2014-10-30 | 株式会社半導体エネルギー研究所 | 金属酸化物膜及び金属酸化物膜の成膜方法 |
| JP2014175446A (ja) | 2013-03-08 | 2014-09-22 | Semiconductor Energy Lab Co Ltd | 金属酸化物膜、及び半導体装置 |
| JP2015088739A (ja) | 2013-09-25 | 2015-05-07 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US20150243738A1 (en) | 2014-02-21 | 2015-08-27 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor film, transistor, semiconductor device, display device, and electronic appliance |
Non-Patent Citations (1)
| Title |
|---|
| C.Revenant, M.Benwadih and M.Maret,Self-organized nanoclusters in solution-processed mesoporous In-Ga-Zn-O thin films,Chemical Communications,vol. 51, Issue 7,Royal Society of Chemistry,2015年01月25日,p.1218-1221 |
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| JP7077294B2 (ja) | 2022-05-30 |
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