JP6985031B2 - Ｌｅｄディスプレーパネルの製造方法 - Google Patents

Ｌｅｄディスプレーパネルの製造方法 Download PDF

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Publication number
JP6985031B2
JP6985031B2 JP2017099602A JP2017099602A JP6985031B2 JP 6985031 B2 JP6985031 B2 JP 6985031B2 JP 2017099602 A JP2017099602 A JP 2017099602A JP 2017099602 A JP2017099602 A JP 2017099602A JP 6985031 B2 JP6985031 B2 JP 6985031B2
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Japan
Prior art keywords
led
display substrate
electrode
wafer
display
Prior art date
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Active
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JP2017099602A
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English (en)
Japanese (ja)
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JP2018194718A (ja
Inventor
一馬 関家
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
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Disco Corp
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Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2017099602A priority Critical patent/JP6985031B2/ja
Priority to TW107112490A priority patent/TWI776880B/zh
Priority to CN201810453947.6A priority patent/CN108962916B/zh
Publication of JP2018194718A publication Critical patent/JP2018194718A/ja
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Publication of JP6985031B2 publication Critical patent/JP6985031B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Laser Beam Processing (AREA)
  • Led Devices (AREA)
JP2017099602A 2017-05-19 2017-05-19 Ｌｅｄディスプレーパネルの製造方法 Active JP6985031B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017099602A JP6985031B2 (ja) 2017-05-19 2017-05-19 Ｌｅｄディスプレーパネルの製造方法
TW107112490A TWI776880B (zh) 2017-05-19 2018-04-12 Ｌｅｄ顯示器面板的製造方法
CN201810453947.6A CN108962916B (zh) 2017-05-19 2018-05-14 Led显示面板的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017099602A JP6985031B2 (ja) 2017-05-19 2017-05-19 Ｌｅｄディスプレーパネルの製造方法

Publications (2)

Publication Number Publication Date
JP2018194718A JP2018194718A (ja) 2018-12-06
JP6985031B2 true JP6985031B2 (ja) 2021-12-22

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Family Applications (1)

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JP2017099602A Active JP6985031B2 (ja) 2017-05-19 2017-05-19 Ｌｅｄディスプレーパネルの製造方法

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JP (1) JP6985031B2 (zh)
CN (1) CN108962916B (zh)
TW (1) TWI776880B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7333192B2 (ja) * 2019-04-23 2023-08-24 株式会社ディスコ 移設方法
JP7199307B2 (ja) * 2019-05-24 2023-01-05 株式会社ディスコ 移設方法
JP2021012936A (ja) * 2019-07-05 2021-02-04 株式会社ディスコ 光デバイスの移設方法
JP7289744B2 (ja) * 2019-07-11 2023-06-12 株式会社ジャパンディスプレイ 表示装置、及びその製造方法
TWI727428B (zh) * 2019-09-20 2021-05-11 東貝光電科技股份有限公司 微型led面板之製造方法及其微型led面板
JP2022164272A (ja) 2021-04-16 2022-10-27 株式会社ディスコ Ｌｅｄディスプレイパネルの製造方法
JP2023109616A (ja) 2022-01-27 2023-08-08 株式会社ディスコ ウエーハの製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60103328A (ja) * 1983-11-10 1985-06-07 Sanyo Electric Co Ltd 液晶表示板の電極接続方法
JP2002314053A (ja) * 2001-04-19 2002-10-25 Sony Corp チップ部品の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
FI123860B (fi) * 2010-05-18 2013-11-29 Corelase Oy Menetelmä substraattien tiivistämiseksi ja kontaktoimiseksi laservalon avulla ja elektroniikkamoduli
DE112012004373T5 (de) * 2011-10-18 2014-07-10 Fuji Electric Co., Ltd Verfahren zur trennung eines trägersubstrats von einem festphasengebundenen wafer und verfahren zur herstellung einer halbleitervorrichtung
JP5878330B2 (ja) * 2011-10-18 2016-03-08 株式会社ディスコ レーザー光線の出力設定方法およびレーザー加工装置
US9159700B2 (en) * 2012-12-10 2015-10-13 LuxVue Technology Corporation Active matrix emissive micro LED display
JP2015144192A (ja) * 2014-01-31 2015-08-06 株式会社ディスコ リフトオフ方法
WO2016100657A2 (en) * 2014-12-19 2016-06-23 Glo Ab Method of making a light emitting diode array on a backplane
US10224308B2 (en) * 2015-07-14 2019-03-05 Goertek, Inc. Transferring method, manufacturing method, device and electronic apparatus of micro-LED
TWI756384B (zh) * 2017-03-16 2022-03-01 美商康寧公司 用於大量轉移微型led的方法及製程

Also Published As

Publication number Publication date
CN108962916B (zh) 2024-03-01
JP2018194718A (ja) 2018-12-06
TWI776880B (zh) 2022-09-11
CN108962916A (zh) 2018-12-07
TW201901255A (zh) 2019-01-01

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