JP6973727B2 - 電子装置 - Google Patents
電子装置 Download PDFInfo
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- JP6973727B2 JP6973727B2 JP2017049556A JP2017049556A JP6973727B2 JP 6973727 B2 JP6973727 B2 JP 6973727B2 JP 2017049556 A JP2017049556 A JP 2017049556A JP 2017049556 A JP2017049556 A JP 2017049556A JP 6973727 B2 JP6973727 B2 JP 6973727B2
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Description
図1〜図13を用いて、第1実施形態について説明する。
図14を用いて、第2実施形態について説明する。
図15を用いて、第3実施形態について説明する。
[付記1]
基材と、
前記基材に形成された配線パターンと、
前記配線パターンに配置された電子素子と、
前記電子素子および前記配線パターンの間に介在する接合層と、を備え、
前記配線パターンには、開口部が形成され、前記接合層は、前記基材のうち前記配線パターンにおける前記開口部に露出した部位に接している、電子装置。
[付記2]
前記配線パターンは、前記電子素子が配置されたダイパッド部を含み、
前記ダイパッド部の一部は、前記開口部を構成しており、
前記接合層は、前記ダイパッド部に接する、付記1に記載の電子装置。
[付記3]
前記ダイパッド部は、前記基材の厚さ方向に交差する方向を向く第1内側面を含み、前記第1内側面は、前記開口部の一部を規定しており、前記接合層は、前記第1内側面に接する、付記2に記載の電子装置。
[付記4]
前記配線パターンは、第1導電部を含み、前記開口部は、前記基材の厚さ方向視において、前記第1導電部および前記ダイパッド部の間に位置する、付記3に記載の電子装置。
[付記5]
前記第1導電部は、前記第1内側面に対向する第2内側面を含み、前記接合層は、前記第2内側面に接する、付記4に記載の電子装置。
[付記6]
前記第1導電部は、前記基材の厚さ方向を向く表面を有し、前記第1導電部の前記表面は、前記接合層に接する接触部位を含む、付記4または付記5に記載の電子装置。
[付記7]
前記第1導電部の前記表面は、前記接合層から露出している露出部位を含み、
前記接触部位は、前記基材の厚さ方向視において、前記露出部位と前記開口部との間に位置する、付記6に記載の電子装置。
[付記8]
前記第1導電部は、前記ダイパッド部を囲む環状である、付記4ないし付記7のいずれかに記載の電子装置。
[付記9]
前記配線パターンは、前記ダイパッド部および前記第1導電部のいずれにもつながる少なくとも1つの第2導電部を含み、前記少なくとも1つの第2導電部は各々、前記ダイパッド部および前記第1導電部の間に位置し、
前記少なくとも1つの第2導電部のいずれか1つの一部は、前記開口部を構成しており、
前記接合層は、前記少なくとも1つの第2導電部に接している、付記4に記載の電子装置。
[付記10]
前記少なくとも1つの第2導電部は各々、前記基材の厚さ方向視において、前記ダイパッド部から前記第1導電部に向かって延びており、
前記少なくとも1つの第2導電部は、前記基材の厚さ方向を向く表面を有し、前記少なくとも1つの第2導電部における前記表面は、前記接合層に接している、付記9に記載の電子装置。
[付記11]
前記ダイパッド部は、前記ダイパッド部において前記基材の厚さ方向視にて互いに反対側に位置する第1端縁および第2端縁を含み、
前記少なくとも1つの第2導電部の幅は、前記第1端縁および前記第2端縁の離間距離よりも、小さい、付記10に記載の電子装置。
[付記12]
前記電子素子は、光学素子あるいはツェナーダイオードである、付記1ないし付記11のいずれかに記載の電子装置。
