JP7006610B2 - 接続構造体、回路接続部材及び接着剤組成物 - Google Patents

接続構造体、回路接続部材及び接着剤組成物 Download PDF

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Publication number
JP7006610B2
JP7006610B2 JP2018544726A JP2018544726A JP7006610B2 JP 7006610 B2 JP7006610 B2 JP 7006610B2 JP 2018544726 A JP2018544726 A JP 2018544726A JP 2018544726 A JP2018544726 A JP 2018544726A JP 7006610 B2 JP7006610 B2 JP 7006610B2
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Japan
Prior art keywords
circuit
adhesive composition
connection member
temperature
thermal expansion
Prior art date
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JP2018544726A
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English (en)
Japanese (ja)
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JPWO2018070208A1 (ja
Inventor
智樹 森尻
雅英 久米
勝 田中
潤 竹田津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
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Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2018070208A1 publication Critical patent/JPWO2018070208A1/ja
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • C09J175/14Polyurethanes having carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2018544726A 2016-10-11 2017-09-21 接続構造体、回路接続部材及び接着剤組成物 Active JP7006610B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016200072 2016-10-11
JP2016200072 2016-10-11
PCT/JP2017/034153 WO2018070208A1 (ja) 2016-10-11 2017-09-21 接続構造体、回路接続部材及び接着剤組成物

Publications (2)

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JPWO2018070208A1 JPWO2018070208A1 (ja) 2019-08-08
JP7006610B2 true JP7006610B2 (ja) 2022-01-24

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JP2018544726A Active JP7006610B2 (ja) 2016-10-11 2017-09-21 接続構造体、回路接続部材及び接着剤組成物

Country Status (5)

Country Link
JP (1) JP7006610B2 (zh)
KR (3) KR20220107095A (zh)
CN (3) CN113571926A (zh)
TW (2) TWI763551B (zh)
WO (1) WO2018070208A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7419697B2 (ja) * 2019-08-01 2024-01-23 株式会社オートネットワーク技術研究所 ワイヤーハーネス

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5552092A (en) 1994-05-31 1996-09-03 Corning Incorporated Waveguide coupler
JP2013231097A (ja) 2012-04-27 2013-11-14 Hitachi Chemical Co Ltd 回路接続材料、フィルム状回路接続材料、回路接続シート、回路接続体及び回路部材の接続方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0323959A (ja) * 1989-06-22 1991-01-31 Mitsubishi Electric Corp Ledアレイプリントヘッド
US5783867A (en) * 1995-11-06 1998-07-21 Ford Motor Company Repairable flip-chip undercoating assembly and method and material for same
JP4151081B2 (ja) * 1997-03-07 2008-09-17 日立化成工業株式会社 回路部材接続用接着剤
JP2003017149A (ja) * 2001-06-29 2003-01-17 Matsushita Electric Ind Co Ltd 電気接続部材とそれを用いた電気部品
JP4649815B2 (ja) 2002-03-27 2011-03-16 日立化成工業株式会社 回路接続用接着剤組成物及びそれを用いた回路接続構造体
JP3858740B2 (ja) 2002-03-27 2006-12-20 日立化成工業株式会社 回路接続用接着剤組成物及びそれを用いた回路接続構造体
US7790276B2 (en) * 2006-03-31 2010-09-07 E. I. Du Pont De Nemours And Company Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto
JP5387592B2 (ja) * 2011-02-07 2014-01-15 日立化成株式会社 回路接続材料、及び回路部材の接続構造の製造方法
JP5934528B2 (ja) 2012-03-12 2016-06-15 デクセリアルズ株式会社 回路接続材料、及びそれを用いた実装体の製造方法
KR101350997B1 (ko) * 2012-08-21 2014-01-14 주식회사 신아티앤씨 전기적 특성이 우수한 에폭시 화합물 및 그 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5552092A (en) 1994-05-31 1996-09-03 Corning Incorporated Waveguide coupler
JP2013231097A (ja) 2012-04-27 2013-11-14 Hitachi Chemical Co Ltd 回路接続材料、フィルム状回路接続材料、回路接続シート、回路接続体及び回路部材の接続方法

Also Published As

Publication number Publication date
CN113555703A (zh) 2021-10-26
JPWO2018070208A1 (ja) 2019-08-08
TWI763551B (zh) 2022-05-01
KR20220107095A (ko) 2022-08-01
CN109804508B (zh) 2021-08-03
KR20190058614A (ko) 2019-05-29
KR102467385B1 (ko) 2022-11-14
CN113571926A (zh) 2021-10-29
TW201816904A (zh) 2018-05-01
CN109804508A (zh) 2019-05-24
WO2018070208A1 (ja) 2018-04-19
TW202139310A (zh) 2021-10-16
KR20240014613A (ko) 2024-02-01
TWI734841B (zh) 2021-08-01

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