JP6989507B2 - ヒートシンク - Google Patents

ヒートシンク Download PDF

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Publication number
JP6989507B2
JP6989507B2 JP2018537215A JP2018537215A JP6989507B2 JP 6989507 B2 JP6989507 B2 JP 6989507B2 JP 2018537215 A JP2018537215 A JP 2018537215A JP 2018537215 A JP2018537215 A JP 2018537215A JP 6989507 B2 JP6989507 B2 JP 6989507B2
Authority
JP
Japan
Prior art keywords
heat
base plate
heat sink
heat pipe
thermally connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018537215A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2018043312A1 (ja
Inventor
泰博 内村
敬大 片山
剛一 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Publication of JPWO2018043312A1 publication Critical patent/JPWO2018043312A1/ja
Application granted granted Critical
Publication of JP6989507B2 publication Critical patent/JP6989507B2/ja
Active legal-status Critical Current
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2018537215A 2016-08-29 2017-08-25 ヒートシンク Active JP6989507B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016167130 2016-08-29
JP2016167130 2016-08-29
PCT/JP2017/030450 WO2018043312A1 (ja) 2016-08-29 2017-08-25 ヒートシンク

Publications (2)

Publication Number Publication Date
JPWO2018043312A1 JPWO2018043312A1 (ja) 2019-06-24
JP6989507B2 true JP6989507B2 (ja) 2022-01-05

Family

ID=61305209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018537215A Active JP6989507B2 (ja) 2016-08-29 2017-08-25 ヒートシンク

Country Status (3)

Country Link
JP (1) JP6989507B2 (zh)
TW (1) TWI719244B (zh)
WO (1) WO2018043312A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10677535B1 (en) 2018-11-30 2020-06-09 Furukawa Electric Co., Ltd. Heat sink
JP6582114B1 (ja) * 2018-11-30 2019-09-25 古河電気工業株式会社 ヒートシンク

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW592279U (en) * 2001-11-09 2004-06-11 Ind Tech Res Inst Photo-electric illumination module
JP3146239U (ja) * 2008-08-28 2008-11-06 奇宏電子深▲しん▼有限公司 Ｌｅｄの放熱装置
US7909489B2 (en) * 2009-03-09 2011-03-22 Cpumate Inc LED road lamp holder structure
US7674012B1 (en) * 2009-04-17 2010-03-09 Cpumate Inc. LED lighting device capable of uniformly dissipating heat
WO2012168845A1 (en) * 2011-06-06 2012-12-13 Koninklijke Philips Electronics N.V. Remote heat sink
JP2015125871A (ja) * 2013-12-26 2015-07-06 コイト電工株式会社 照明装置
JP6372845B2 (ja) * 2014-01-16 2018-08-15 国立大学法人 鹿児島大学 ヒートシンク
JP6293504B2 (ja) * 2014-01-31 2018-03-14 コイト電工株式会社 照明装置
JP2015153706A (ja) * 2014-02-18 2015-08-24 株式会社東芝 照明装置

Also Published As

Publication number Publication date
TWI719244B (zh) 2021-02-21
WO2018043312A1 (ja) 2018-03-08
JPWO2018043312A1 (ja) 2019-06-24
TW201812213A (zh) 2018-04-01

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