JP7001773B2 - 垂直型テスト装置及びそのシート状プローブ - Google Patents

垂直型テスト装置及びそのシート状プローブ Download PDF

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Publication number
JP7001773B2
JP7001773B2 JP2020129095A JP2020129095A JP7001773B2 JP 7001773 B2 JP7001773 B2 JP 7001773B2 JP 2020129095 A JP2020129095 A JP 2020129095A JP 2020129095 A JP2020129095 A JP 2020129095A JP 7001773 B2 JP7001773 B2 JP 7001773B2
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Japan
Prior art keywords
sheet
substrate element
sheet body
contact portion
advancing
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Japanese (ja)
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JP2021177160A (ja
Inventor
文聰 李
遜泰 魏
曉剛 李
亘生 丁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chunghwa Precision Test Technology Co Ltd
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Chunghwa Precision Test Technology Co Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
JP2020129095A 2020-05-08 2020-07-30 垂直型テスト装置及びそのシート状プローブ Active JP7001773B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW109115299 2020-05-08
TW109115299A TWI737291B (zh) 2020-05-08 2020-05-08 垂直式測試裝置

Publications (2)

Publication Number Publication Date
JP2021177160A JP2021177160A (ja) 2021-11-11
JP7001773B2 true JP7001773B2 (ja) 2022-02-10

Family

ID=78283314

Family Applications (1)

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JP2020129095A Active JP7001773B2 (ja) 2020-05-08 2020-07-30 垂直型テスト装置及びそのシート状プローブ

Country Status (3)

Country Link
JP (1) JP7001773B2 (zh)
KR (1) KR102387109B1 (zh)
TW (1) TWI737291B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240055555A (ko) * 2022-10-20 2024-04-29 주식회사 에이엠에스티 프로브 카드 제작 방법

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020155735A1 (en) 2000-02-14 2002-10-24 Yu Zhou Contact structure and production method thereof and probe contact assembly using same
US20060066328A1 (en) 2004-09-30 2006-03-30 Probelogic, Inc. Buckling beam probe test assembly
JP2006284297A (ja) 2005-03-31 2006-10-19 Kanai Hiroaki コンタクトプローブ構造体の製造方法
US20090102495A1 (en) 2007-10-19 2009-04-23 January Kister Vertical guided probe array providing sideways scrub motion
US20140352460A1 (en) 2013-06-03 2014-12-04 Mpi Corporation Probe Needle and Probe Module Using the Same
JP2017122686A (ja) 2016-01-08 2017-07-13 株式会社日本マイクロニクス プローブ、プローブカード及び接触検査装置
JP2018513389A (ja) 2015-03-13 2018-05-24 テクノプローベ エス．ピー．エー． 様々な動作状態での試験ヘッドでのプローブ保持を適正化し、各々のガイドホールでのスライドを改善するバーチカルプローブをもつ試験ヘッド
US20190041430A1 (en) 2017-08-04 2019-02-07 Leeno Industrial Inc. Test device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5977787A (en) * 1997-06-16 1999-11-02 International Business Machines Corporation Large area multiple-chip probe assembly and method of making the same
JPH11233216A (ja) * 1998-02-16 1999-08-27 Nippon Denki Factory Engineering Kk テスト用ｉｃソケット
CN101395481B (zh) * 2006-03-03 2012-07-18 日本发条株式会社 导电性接触器单元
KR100927157B1 (ko) * 2009-02-26 2009-11-18 (주)기가레인 프로브블록
KR101519529B1 (ko) * 2013-09-13 2015-05-13 (주) 루켄테크놀러지스 수직형 프로브 유닛 블록
TW201537181A (zh) * 2014-03-25 2015-10-01 Mpi Corp 垂直式探針裝置及使用於該垂直式探針裝置之支撐柱
TW201623976A (zh) * 2014-12-24 2016-07-01 Mpi Corp 具有定位片之垂直式探針裝置
JP6515877B2 (ja) * 2016-06-17 2019-05-22 オムロン株式会社 プローブピン
KR101869044B1 (ko) * 2016-11-10 2018-07-19 윌테크놀러지(주) 스크럽 현상이 저감된 수직형 프로브 카드용 니들유닛 및 이를 이용한 프로브 카드
KR101845652B1 (ko) 2017-01-17 2018-04-04 주식회사 텝스 부품 실장된 웨이퍼 테스트를 위한 하이브리드 프로브 카드
KR101962644B1 (ko) * 2017-08-23 2019-03-28 리노공업주식회사 검사프로브 및 이를 사용한 검사장치
KR101913355B1 (ko) 2017-09-19 2018-12-28 윌테크놀러지(주) 미세피치 대응이 가능한 수직형 프로브 카드용 니들유닛 및 이를 이용한 프로브 카드
TWI638168B (zh) * 2018-04-03 2018-10-11 中華精測科技股份有限公司 探針卡裝置及探針座
KR102145398B1 (ko) 2020-07-09 2020-08-19 피엠피(주) 수직형 프로브 핀 및 이를 구비한 프로브 카드

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020155735A1 (en) 2000-02-14 2002-10-24 Yu Zhou Contact structure and production method thereof and probe contact assembly using same
US20060066328A1 (en) 2004-09-30 2006-03-30 Probelogic, Inc. Buckling beam probe test assembly
JP2006284297A (ja) 2005-03-31 2006-10-19 Kanai Hiroaki コンタクトプローブ構造体の製造方法
US20090102495A1 (en) 2007-10-19 2009-04-23 January Kister Vertical guided probe array providing sideways scrub motion
US20140352460A1 (en) 2013-06-03 2014-12-04 Mpi Corporation Probe Needle and Probe Module Using the Same
JP2018513389A (ja) 2015-03-13 2018-05-24 テクノプローベ エス．ピー．エー． 様々な動作状態での試験ヘッドでのプローブ保持を適正化し、各々のガイドホールでのスライドを改善するバーチカルプローブをもつ試験ヘッド
JP2017122686A (ja) 2016-01-08 2017-07-13 株式会社日本マイクロニクス プローブ、プローブカード及び接触検査装置
US20190041430A1 (en) 2017-08-04 2019-02-07 Leeno Industrial Inc. Test device

Also Published As

Publication number Publication date
TW202142871A (zh) 2021-11-16
KR102387109B1 (ko) 2022-04-14
KR20210137364A (ko) 2021-11-17
TWI737291B (zh) 2021-08-21
JP2021177160A (ja) 2021-11-11

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