[付記13]
前記電子素子にボンディングされたワイヤを更に備え、
前記配線パターンは、前記ワイヤがボンディングされたワイヤボンディングパッド部を含む、付記4に記載の電子装置。
[付記14]
前記基材は、互いに反対側を向く主面および裏面を含み、
前記電子素子は、前記主面側に配置されており、
前記配線パターンは、前記主面および前記裏面に形成されている、付記13に記載の電子装置。
[付記15]
前記基材は、前記基材の厚さ方向に直交する方向を向く第1側面および第2側面を含み、前記第1側面および前記第2側面は、互いに反対側を向き、
前記基材には、前記第1側面から凹む第1凹部と、前記第2側面から凹む第2凹部と、が形成され、
前記配線パターンは、第1連絡部と、第2連絡部と、第1端縁部と、第2端縁部と、第1側面部と、第2側面部と、を含み、
前記第1端縁部は、前記主面に形成され、且つ、前記第1凹部の縁に沿って延びており、
前記第2端縁部は、前記主面に形成され、且つ、前記第2凹部の縁に沿って延びており、
前記第1側面部は、前記第1凹部の内側面に形成され、且つ、前記第1端縁部につながっており、
前記第2側面部は、前記第2凹部の内側面に形成され、且つ、前記第2端縁部につながっており、
前記第1連絡部は、前記主面に形成され、前記第1導電部および前記第1端縁部の間に位置し、且つ、前記第1導電部および前記第1端縁部に導通し、
前記第2連絡部は、前記主面に形成され、前記ワイヤボンディングパッド部および前記第2端縁部の間に位置し、且つ、前記ワイヤボンディングパッド部および前記第2端縁部に導通する、付記14に記載の電子装置。
[付記16]
前記電子素子と前記配線パターンと前記基材とを覆う樹脂部を更に備える、付記1ないし付記15のいずれかに記載の電子装置。
[付記17]
前記配線パターンを覆う保護層を更に備え、
前記保護層は、前記第1連絡部を覆う部位を含む、付記15に記載の電子装置。
100 基材
11 主面
111,119 部位
13 裏面
15A 第1側面
15B 第2側面
15C 第3側面
15D 第4側面
161A 縁
161B 縁
16A 第1凹部
16B 第2凹部
3 配線パターン
31 ダイパッド部
311 第1内側面
31A 第1端縁
31B 第2端縁
32 第1導電部
321 第2内側面
322 表面
322A 接触部位
322B 露出部位
33 第2導電部
332 表面
34 ワイヤボンディングパッド部
35A 第1端縁部
35B 第2端縁部
36A 第1連絡部
36B 第2連絡部
36C 導電部
37A 第1側面部
37B 第2側面部
38A 第1裏面部
38B 第2裏面部
39 開口部
391 部位
41 電子素子
42 ワイヤ
5 接合層
6 保護層
61〜63 部位
7 樹脂部
A1 電子装置
A2 電子装置
A3 電子装置
L1 離間距離
W1 幅
X1 第1方向
Y1 第2方向
Z1 厚さ方向
Claims (17)
- 基材と、
前記基材に形成された配線パターンと、
前記配線パターンに配置された電子素子と、
前記電子素子および前記配線パターンの間に介在する接合層と、を備え、
前記配線パターンには、開口部が形成され、前記接合層は、前記基材のうち前記配線パターンにおける前記開口部に露出した部位に接しており、
前記基材の厚さ方向視において、前記開口部は前記電子素子から離れた位置に設けられており、かつ前記電子素子のすべてが前記配線パターンと重なっている、電子装置。 - 前記配線パターンは、前記電子素子が配置されたダイパッド部を含み、
前記ダイパッド部の一部は、前記開口部を構成しており、
前記接合層は、前記ダイパッド部に接する、請求項1に記載の電子装置。 - 前記ダイパッド部は、前記基材の厚さ方向に交差する方向を向く第1内側面を含み、前記第1内側面は、前記開口部の一部を規定しており、前記接合層は、前記第1内側面に接する、請求項2に記載の電子装置。
