JP7030535B2 - パワー半導体装置 - Google Patents

パワー半導体装置 Download PDF

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Publication number
JP7030535B2
JP7030535B2 JP2018005308A JP2018005308A JP7030535B2 JP 7030535 B2 JP7030535 B2 JP 7030535B2 JP 2018005308 A JP2018005308 A JP 2018005308A JP 2018005308 A JP2018005308 A JP 2018005308A JP 7030535 B2 JP7030535 B2 JP 7030535B2
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Japan
Prior art keywords
power semiconductor
conductor
protective film
power
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018005308A
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English (en)
Japanese (ja)
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JP2019125700A5 (https=
JP2019125700A (ja
Inventor
ひろみ 島津
尚史 谷江
晃 松下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Astemo Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Astemo Ltd filed Critical Hitachi Astemo Ltd
Priority to JP2018005308A priority Critical patent/JP7030535B2/ja
Priority to PCT/JP2018/045404 priority patent/WO2019142543A1/ja
Publication of JP2019125700A publication Critical patent/JP2019125700A/ja
Publication of JP2019125700A5 publication Critical patent/JP2019125700A5/ja
Application granted granted Critical
Publication of JP7030535B2 publication Critical patent/JP7030535B2/ja
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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Inverter Devices (AREA)
JP2018005308A 2018-01-17 2018-01-17 パワー半導体装置 Active JP7030535B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018005308A JP7030535B2 (ja) 2018-01-17 2018-01-17 パワー半導体装置
PCT/JP2018/045404 WO2019142543A1 (ja) 2018-01-17 2018-12-11 パワー半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018005308A JP7030535B2 (ja) 2018-01-17 2018-01-17 パワー半導体装置

Publications (3)

Publication Number Publication Date
JP2019125700A JP2019125700A (ja) 2019-07-25
JP2019125700A5 JP2019125700A5 (https=) 2020-08-20
JP7030535B2 true JP7030535B2 (ja) 2022-03-07

Family

ID=67301014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018005308A Active JP7030535B2 (ja) 2018-01-17 2018-01-17 パワー半導体装置

Country Status (2)

Country Link
JP (1) JP7030535B2 (https=)
WO (1) WO2019142543A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7356402B2 (ja) * 2020-05-18 2023-10-04 日立Astemo株式会社 パワーモジュール
JP2023166635A (ja) * 2020-10-01 2023-11-22 京セラドキュメントソリューションズ株式会社 流体冷却式コールドプレート及び流体冷却式コールドプレートの製造方法
JP7554169B2 (ja) * 2021-09-30 2024-09-19 株式会社日立産機システム 電力変換装置
JP2025087361A (ja) * 2023-11-29 2025-06-10 Ａｓｔｅｍｏ株式会社 パワー半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011066377A (ja) 2009-08-18 2011-03-31 Denso Corp 半導体装置およびその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011066377A (ja) 2009-08-18 2011-03-31 Denso Corp 半導体装置およびその製造方法

Also Published As

Publication number Publication date
WO2019142543A1 (ja) 2019-07-25
JP2019125700A (ja) 2019-07-25

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