JP6962234B2 - 光電変換素子、光電変換モジュールおよび電子機器 - Google Patents
光電変換素子、光電変換モジュールおよび電子機器 Download PDFInfo
- Publication number
- JP6962234B2 JP6962234B2 JP2018030522A JP2018030522A JP6962234B2 JP 6962234 B2 JP6962234 B2 JP 6962234B2 JP 2018030522 A JP2018030522 A JP 2018030522A JP 2018030522 A JP2018030522 A JP 2018030522A JP 6962234 B2 JP6962234 B2 JP 6962234B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- terminal
- electrode
- photoelectric conversion
- outer edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000006243 chemical reaction Methods 0.000 title claims description 74
- 239000000758 substrate Substances 0.000 claims description 189
- 239000004065 semiconductor Substances 0.000 claims description 23
- 239000013078 crystal Substances 0.000 claims description 10
- 239000012535 impurity Substances 0.000 description 27
- 239000000463 material Substances 0.000 description 21
- 238000000926 separation method Methods 0.000 description 19
- 239000011347 resin Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 15
- 239000000470 constituent Substances 0.000 description 14
- 230000007547 defect Effects 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 238000013461 design Methods 0.000 description 12
- 238000010248 power generation Methods 0.000 description 12
- 238000005336 cracking Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 230000003287 optical effect Effects 0.000 description 11
- 238000005304 joining Methods 0.000 description 10
- 238000002161 passivation Methods 0.000 description 10
- 230000007423 decrease Effects 0.000 description 9
- 238000010030 laminating Methods 0.000 description 9
- 230000035882 stress Effects 0.000 description 9
- 230000008646 thermal stress Effects 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000001133 acceleration Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000002019 doping agent Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000969 carrier Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 238000001962 electrophoresis Methods 0.000 description 2
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
-
- G—PHYSICS
- G04—HOROLOGY
- G04C—ELECTROMECHANICAL CLOCKS OR WATCHES
- G04C10/00—Arrangements of electric power supplies in time pieces
- G04C10/02—Arrangements of electric power supplies in time pieces the power supply being a radioactive or photovoltaic source
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
- G04G17/06—Electric connectors, e.g. conductive elastomers
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G19/00—Electric power supply circuits specially adapted for use in electronic time-pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
