JP6989410B2 - 樹脂モールド装置 - Google Patents

樹脂モールド装置 Download PDF

Info

Publication number
JP6989410B2
JP6989410B2 JP2018025728A JP2018025728A JP6989410B2 JP 6989410 B2 JP6989410 B2 JP 6989410B2 JP 2018025728 A JP2018025728 A JP 2018025728A JP 2018025728 A JP2018025728 A JP 2018025728A JP 6989410 B2 JP6989410 B2 JP 6989410B2
Authority
JP
Japan
Prior art keywords
work
mold
resin
film
supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018025728A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019145549A (ja
JP2019145549A5 (enExample
Inventor
和広 鈴木
良尚 轟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apic Yamada Corp
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Priority to JP2018025728A priority Critical patent/JP6989410B2/ja
Priority to TW107144278A priority patent/TWI787411B/zh
Priority to CN201910117010.6A priority patent/CN110154300B/zh
Priority to KR1020190018210A priority patent/KR102521504B1/ko
Publication of JP2019145549A publication Critical patent/JP2019145549A/ja
Publication of JP2019145549A5 publication Critical patent/JP2019145549A5/ja
Application granted granted Critical
Publication of JP6989410B2 publication Critical patent/JP6989410B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2018025728A 2018-02-16 2018-02-16 樹脂モールド装置 Active JP6989410B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018025728A JP6989410B2 (ja) 2018-02-16 2018-02-16 樹脂モールド装置
TW107144278A TWI787411B (zh) 2018-02-16 2018-12-10 樹脂模製裝置
CN201910117010.6A CN110154300B (zh) 2018-02-16 2019-02-15 树脂模制装置以及树脂模制方法
KR1020190018210A KR102521504B1 (ko) 2018-02-16 2019-02-15 수지 몰드 장치 및 수지 몰드 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018025728A JP6989410B2 (ja) 2018-02-16 2018-02-16 樹脂モールド装置

Publications (3)

Publication Number Publication Date
JP2019145549A JP2019145549A (ja) 2019-08-29
JP2019145549A5 JP2019145549A5 (enExample) 2021-02-25
JP6989410B2 true JP6989410B2 (ja) 2022-01-05

Family

ID=67773949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018025728A Active JP6989410B2 (ja) 2018-02-16 2018-02-16 樹脂モールド装置

Country Status (1)

Country Link
JP (1) JP6989410B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7312452B2 (ja) * 2020-01-24 2023-07-21 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法
JP7444453B2 (ja) * 2020-11-25 2024-03-06 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4886344B2 (ja) * 2006-04-11 2012-02-29 Ｔｏｗａ株式会社 電子部品の樹脂封止成形装置
JP2012020446A (ja) * 2010-07-13 2012-02-02 Apic Yamada Corp 樹脂モールド装置
SG11201402077UA (en) * 2011-11-08 2014-09-26 Apic Yamada Corp Resin molding apparatus

Also Published As

Publication number Publication date
JP2019145549A (ja) 2019-08-29

Similar Documents

Publication Publication Date Title
JP7088687B2 (ja) 樹脂モールド装置及び樹脂モールド方法
JP6989409B2 (ja) 樹脂モールド装置及び樹脂モールド方法
KR102521504B1 (ko) 수지 몰드 장치 및 수지 몰드 방법
TWI814088B (zh) 樹脂密封裝置及樹脂密封方法
KR20160013202A (ko) 수지 몰드 장치 및 수지 몰드 방법
JP2014231185A (ja) 樹脂モールド装置および樹脂モールド方法
JP7203414B2 (ja) 樹脂供給取出装置、ワーク搬送装置及び樹脂モールド装置
JP6936177B2 (ja) 樹脂モールド装置
JP6989410B2 (ja) 樹脂モールド装置
TWI786515B (zh) 樹脂模製裝置及樹脂模製方法
JP2023062616A (ja) 樹脂封止装置及び樹脂封止方法
JP4235623B2 (ja) 樹脂封止装置
WO2022254776A1 (ja) 樹脂封止装置及び樹脂封止方法
JP7312452B2 (ja) 樹脂モールド装置及び樹脂モールド方法
WO2023053629A1 (ja) 樹脂封止装置及び樹脂封止方法
TWI783882B (zh) 壓縮成形裝置以及壓縮成形方法
TWI853274B (zh) 壓縮成形裝置
JP2005238652A (ja) 樹脂成形装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210112

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210112

TRDD Decision of grant or rejection written
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20211118

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20211130

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20211202

R150 Certificate of patent or registration of utility model

Ref document number: 6989410

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250