JP2019145549A5 - - Google Patents

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Publication number
JP2019145549A5
JP2019145549A5 JP2018025728A JP2018025728A JP2019145549A5 JP 2019145549 A5 JP2019145549 A5 JP 2019145549A5 JP 2018025728 A JP2018025728 A JP 2018025728A JP 2018025728 A JP2018025728 A JP 2018025728A JP 2019145549 A5 JP2019145549 A5 JP 2019145549A5
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JP
Japan
Prior art keywords
holding portion
transport tool
holding
state
transport
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JP2018025728A
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English (en)
Japanese (ja)
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JP2019145549A (ja
JP6989410B2 (ja
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Priority to JP2018025728A priority Critical patent/JP6989410B2/ja
Priority claimed from JP2018025728A external-priority patent/JP6989410B2/ja
Priority to TW107144278A priority patent/TWI787411B/zh
Priority to CN201910117010.6A priority patent/CN110154300B/zh
Priority to KR1020190018210A priority patent/KR102521504B1/ko
Publication of JP2019145549A publication Critical patent/JP2019145549A/ja
Publication of JP2019145549A5 publication Critical patent/JP2019145549A5/ja
Application granted granted Critical
Publication of JP6989410B2 publication Critical patent/JP6989410B2/ja
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JP2018025728A 2018-02-16 2018-02-16 樹脂モールド装置 Active JP6989410B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018025728A JP6989410B2 (ja) 2018-02-16 2018-02-16 樹脂モールド装置
TW107144278A TWI787411B (zh) 2018-02-16 2018-12-10 樹脂模製裝置
CN201910117010.6A CN110154300B (zh) 2018-02-16 2019-02-15 树脂模制装置以及树脂模制方法
KR1020190018210A KR102521504B1 (ko) 2018-02-16 2019-02-15 수지 몰드 장치 및 수지 몰드 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018025728A JP6989410B2 (ja) 2018-02-16 2018-02-16 樹脂モールド装置

Publications (3)

Publication Number Publication Date
JP2019145549A JP2019145549A (ja) 2019-08-29
JP2019145549A5 true JP2019145549A5 (enExample) 2021-02-25
JP6989410B2 JP6989410B2 (ja) 2022-01-05

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ID=67773949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018025728A Active JP6989410B2 (ja) 2018-02-16 2018-02-16 樹脂モールド装置

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JP (1) JP6989410B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7312452B2 (ja) * 2020-01-24 2023-07-21 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法
JP7444453B2 (ja) * 2020-11-25 2024-03-06 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4886344B2 (ja) * 2006-04-11 2012-02-29 Ｔｏｗａ株式会社 電子部品の樹脂封止成形装置
JP2012020446A (ja) * 2010-07-13 2012-02-02 Apic Yamada Corp 樹脂モールド装置
WO2013069496A1 (ja) * 2011-11-08 2013-05-16 アピックヤマダ株式会社 樹脂封止装置

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