- H01L31/035281—Shape of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/053—Energy storage means directly associated or integrated with the PV cell, e.g. a capacitor integrated with a PV cell
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
- H01L31/0682—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells back-junction, i.e. rearside emitter, solar cells, e.g. interdigitated base-emitter regions back-junction cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electromechanical Clocks (AREA)
- Photovoltaic Devices (AREA)
- Electric Clocks (AREA)
Description
本発明の光電変換素子は、円弧を含む基板外縁を有する半導体基板と、
前記半導体基板の一方の面側に、前記円弧の円周方向に沿って順に第1端子、第2端子、第3端子および第4端子と、
を有し、
前記基板外縁から前記第2端子までの距離および前記基板外縁から前記第4端子までの距離は、それぞれ前記基板外縁から前記第1端子までの距離および前記基板外縁から前記第3端子までの距離の双方より大きい。
前記第1端子および前記第3端子は、前記基板外縁と前記基板内縁との中間線よりも前記基板外縁側に位置し、
前記第2端子および前記第4端子は、前記中間線よりも前記基板内縁側に位置していることが好ましい。
前記中間線よりも前記基板外縁側に位置する前記端子の数が、前記中間線よりも前記基板内縁側に位置する前記端子の数よりも多いことが好ましい。
これにより、光電変換効率が特に高い光電変換素子が得られる。また、光電変換素子の省スペース化が図られることにより、電子機器の意匠性をより高めることができる。さらに、室内光のような低照度光においても光電変換効率が低下しにくい光電変換素子が得られる。
前記光電変換素子と重なるように設けられている配線基板と、
を有することを特徴とする。
これにより、信頼性の高い光電変換モジュールが得られる。
前記ランド部の配置は、前記第1端子、前記第3端子、前記第2端子および前記第4端子の配置に対応していることが好ましい。
これにより、信頼性の高い電子機器が得られる。
まず、本発明の電子機器の実施形態を適用した電子時計について説明する。かかる電子時計は、受光面に光が照射されると、内蔵する太陽電池(光電変換モジュール)によって発電(光電変換)し、発電により得られた電力を駆動電力として利用するように構成されている。
(機器本体)
機器本体30は、表側および裏側に開口したケース31と、表側の開口部を塞ぐように設けられた風防板55と、ケース31の表面と風防板55の側面とを覆うように設けられたベゼル57と、裏側の開口部を塞ぐように設けられた透明カバー44と、を備える筐体を有している。この筐体内には、後述する種々の構成要素が収容される。
また、ケース31の表側に設けられた開口部35の外縁には、+Z方向に突出する突起部34が形成されている。そして、この突起部34を覆うように、円環状をなすベゼル57が設けられている。
回路基板20は、その端部が回路ケース75を介してケース31に取り付けられている。
次に、本発明の光電変換モジュールの実施形態を適用した太陽電池80、および、太陽電池80に含まれるセル80a、80b、80c、80d(本発明の光電変換素子の実施形態)について詳述する。
図7に示す太陽電池80は、セル80aと配線基板82とを備えている。
図8は、図6に示すセル80aの電極面85を示す平面図である。なお、図8では、前述したパッシベーション膜806に覆われているフィンガー電極804やバスバー電極805を透視するように図示している。
一方、パッシベーション膜806の一部にはコンタクトホールが設けられ、p型バスバー電極805pおよびn型バスバー電極805nの一部が露出している。このうち、p型バスバー電極805pの露出面が前述した電極パッド86(正極端子)となり、n型バスバー電極805nの露出面が前述した電極パッド87(負極端子)となる。
フィンガー電極804は、図9に示すように、基板外縁800aが含む曲線の垂線PLの延伸方向に延在しているのが好ましい。すなわち、セル80a(光電変換素子)は、曲線を含む基板外縁800aと、基板外縁800aの内側(曲線の内側)に位置し曲線を含む基板内縁800bと、を有するSi基板800(半導体基板)と、Si基板800の一方の面に設けられている複数のフィンガー電極804(第1電極)と、を備え、フィンガー電極804は、基板外縁800aが含む曲線の垂線方向に延在しているのが好ましい。これにより、基板外縁800aが円弧である場合、フィンガー電極804は、その円弧の中心から放射状に延伸する直線に沿って延在することとなる。
一方、セル80aは、図8および図10に示すように、複数のフィンガー電極804を跨ぐように、かつ、これらのフィンガー電極804を覆うように設けられたp型バスバー電極805pおよびn型バスバー電極805nを備えている。そして、p型バスバー電極805pは、p型ビア配線814pを介して複数のp型フィンガー電極804pと電気的に接続されており、n型バスバー電極805nは、n型ビア配線814nを介して複数のn型フィンガー電極804nと電気的に接続されている。
また、配線基板82によってセル80aの電極面85の少なくとも一部が覆われることになるため、電極面85が保護される。このため、電極面85に異物が付着したり、外力が加わったりすることが抑制される。その結果、電極面85の信頼性を確保することができる。
次に、図7に示す太陽電池80の製造方法の一例について説明する。
[1]まず、セル80aを準備する(準備工程)。このセル80aは、例えば、半導体ウエハーにドーパント不純物領域等を形成した後、電極や絶縁膜を成膜することにより形成し、その後、個片化することにより製造される。
以上のようにして太陽電池80が得られる。
Claims (8)
- 円弧を含む基板外縁を有する半導体基板と、