- 前記配線パターンは、第1導電部を含み、前記開口部は、前記基材の厚さ方向視において、前記第1導電部および前記ダイパッド部の間に位置する、請求項3に記載の電子装置。
- 前記第1導電部は、前記第1内側面に対向する第2内側面を含み、前記接合層は、前記第2内側面に接する、請求項4に記載の電子装置。
- 前記第1導電部は、前記基材の厚さ方向を向く表面を有し、前記第1導電部の前記表面は、前記接合層に接する接触部位を含む、請求項4または請求項5に記載の電子装置。
- 前記第1導電部の前記表面は、前記接合層から露出している露出部位を含み、
前記接触部位は、前記基材の厚さ方向視において、前記露出部位と前記開口部との間に位置する、請求項6に記載の電子装置。 - 前記第1導電部は、前記ダイパッド部を囲む環状である、請求項4ないし請求項7のいずれかに記載の電子装置。
- 前記配線パターンは、前記ダイパッド部および前記第1導電部のいずれにもつながる少なくとも1つの第2導電部を含み、前記少なくとも1つの第2導電部は各々、前記ダイパッド部および前記第1導電部の間に位置し、
前記少なくとも1つの第2導電部のいずれか1つの一部は、前記開口部を構成しており、
前記接合層は、前記少なくとも1つの第2導電部に接している、請求項4に記載の電子装置。 - 前記少なくとも1つの第2導電部は各々、前記基材の厚さ方向視において、前記ダイパッド部から前記第1導電部に向かって延びており、
前記少なくとも1つの第2導電部は、前記基材の厚さ方向を向く表面を有し、前記少なくとも1つの第2導電部における前記表面は、前記接合層に接している、請求項9に記載の電子装置。 - 前記ダイパッド部は、前記ダイパッド部において前記基材の厚さ方向視にて互いに反対側に位置する第1端縁および第2端縁を含み、
前記少なくとも1つの第2導電部の幅は、前記第1端縁および前記第2端縁の離間距離よりも、小さい、請求項10に記載の電子装置。 - 前記電子素子は、光学素子あるいはツェナーダイオードである、請求項1ないし請求項11のいずれかに記載の電子装置。
- 前記電子素子にボンディングされたワイヤを更に備え、
前記配線パターンは、前記ワイヤがボンディングされたワイヤボンディングパッド部を含む、請求項4に記載の電子装置。 - 前記基材は、互いに反対側を向く主面および裏面を含み、
前記電子素子は、前記主面側に配置されており、
前記配線パターンは、前記主面および前記裏面に形成されている、請求項13に記載の電子装置。 - 前記基材は、前記基材の厚さ方向に直交する方向を向く第1側面および第2側面を含み、前記第1側面および前記第2側面は、互いに反対側を向き、
前記基材には、前記第1側面から凹む第1凹部と、前記第2側面から凹む第2凹部と、が形成され、
前記配線パターンは、第1連絡部と、第2連絡部と、第1端縁部と、第2端縁部と、第1側面部と、第2側面部と、を含み、
前記第1端縁部は、前記主面に形成され、且つ、前記第1凹部の縁に沿って延びており、
前記第2端縁部は、前記主面に形成され、且つ、前記第2凹部の縁に沿って延びており、
前記第1側面部は、前記第1凹部の内側面に形成され、且つ、前記第1端縁部につながっており、
前記第2側面部は、前記第2凹部の内側面に形成され、且つ、前記第2端縁部につながっており、
前記第1連絡部は、前記主面に形成され、前記第1導電部および前記第1端縁部の間に位置し、且つ、前記第1導電部および前記第1端縁部に導通し、
前記第2連絡部は、前記主面に形成され、前記ワイヤボンディングパッド部および前記第2端縁部の間に位置し、且つ、前記ワイヤボンディングパッド部および前記第2端縁部に導通する、請求項14に記載の電子装置。 - 前記電子素子と前記配線パターンと前記基材とを覆う樹脂部を更に備える、請求項1ないし請求項15のいずれかに記載の電子装置。
- 前記配線パターンを覆う保護層を更に備え、
前記保護層は、前記第1連絡部を覆う部位を含む、請求項15に記載の電子装置。
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