JP6958519B2 - はんだ付け装置 - Google Patents

はんだ付け装置 Download PDF

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Publication number
JP6958519B2
JP6958519B2 JP2018168746A JP2018168746A JP6958519B2 JP 6958519 B2 JP6958519 B2 JP 6958519B2 JP 2018168746 A JP2018168746 A JP 2018168746A JP 2018168746 A JP2018168746 A JP 2018168746A JP 6958519 B2 JP6958519 B2 JP 6958519B2
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JP
Japan
Prior art keywords
soldering
hot air
sleeve
unit
land
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018168746A
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English (en)
Japanese (ja)
Other versions
JP2020040084A (ja
JP2020040084A5 (enExample
Inventor
永一郎 宮原
英典 山田
近藤　俊一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2018168746A priority Critical patent/JP6958519B2/ja
Priority to PCT/JP2019/035220 priority patent/WO2020054619A1/ja
Publication of JP2020040084A publication Critical patent/JP2020040084A/ja
Publication of JP2020040084A5 publication Critical patent/JP2020040084A5/ja
Application granted granted Critical
Publication of JP6958519B2 publication Critical patent/JP6958519B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2018168746A 2018-09-10 2018-09-10 はんだ付け装置 Active JP6958519B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018168746A JP6958519B2 (ja) 2018-09-10 2018-09-10 はんだ付け装置
PCT/JP2019/035220 WO2020054619A1 (ja) 2018-09-10 2019-09-06 はんだ付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018168746A JP6958519B2 (ja) 2018-09-10 2018-09-10 はんだ付け装置

Publications (3)

Publication Number Publication Date
JP2020040084A JP2020040084A (ja) 2020-03-19
JP2020040084A5 JP2020040084A5 (enExample) 2020-10-01
JP6958519B2 true JP6958519B2 (ja) 2021-11-02

Family

ID=69778266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018168746A Active JP6958519B2 (ja) 2018-09-10 2018-09-10 はんだ付け装置

Country Status (2)

Country Link
JP (1) JP6958519B2 (enExample)
WO (1) WO2020054619A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2023326586A1 (en) 2022-08-17 2025-02-13 Institut National de la Santé et de la Recherche Médicale Improved anti-albumin nanobodies and their uses

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61156896A (ja) * 1984-12-28 1986-07-16 三菱電機株式会社 半田付け方法
JP2005322806A (ja) * 2004-05-10 2005-11-17 Koyo Seiko Co Ltd 接合装置
JP2007073661A (ja) * 2005-09-06 2007-03-22 Fujifilm Corp レーザはんだ付け方法及びレーザはんだ付け装置
JP2012134269A (ja) * 2010-12-21 2012-07-12 Ricoh Microelectronics Co Ltd ハンダ除去方法及びその装置
JP2014146630A (ja) * 2013-01-28 2014-08-14 Fuji Electric Co Ltd 半導体装置の製造方法及びはんだごて
JP6761930B2 (ja) * 2016-07-29 2020-09-30 株式会社アンド 半田処理装置

Also Published As

Publication number Publication date
WO2020054619A1 (ja) 2020-03-19
JP2020040084A (ja) 2020-03-19

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