前記半導体基板の一方の面側に、前記円弧の円周方向に沿って順に第1端子、第2端子、第3端子および第4端子と、
を有し、
前記基板外縁から前記第2端子までの距離および前記基板外縁から前記第4端子までの距離は、それぞれ前記基板外縁から前記第1端子までの距離および前記基板外縁から前記第3端子までの距離の双方より大きい光電変換素子。 - 前記半導体基板は、前記基板外縁と、前記基板外縁の内側に位置し曲線を含む基板内縁と、を有し、
前記第1端子および前記第3端子は、前記基板外縁と前記基板内縁との中間線よりも前記基板外縁側に位置し、
前記第2端子および前記第4端子は、前記中間線よりも前記基板内縁側に位置している請求項1に記載の光電変換素子。 - 前記第1端子、前記第2端子、前記第3端子および前記第4端子を含む5個以上の端子を有し、
前記中間線よりも前記基板外縁側に位置する前記端子の数が、前記中間線よりも前記基板内縁側に位置する前記端子の数よりも多い請求項2に記載の光電変換素子。 - 前記基板外縁および前記基板内縁は、互いに同心の円弧を含む請求項2または3に記載の光電変換素子。
- 前記半導体基板は、単結晶性を有する請求項1ないし4のいずれか1項に記載の光電変換素子。
- 請求項1ないし5のいずれか1項に記載の光電変換素子と、
前記光電変換素子と重なるように設けられている配線基板と、
を有することを特徴とする光電変換モジュール。 - 前記配線基板は、絶縁基板と、前記絶縁基板に設けられている導電層と、前記導電層と電気的に接続されている複数のランド部と、を有し、
前記ランド部の配置は、前記第1端子、前記第3端子、前記第2端子および前記第4端子の配置に対応している請求項6に記載の光電変換モジュール。 - 請求項1ないし5のいずれか1項に記載の光電変換素子を備えることを特徴とする電子機器。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018030522A JP6962234B2 (ja) | 2018-02-23 | 2018-02-23 | 光電変換素子、光電変換モジュールおよび電子機器 |
US16/283,344 US11024751B2 (en) | 2018-02-23 | 2019-02-22 | Photoelectric conversion element. photoelectric conversion module, and electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018030522A JP6962234B2 (ja) | 2018-02-23 | 2018-02-23 | 光電変換素子、光電変換モジュールおよび電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019145731A JP2019145731A (ja) | 2019-08-29 |
JP6962234B2 true JP6962234B2 (ja) | 2021-11-05 |
Family
ID=67686091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018030522A Active JP6962234B2 (ja) | 2018-02-23 | 2018-02-23 | 光電変換素子、光電変換モジュールおよび電子機器 |
Country Status (2)
Country | Link |
---|---|
US (1) | US11024751B2 (ja) |
JP (1) | JP6962234B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117136396A (zh) * | 2022-03-28 | 2023-11-28 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示面板、显示装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5111411Y1 (ja) * | 1970-10-31 | 1976-03-27 | ||
JPS5373170A (en) * | 1976-12-10 | 1978-06-29 | Hamasawa Kogyo:Kk | Dial for solar battery watch |
CN1142597C (zh) * | 1998-03-25 | 2004-03-17 | Tdk株式会社 | 太阳能电池组件 |
US7057102B2 (en) * | 2000-11-10 | 2006-06-06 | Citizen Watch Co., Ltd. | Solar cell module and portable electronic apparatus with it |
JP4244137B2 (ja) * | 2002-12-24 | 2009-03-25 | シチズンホールディングス株式会社 | 太陽電池モジュール及び電子機器 |
JP3687970B1 (ja) | 2004-12-24 | 2005-08-24 | 信越化学工業株式会社 | 太陽光発電用モジュール及びこれを用いた太陽光発電システム |
WO2006027898A1 (ja) | 2004-09-03 | 2006-03-16 | Shin-Etsu Chemical Co., Ltd. | 太陽光発電用モジュール及びこれを用いた太陽光発電システム |
JP4838827B2 (ja) | 2008-07-02 | 2011-12-14 | シャープ株式会社 | 太陽電池モジュールおよびその製造方法 |
WO2011042904A1 (en) | 2009-10-07 | 2011-04-14 | Pythagoras Solar Inc. | Photovoltaic module and array and method of manufacture thereof |
JP2014170763A (ja) * | 2011-06-29 | 2014-09-18 | Sharp Corp | 太陽電池モジュール及び太陽電池実装方法 |
JP5406900B2 (ja) | 2011-09-29 | 2014-02-05 | シャープ株式会社 | 太陽電池モジュールおよびその製造方法 |
JP2014011232A (ja) | 2012-06-28 | 2014-01-20 | Hitachi Chemical Co Ltd | 太陽電池素子、太陽電池素子の製造方法、太陽電池モジュールの製造方法及び太陽電池モジュール |
JP2014150179A (ja) * | 2013-02-01 | 2014-08-21 | Sharp Corp | 太陽電池モジュール |
JP6269945B2 (ja) * | 2013-09-04 | 2018-01-31 | カシオ計算機株式会社 | ソーラーパネルおよび時計 |
JP2015154050A (ja) | 2014-02-19 | 2015-08-24 | 三菱化学株式会社 | 薄膜太陽電池モジュール |
JP5936150B2 (ja) | 2014-03-18 | 2016-06-15 | カシオ計算機株式会社 | 電子機器および腕時計 |
JP6589126B2 (ja) | 2015-05-28 | 2019-10-16 | パナソニックIpマネジメント株式会社 | 太陽電池モジュール |
JP2017041534A (ja) * | 2015-08-20 | 2017-02-23 | シャープ株式会社 | 配線基板及び太陽電池 |
JP2016176957A (ja) | 2016-05-13 | 2016-10-06 | カシオ計算機株式会社 | 電子機器および腕時計 |
-
2018
- 2018-02-23 JP JP2018030522A patent/JP6962234B2/ja active Active
-
2019
- 2019-02-22 US US16/283,344 patent/US11024751B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20190267497A1 (en) | 2019-08-29 |
JP2019145731A (ja) | 2019-08-29 |
US11024751B2 (en) | 2021-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20090022198A1 (en) | Package structure of compound semiconductor device and fabricating method thereof | |
CN102467085B (zh) | 具备天线装置和太阳能电池板的手表 | |
US9760754B2 (en) | Printed circuit board assembly forming enhanced fingerprint module | |
TW201715695A (zh) | 晶圓級光電子器件封裝及其製造方法 | |
US20190265655A1 (en) | Portable radio-controlled watch | |
JP2012109475A (ja) | 発光装置、発光装置の製造方法、および光学装置 | |
US11594649B2 (en) | Photoelectric converter, photoelectric conversion module, and electronic instrument | |
CN103579474A (zh) | 发光二极管元件 | |
EP3751606A1 (en) | Electronic device | |
JP6962234B2 (ja) | 光電変換素子、光電変換モジュールおよび電子機器 | |
JP7176265B2 (ja) | 裏面電極型光電変換素子、光電変換モジュールおよび電子機器 | |
JP7040140B2 (ja) | 光電変換素子、光電変換モジュールおよび電子機器 | |
US20190163137A1 (en) | Electronic apparatus and photoelectric conversion device manufacturing method | |
US20120024347A1 (en) | Solar package structure and method for fabricating the same | |
JP2020013869A (ja) | 光電変換素子、光電変換素子の製造方法、光電変換モジュールおよび電子機器 | |
JP2019125658A (ja) | 光電変換素子、光電変換モジュールおよび電子機器 | |
JP2019153763A (ja) | 光電変換素子、光電変換モジュールおよび電子機器 | |
CN112782959B (zh) | 带有太阳能电池的电子手表 | |
JP2019102597A (ja) | 光電変換モジュール、光電変換モジュールの製造方法および電子機器 | |
JP2020013843A (ja) | 光電変換素子の製造方法、光電変換素子、光電変換モジュールおよび電子機器 | |
JP5044319B2 (ja) | 半導体装置 | |
JP4814007B2 (ja) | 時計 | |
JP2019125667A (ja) | 光電変換素子および電子機器 | |
KR101167779B1 (ko) | 태양전지 모듈 및 그 제조 방법, 그리고 상기 태양전지 모듈을 구비하는 모바일 장치 및 그 제조 방법 | |
JP5925432B2 (ja) | 光学センサおよび光学センサの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20201215 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20210907 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210914 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210927 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6962234 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |