JP6956388B2 - プリプレグ、金属張積層板及びプリント配線板 - Google Patents
プリプレグ、金属張積層板及びプリント配線板 Download PDFInfo
- Publication number
- JP6956388B2 JP6956388B2 JP2018513179A JP2018513179A JP6956388B2 JP 6956388 B2 JP6956388 B2 JP 6956388B2 JP 2018513179 A JP2018513179 A JP 2018513179A JP 2018513179 A JP2018513179 A JP 2018513179A JP 6956388 B2 JP6956388 B2 JP 6956388B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- prepreg
- cured product
- component
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003822 epoxy resin Substances 0.000 claims description 51
- 229920000647 polyepoxide Polymers 0.000 claims description 51
- 229920005989 resin Polymers 0.000 claims description 44
- 239000011347 resin Substances 0.000 claims description 44
- 239000011342 resin composition Substances 0.000 claims description 40
- 229920001971 elastomer Polymers 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 26
- 239000011258 core-shell material Substances 0.000 claims description 22
- 239000011256 inorganic filler Substances 0.000 claims description 20
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 20
- 239000005011 phenolic resin Substances 0.000 claims description 20
- 239000011888 foil Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 229920000642 polymer Polymers 0.000 claims description 19
- 229920001187 thermosetting polymer Polymers 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 14
- 239000012783 reinforcing fiber Substances 0.000 claims description 13
- 230000009477 glass transition Effects 0.000 claims description 10
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 9
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 8
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 description 37
- 239000010410 layer Substances 0.000 description 36
- 239000004925 Acrylic resin Substances 0.000 description 24
- 229920000178 Acrylic resin Polymers 0.000 description 24
- 238000000034 method Methods 0.000 description 19
- 230000008859 change Effects 0.000 description 14
- 238000012360 testing method Methods 0.000 description 14
- 239000004593 Epoxy Substances 0.000 description 13
- 239000003365 glass fiber Substances 0.000 description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 12
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 11
- 238000005530 etching Methods 0.000 description 11
- 239000011521 glass Substances 0.000 description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 11
- 229920003986 novolac Polymers 0.000 description 11
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- -1 bismaleimide compound Chemical class 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 9
- 239000004305 biphenyl Substances 0.000 description 8
- 235000010290 biphenyl Nutrition 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000000654 additive Substances 0.000 description 6
- 239000004744 fabric Substances 0.000 description 6
- 229920000058 polyacrylate Polymers 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229920005573 silicon-containing polymer Polymers 0.000 description 5
- 229920000297 Rayon Polymers 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000002964 rayon Substances 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- NQMUGNMMFTYOHK-UHFFFAOYSA-N 1-methoxynaphthalene Chemical compound C1=CC=C2C(OC)=CC=CC2=C1 NQMUGNMMFTYOHK-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- XDOBJOBITOLMFI-UHFFFAOYSA-N pyrrole-2,5-dione;toluene Chemical compound CC1=CC=CC=C1.O=C1NC(=O)C=C1 XDOBJOBITOLMFI-UHFFFAOYSA-N 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- WBODDOZXDKQEFS-UHFFFAOYSA-N 1,2,3,4-tetramethyl-5-phenylbenzene Chemical group CC1=C(C)C(C)=CC(C=2C=CC=CC=2)=C1C WBODDOZXDKQEFS-UHFFFAOYSA-N 0.000 description 1
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- MOSSLXZUUKTULI-UHFFFAOYSA-N 3-[3-(2,5-dioxopyrrol-3-yl)-4-methylphenyl]pyrrole-2,5-dione Chemical compound CC1=CC=C(C=2C(NC(=O)C=2)=O)C=C1C1=CC(=O)NC1=O MOSSLXZUUKTULI-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 241001641958 Desmia Species 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910001593 boehmite Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000002140 halogenating effect Effects 0.000 description 1
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 108091063785 miR-3000 stem-loop Proteins 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- NAKOELLGRBLZOF-UHFFFAOYSA-N phenoxybenzene;pyrrole-2,5-dione Chemical compound O=C1NC(=O)C=C1.O=C1NC(=O)C=C1.C=1C=CC=CC=1OC1=CC=CC=C1 NAKOELLGRBLZOF-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/022—Non-woven fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/024—Woven fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/28—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/10—Reinforcing macromolecular compounds with loose or coherent fibrous material characterised by the additives used in the polymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/03—3 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0261—Polyamide fibres
- B32B2262/0269—Aromatic polyamide fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0276—Polyester fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/51—Elastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2351/00—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
- C08J2351/04—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2361/04—Condensation polymers of aldehydes or ketones with phenols only
- C08J2361/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2361/04—Condensation polymers of aldehydes or ketones with phenols only
- C08J2361/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08J2361/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with monohydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2425/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Derivatives of such polymers
- C08J2425/02—Homopolymers or copolymers of hydrocarbons
- C08J2425/04—Homopolymers or copolymers of styrene
- C08J2425/08—Copolymers of styrene
- C08J2425/12—Copolymers of styrene with unsaturated nitriles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2433/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2433/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
- C08J2433/06—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C08J2433/10—Homopolymers or copolymers of methacrylic acid esters
- C08J2433/12—Homopolymers or copolymers of methyl methacrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2433/18—Homopolymers or copolymers of nitriles
- C08J2433/20—Homopolymers or copolymers of acrylonitrile
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2461/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2461/04—Condensation polymers of aldehydes or ketones with phenols only
- C08J2461/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2461/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2461/04—Condensation polymers of aldehydes or ketones with phenols only
- C08J2461/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08J2461/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with monohydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2475/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0227—Insulating particles having an insulating coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Textile Engineering (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
本実施形態に係るプリプレグ(以下、単にプリプレグという場合がある)は、強化繊維の基材と、強化繊維の基材に含浸された樹脂組成物の半硬化物とを備え、硬化後において、ガラス転移温度(Tg)が150℃以上220℃以下である。樹脂組成物は、(A)熱硬化性樹脂と、(B)コアシェルゴム(以下、コアシェルゴム(B1)という場合がある)、及び重量平均分子量が10万以上である高分子成分(以下、単に高分子成分(B2)という場合がある)から選ばれる少なくとも1種(以下、単にゴム成分(B)という場合がある)と、を含有する。ゴム成分(B)((B)成分)の含有量は、(A)成分100質量部に対して、30質量部以上100質量部以下である。本実施形態に係るプリプレグを、プリント配線板に半導体チップを搭載した半導体パッケージの材料として用いれば、プリプレグの硬化物の熱膨張係数が所定範囲内で、かつプリプレグの硬化物の260℃における弾性率が高くなるように、樹脂組成物を調整しなくても、半導体チップとプリント配線板に生じる応力を効果的に緩和し、温度変化による半導体パッケージの反り量を低減することができる。さらに、本実施形態に係るプリプレグをプリント配線板に用いれば、層間接続のための穴あけ時に発生する樹脂スミアのデスミアエッチング量を少なくすることができ、プリント配線板の導通信頼性が低下しにくい。
樹脂組成物の半硬化物は、樹脂組成物を半硬化させたものである。
樹脂組成物は、熱硬化性樹脂(A)を含有する。熱硬化性樹脂(A)としては、例えば、エポキシ樹脂、フェノール樹脂、ビスマレイミド樹脂、シアネート樹脂などを用いることができる。これらのうちの1種のみを用いてもよいし、これら2種以上を組み合わせて用いてもよい。なかでも、熱硬化性樹脂(A)は、エポキシ樹脂、フェノール樹脂、ビスマレイミド樹脂及びシアネート樹脂からなる群より選ばれた少なくとも1種(以下、熱硬化性樹脂(A1)という)からなることが好ましい。
エポキシ樹脂としては、ビスフェノール型エポキシ樹脂、ノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、キシリレン型エポキシ樹脂、アリールアルキレン型エポキシ樹脂、ナフタレン型エポキシ樹脂、ナフタレン骨格変性エポキシ樹脂、トリフェニルメタン型エポキシ樹脂、アントラセン型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、ノルボルネン型エポキシ樹脂、フルオレン型エポキシ樹脂、上記エポキシ樹脂をハロゲン化した難燃化エポキシ樹脂などを用いることができる。これらのうちの1種のみを用いてもよいし、これら2種以上を組み合わせて用いてもよい。ビスフェノール型エポキシ樹脂としては、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂などを用いることができる。ノボラック型エポキシ樹脂としては、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂などを用いることができる。アリールアルキレン型エポキシ樹脂としては、例えば、フェノールアラルキル型エポキシ樹脂、ビフェニルアラルキル型エポキシ樹脂、ビフェニルノボラック型エポキシ樹脂、ビフェニルジメチレン型エポキシ樹脂、トリスフェノールメタンノボラック型エポキシ樹脂、テトラメチルビフェニル型エポキシ樹脂などを用いることができる。ナフタレン骨格変性エポキシ樹脂としては、例えば、ナフタレン骨格変性クレゾールノボラック型エポキシ樹脂、ナフタレンジオールアラルキル型エポキシ樹脂、ナフトールアラルキル型エポキシ樹脂、メトキシナフタレン変性クレゾールノボラック型エポキシ樹脂、メトキシナフタレンジメチレン型エポキシ樹脂などを用いることができる。
フェノール樹脂としては、例えば、ビフェニルアラルキル型フェノール樹脂、フェニルアラルキル型フェノール樹脂、ノボラック型フェノール樹脂、クレゾールノボラック型フェノール樹脂、ビスフェノールAノボラック型フェノール樹脂、ナフタレン型フェノール樹脂、テトラキスフェノール型フェノール樹脂、リン変性フェノール樹脂などを用いることができる。これらのうちの1種のみを用いてもよいし、これら2種以上を組み合わせて用いてもよい。
ビスマレイミド樹脂としては、4,4'−ジフェニルメタンビスマレイミド、フェニルメタンマレイミド、m−フェニレンビスマレイミド、ビスフェノール A ジフェニルエーテルビスマレイミド、3,3'−ジメチル-5,5'−ジエチル−4,4'−ジフェニルメタンビスマレイミド、4−メチル−1,3−フェニレンビスマレイミド、1,6'−ビスマレイミド−(2,2,4−トリメチル)ヘキサンなどを用いることができる。これらは単独で用いても、2種以上を組み合わせて用いてもよい。
シアネート樹脂としては、1分子中に2個以上のシアネート基を有するものが好ましく、例えば、2,2−ビス(4−シアナートフェニル)プロパン(ビスフェノールA型シアネート樹脂)、ビス(3,5−ジメチル−4−シアナートフェニル)メタン、2,2−ビス(4−シアナートフェニル)エタン、これらの誘導体などの芳香族系シアネートエステル化合物などを用いることができる。これらは単独で用いても、2種以上を組み合わせて用いてもよい。
樹脂組成物は、コアシェルゴム(B1)、及び重量平均分子量が10万以上である高分子成分(B2)から選ばれる少なくとも1種(B)を含有する。すなわち、樹脂組成物は、熱硬化性樹脂(A)の成分などに応じて、ゴム成分(B)のうち、コアシェルゴム(B1)及び高分子成分(B2)を含有してもよいし、コアシェルゴム(B1)のみを含有してもよいし、高分子成分(B2)のみを含有してもよい。反り特性と加工性(例えば、レーザ加工性)のバランスを考慮すると、コアシェルゴム(B1)及び高分子成分(B2)を含有する方が好ましい。
コアシェルゴム(B1)は、中心部(コア相)とその周囲(シェル相)が異なる重合体からなるコアシェル型構造のゴム成分である。
高分子成分(B2)の重量平均分子量は、10万以上であり、成型性を向上させる観点から、好ましくは85万以下である。高分子成分(B2)の重量平均分子量が10万未満であると、半導体チップとプリント配線板に生じる応力を緩和する効果が十分でなく、温度変化による半導体パッケージの反り量が大きくなるおそれがある。
樹脂組成物は、無機充填材(C)をさらに含有してもよい。樹脂組成物が無機充填材(C)を含有することにより、低熱膨張化することができる。
樹脂組成物は、硬化剤をさらに含有してもよい。硬化剤としては、例えば、ジシアンジアミド、オクタン酸亜鉛などを用いることができる。
樹脂組成物は、硬化促進剤をさらに含有してもよい。硬化促進剤としては、例えば、イミダゾール化合物、アミン系化合物、チオール化合物、金属石鹸などの有機酸金属塩などを用いることができる。
樹脂組成物は、添加剤をさらに含有してもよい。添加剤としては、例えば、熱可塑性樹脂、難燃剤、着色剤、カップリング剤などを用いることができる。
樹脂組成物の調製方法としては、例えば、熱硬化性樹脂(A)、ゴム成分(B)及びその他必要に応じて配合する成分を、それぞれ所定の配合量準備し、これらを有機溶媒中で配合し、さらに攪拌、混合する方法などが挙げられる。樹脂組成物に無機充填材(C)を配合する場合、無機充填材(C)以外の成分を有機溶媒中に配合してワニス状のベース樹脂を得、得られたベース樹脂に無機充填材(C)を配合するようにしてもよい。有機溶媒としては、例えば、エーテル類、アセトン、メチルエチルケトン(MEK)、ジメチルホルムアミド、ベンゼン、トルエンなどを用いることができる。エーテル類としては、エチレングリコールモノメチルエーテルなどを用いることができる。
プリプレグは、強化繊維の基材を備える。強化繊維としては、例えば、ガラス繊維、芳香族ポリアミド、液晶ポリエステル、ポリ(パラフェニレンベンゾビスオキサゾール)(PBO)、ポリフェニレンサルファイド樹脂(PPS)などを用いることができ、なかでもガラス繊維を用いることが好ましい。
プリプレグの製造方法としては、例えば、上記の樹脂組成物を強化繊維の基材に含浸して樹脂含浸基材を得、得られた樹脂含浸基材を加熱乾燥して樹脂組成物中の溶媒を除去することにより、樹脂組成物を半硬化させる方法などが挙げられる。加熱乾燥する温度は、好ましくは110〜150℃である。
本実施形態の金属張積層板(以下、金属張積層板という場合がある)は、プリプレグの1枚の硬化物又は複数枚の積層物の硬化物(以下、第一絶縁層という場合がある)と、この硬化物の片面又は両面に接着された金属箔とを備える。すなわち、金属張積層板の構成は、2層構成、又は3層構成である。2層構成の金属張積層板は、第一絶縁層と、この第一絶縁層の片面に接着された金属箔とを備える。3層構成の金属張積層板は、第一絶縁層と、この第一絶縁層の両面に接着された金属箔とを備える。
本実施形態のプリント配線板(以下、プリント配線板という)は、プリプレグの1枚の硬化物又は複数枚の積層物の硬化物(以下、第二絶縁層という場合がある)と、硬化物の片面又は両面に設けられた導体配線とを備える。プリント配線板は、単層構造のプリント配線板(以下、コア基板という場合がある);多層構造のプリント配線板などを含む。単層構造のプリント配線板は、第二絶縁層と、この第二絶縁層の片面又は両面に導体配線とからなる。多層構造のプリント配線板は、コア基板の導体配線が形成された面上に、第二絶縁層(以下、層間絶縁層という場合がある)と内層の導体配線(以下、内層導体配線という場合がある)とが交互に形成されて構成され、最外層に導体配線が形成されてなる。多層構造のプリント配線板の層数は特に限定されない。
〔樹脂組成物〕
樹脂組成物の原料として、以下のものを用意した。熱硬化性樹脂(A)、ゴム成分(B)、無機充填材(C)及び硬化促進剤を表1〜表7に示す割合で配合して、溶媒(メチルエチルケトン)で希釈し、これを撹拌、混合して均一化することにより、樹脂組成物を調製した。
(エポキシ樹脂)
・品名「EPPN−502H」(トリフェニルメタン型エポキシ樹脂、日本化薬株式会社製、エポキシ当量:170g/eq)
・品名「NC−3000」(ビフェニルアラルキル型エポキシ樹脂、日本化薬株式会社製、エポキシ当量:275g/eq)
・品名「NC−3500」(ビフェニルアラルキル型エポキシ樹脂、日本化薬株式会社製、エポキシ当量:209g/eq)
・品名「HP−9500」(ナフタレン型エポキシ樹脂、DIC株式会社製、エポキシ当量:230g/eq))
・品名「HP−4710」(ナフタレン型エポキシ樹脂、DIC株式会社製、エポキシ当量170g/eq)
・品名「YX7400」(エポキシ樹脂、三菱化学株式会社製、エポキシ当量:440g/eq)
エポキシ当量はカタログ値である。
(フェノール樹脂)
・品名「TD−2090」(ノボラック型フェノール樹脂、DIC株式会社製、水酸基当量:105g/eq)
・品名「MEH−7600」(テトラキスフェノール型フェノール樹脂、明和化成株式会社、水酸基当量:100g/eq)
・品名「GPH−103」(ビフェニルアラルキル型フェノール樹脂、日本化薬株式会社、水酸基当量:230g/eq)
・品名「HPC−9500」(ナフタレン型フェノール樹脂、DIC株式会社製、水酸基当量:153g/eq)
・品名「TD−2093Y」(ノボラック型フェノール樹脂、DIC株式会社製、水酸基当量:104g/eq)
・品名「HPC−9100」(リン変性フェノール樹脂、DIC株式会社製、水酸基当量:373g/eq)
水酸基当量はカタログ値である。
(ビスマレイミド樹脂)
・品名「MIR−3000」(マレイミド、日本化薬株式会社製)
・品名「BMI−2300」(フェニルメタンマレイミド、大和化成工業株式会社製)
(シアネート樹脂)
・品名「BADCy」(ビスフェノールA型シアネート樹脂、ロンザジャパン株式会社製)
(重量平均分子量が10万以上である高分子成分(B2))
・品名「SG−P3改197」(アクリル樹脂、ナガセケムテックス株式会社製)
このアクリル樹脂(品名「SG−P3改197」)は、エポキシ価が0.17ep/kgであり、重量平均分子量が70万である。
・品名「SG−P3 Mw1」(アクリル樹脂、ナガセケムテックス株式会社製)
このアクリル樹脂(品名「SG−P3 Mw1」)は、分子中に上記式(1)及び(2)で表される繰り返し単位(式(1)におけるR1は水素原子、式(2)におけるR2はブチル基、エチル基である)を有し、エポキシ基を有し、炭素原子間に不飽和結合を有さない樹脂である。このアクリル樹脂(品名「SG−P3 Mw1」)は、エポキシ価が0.21ep/kgであり、重量平均分子量が26万である。
・品名「SG−80H」(アクリル樹脂、ナガセケムテックス株式会社製)
このアクリル樹脂(品名「SG−80H」)は、エポキシ価が0.07ep/kgであり、重量平均分子量が35万である。
(コアシェルゴム(B1))
・品名「SRK200A」(コアシェル型多層構造ゴム、コア相:シリコーン/アクリル重合体、シェル相:アクリロニトリル/スチレン、平均粒子径:0.15μm、三菱レイヨン株式会社製)
・品名「S−2100」(コアシェル型多層構造ゴム、コア相:シリコーン/アクリル重合体、シェル相:ポリメタクリル酸メチル、平均粒子径:0.70μm、三菱レイヨン株式会社製)
・品名「SX−005」(コアシェル型多層構造ゴム、コア相:シリコーン/アクリル重合体、シェル相:ポリメタクリル酸メチル、平均粒子径:0.20μm、三菱レイヨン株式会社製)
・品名「AC3816」(コアシェル型多層構造ゴム、コア相:架橋アクリル重合体、シェル相:ポリメタクリル酸メチル、平均粒子径:0.3μm、アイカ工業株式会社製)
・品名「MX−217」(コアシェルゴム、株式会社カネカ製)
・品名「SC−2500SEJ」(溶融シリカ粒子、平均粒子径:0.5μm、株式会社アドマテックス製)
・品名「2E4MZ」(イミダゾール、四国化成工業株式会社製)
・品名「Zn−OCTOATE」(オクタン酸亜鉛、DIC株式会社製)
ガラスクロス(日東紡績株式会社製の♯2118タイプ、WTX2118T−107−S199、Tガラス)を、プリプレグの硬化物の厚みが100μmとなるように樹脂組成物に含浸させた。ガラスクロスに含浸された樹脂組成物を半硬化状態となるまで非接触タイプの加熱ユニットによって加熱乾燥した。加熱温度は150〜160℃であった。これにより、樹脂組成物中の溶媒を除去し、ガラスクロスと、このガラスクロスに含浸された樹脂組成物の半硬化物とを備えるプリプレグを製造した。プリプレグのレジンコンテント(樹脂量)は、プリプレグ100質量部に対して41質量部であった。
プリプレグを2枚重ねて積層物を得、得られた積層物の両面に金属箔として銅箔(厚み:12μm)を重ねて、銅箔付きの積層物を得た。この銅箔付きの積層物を、加熱加圧成形することによって、厚み0.2mmの両面金属張積層板を製造した。加熱加圧成形の条件は、210℃、4MPa、120分間であった。
上記ガラスクロスは縦糸及び横糸がほぼ直交するように織られた織布からなる。両面金属張積層板の両面に接着された銅箔をエッチングにより除去し、積層物の硬化物を得た。この積層物の硬化物をガラスクロスの縦糸又は横糸に対して斜め45°方向(バイアス方向)に、この積層物の硬化物を切断して、サイズが50mm×5mmの試料を作製した。この試料を用いて下記方法により、Tg(DMA・引張)及び弾性率(260℃・DMA・引張・バイアス)を測定した。さらに、デスミア耐性及びスウィング量(30−260℃)を評価した。材料特性の測定結果、並びにデスミア耐性及びスウィング量の評価結果を表1〜表7に示す。
上記試料について、動的粘弾性測定装置(エスアイアイ・ナノテクノロジー株式会社製「DMS6100」)を用い、5℃/分の昇温条件(DMA法)でtanδを測定し、そのピーク温度をガラス転移温度(Tg)とした。
DMA測定により、260℃の雰囲気下で、上記試料の弾性率(動的貯蔵弾性率)を測定した。
デスミア耐性は、下記の試験片をデスミア処理する前の処理前試験片の質量と、下記の試験片を過マンガン酸塩でデスミア処理した後の処理済み試験片の質量との差からデスミアエッチング量を計算し、その計算値から評価した。
両面金属張積層板の両面に接着された銅箔の一部をサブトラクティブ法によりエッチング除去し、導体配線を形成することによってプリント配線板を製造した。半導体チップ(サイズ:10mm×10mm×厚さ0.10mmt)をプリント配線板にフリップチップ実装し、リフロー処理(260℃)した。その後、半導体チップとプリント配線板との間をアンダーフィル(パナソニック株式会社製「CV5300」)で充填して、半導体チップをプリント配線板に接着固定し、半導体パッケージ(12.5mm×12.5mm×厚さ0.27mmt)を製造した。
Claims (7)
- 強化繊維の基材と、
前記強化繊維の基材に含浸された樹脂組成物の半硬化物と
を備えるプリプレグであって、
硬化後において、ガラス転移温度(Tg)が150℃以上220℃以下であり、
前記樹脂組成物は、
(A)熱硬化性樹脂と、
(B)ゴム成分と、
を含有し、
前記(B)成分は、重量平均分子量が10万以上であって、かつ、下記式(3)で表される構造を有する高分子成分を含み、
前記(B)成分の含有量は、前記(A)成分100質量部に対して、30質量部以上100質量部以下であることを特徴とするプリプレグ。
- 前記(B)成分は、さらにコアシェルゴムを含むことを特徴とする請求項1に記載のプリプレグ。
- 前記樹脂組成物は、さらに(C)無機充填材を含有することを特徴とする請求項1又は2に記載のプリプレグ。
- 前記(C)成分の含有量は、前記(A)成分100質量部に対して、150質量部以下であることを特徴とする請求項3に記載のプリプレグ。
- 前記(A)成分は、エポキシ樹脂、フェノール樹脂、ビスマレイミド樹脂及びシアネート樹脂からなる群より選ばれた少なくとも1種からなることを特徴とする請求項1乃至4のいずれか1項に記載のプリプレグ。
- 請求項1乃至5のいずれか1項に記載のプリプレグの1枚の硬化物又は複数枚の積層物の硬化物と、
前記硬化物の片面又は両面に接着された金属箔と
を備えることを特徴とする金属張積層板。 - 請求項1乃至5のいずれか1項に記載のプリプレグの1枚の硬化物又は複数枚の積層物の硬化物と、
前記硬化物の片面又は両面に設けられた導体配線と
を備えることを特徴とするプリント配線板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016084034 | 2016-04-19 | ||
JP2016084034 | 2016-04-19 | ||
PCT/JP2017/015528 WO2017183621A1 (ja) | 2016-04-19 | 2017-04-18 | プリプレグ、金属張積層板及びプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017183621A1 JPWO2017183621A1 (ja) | 2019-04-25 |
JP6956388B2 true JP6956388B2 (ja) | 2021-11-02 |
Family
ID=60116822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018513179A Active JP6956388B2 (ja) | 2016-04-19 | 2017-04-18 | プリプレグ、金属張積層板及びプリント配線板 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11647583B2 (ja) |
JP (1) | JP6956388B2 (ja) |
KR (1) | KR102350152B1 (ja) |
CN (1) | CN109071854B (ja) |
TW (1) | TWI642151B (ja) |
WO (1) | WO2017183621A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6546993B2 (ja) * | 2014-11-11 | 2019-07-17 | 廣東生益科技股▲ふん▼有限公司Shengyi Technology Co.,Ltd. | 熱硬化性樹脂組成物、及びそれを用いて製造されたプリプレグと積層板 |
KR102476086B1 (ko) * | 2015-06-25 | 2022-12-09 | 닛뽄 가야쿠 가부시키가이샤 | 에폭시 수지 조성물 및 그 경화물 |
KR102262624B1 (ko) * | 2015-07-06 | 2021-06-08 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 프리프레그, 금속박 피복 적층판, 및 프린트 배선판 |
JP7426629B2 (ja) * | 2018-12-12 | 2024-02-02 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及びプリント配線板 |
US20220056260A1 (en) * | 2018-12-29 | 2022-02-24 | Shengyi Technology Co., Ltd. | Resin composition, prepreg, laminate and metal foil-clad laminate |
CN113166553A (zh) * | 2019-02-06 | 2021-07-23 | 三菱瓦斯化学株式会社 | 组合物、预浸料、树脂片、层叠板以及印刷电路板 |
JP7088143B2 (ja) * | 2019-08-23 | 2022-06-21 | 横浜ゴム株式会社 | プリプレグおよびその製造方法 |
WO2021261308A1 (ja) * | 2020-06-24 | 2021-12-30 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及びプリント配線板 |
CN114479406A (zh) * | 2021-12-22 | 2022-05-13 | 四川仁智新材料科技有限责任公司 | 一种阻燃耐候耐低温塑料及其制备方法 |
CN114552198B (zh) * | 2022-04-25 | 2022-07-08 | 中国电子科技集团公司第二十九研究所 | 一种轻质高性能电路的精密制备方法 |
WO2024203311A1 (ja) * | 2023-03-31 | 2024-10-03 | パナソニックIpマネジメント株式会社 | プリプレグ、金属張積層板、及びプリント配線板 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8029889B1 (en) * | 2004-12-03 | 2011-10-04 | Henkel Corporation | Prepregs, towpregs and preforms |
WO2008041453A1 (fr) * | 2006-09-29 | 2008-04-10 | Hitachi Chemical Company, Ltd. | Composition de résine thermodurcissable, pré-imprégné et stratifié obtenus avec celle-ci |
US20100096173A1 (en) * | 2007-02-23 | 2010-04-22 | Kentaro Fujino | Epoxy resin composition, prepreg, and laminate and printed wiring board |
JP4765975B2 (ja) * | 2007-03-27 | 2011-09-07 | パナソニック電工株式会社 | 積層板とそれを用いたプリント配線板 |
JP5024205B2 (ja) * | 2007-07-12 | 2012-09-12 | 三菱瓦斯化学株式会社 | プリプレグ及び積層板 |
JP4613977B2 (ja) * | 2008-04-28 | 2011-01-19 | 日立化成工業株式会社 | 薄層石英ガラスクロスを含むプリプレグ、およびそれを用いた配線板 |
ES2690653T3 (es) * | 2008-06-16 | 2018-11-21 | 3M Innovative Properties Company | Composiciones curables reforzadas |
TWI499690B (zh) * | 2009-03-13 | 2015-09-11 | Ajinomoto Kk | Paste metal laminates |
JP5260458B2 (ja) | 2009-09-25 | 2013-08-14 | パナソニック株式会社 | プリプレグ用エポキシ樹脂組成物とそれを用いたプリプレグ、積層板、多層板 |
JP5716339B2 (ja) * | 2010-01-08 | 2015-05-13 | 大日本印刷株式会社 | 粘接着シートおよびそれを用いた接着方法 |
JP2012045887A (ja) * | 2010-08-30 | 2012-03-08 | Sumitomo Bakelite Co Ltd | 金属張積層板、及びその製造方法 |
TWI568587B (zh) * | 2011-04-14 | 2017-02-01 | 住友電木股份有限公司 | 積層板,電路基板,半導體封裝及積層板之製造方法 |
JP6410405B2 (ja) * | 2012-08-01 | 2018-10-24 | 住友ベークライト株式会社 | 樹脂基板、プリプレグ、プリント配線基板、半導体装置 |
KR20140037650A (ko) * | 2012-09-19 | 2014-03-27 | 삼성전기주식회사 | 패키지 기판용 수지 조성물, 및 이를 코어 절연재와 프리프레그로 포함하는 패키지 기판 |
JP5942261B2 (ja) | 2012-09-28 | 2016-06-29 | パナソニックIpマネジメント株式会社 | プリプレグ、金属張積層板、プリント配線板 |
US9701811B2 (en) | 2012-10-17 | 2017-07-11 | Blue Cube Ip Llc | Toughened, curable epoxy compositions for high temperature applications |
CN105008456B (zh) * | 2013-03-11 | 2017-12-01 | 东丽株式会社 | 环氧树脂组合物、预浸料坯及纤维增强复合材料 |
JP6206035B2 (ja) | 2013-09-24 | 2017-10-04 | 住友ベークライト株式会社 | 金属張積層板、プリント配線基板、および半導体装置 |
JP2015172144A (ja) * | 2014-03-12 | 2015-10-01 | パナソニックIpマネジメント株式会社 | プリプレグ、金属張積層板、プリント配線板 |
-
2017
- 2017-04-18 TW TW106112886A patent/TWI642151B/zh active
- 2017-04-18 WO PCT/JP2017/015528 patent/WO2017183621A1/ja active Application Filing
- 2017-04-18 US US16/095,120 patent/US11647583B2/en active Active
- 2017-04-18 JP JP2018513179A patent/JP6956388B2/ja active Active
- 2017-04-18 CN CN201780024355.6A patent/CN109071854B/zh active Active
- 2017-04-18 KR KR1020187029542A patent/KR102350152B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US11647583B2 (en) | 2023-05-09 |
KR20180135900A (ko) | 2018-12-21 |
KR102350152B1 (ko) | 2022-01-11 |
JPWO2017183621A1 (ja) | 2019-04-25 |
CN109071854B (zh) | 2021-08-27 |
US20190150279A1 (en) | 2019-05-16 |
CN109071854A (zh) | 2018-12-21 |
WO2017183621A1 (ja) | 2017-10-26 |
TWI642151B (zh) | 2018-11-21 |
TW201739019A (zh) | 2017-11-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6956388B2 (ja) | プリプレグ、金属張積層板及びプリント配線板 | |
JP6793326B2 (ja) | プリプレグ、金属張積層板、プリント配線板 | |
JP7426629B2 (ja) | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及びプリント配線板 | |
CN108047718B (zh) | 马来酰亚胺树脂组合物、预浸料、层压板和印刷电路板 | |
JP2004182851A (ja) | 樹脂組成物、プリプレグおよびそれを用いたプリント配線板 | |
CN110050018B (zh) | 预浸料、覆金属层压板和印刷线路板 | |
JP3821728B2 (ja) | プリプレグ | |
JP6778889B2 (ja) | プリプレグ、金属張積層板及びプリント配線板 | |
JP2007009217A (ja) | 樹脂組成物、プリプレグ及びそれを用いたプリント配線板 | |
JP6624545B2 (ja) | 熱硬化性樹脂組成物、金属張積層板、絶縁シート、プリント配線板、プリント配線板の製造方法及びパッケージ基板 | |
JP2015207753A (ja) | プリント配線板用樹脂組成物、プリプレグ、金属張積層板、プリント配線板 | |
JP7352799B2 (ja) | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板 | |
JP2003213019A (ja) | プリプレグ及びそれを用いたプリント配線板 | |
JP2004277671A (ja) | プリプレグおよびそれを用いたプリント配線板 | |
JP5428212B2 (ja) | 樹脂組成物、プリプレグおよびそれを用いたプリント配線板 | |
JP2015076589A (ja) | 積層板 | |
JP2019009195A (ja) | プリント配線板、プリプレグ、積層体及び半導体パッケージ | |
JP4150178B2 (ja) | 樹脂組成物、プリプレグ及びそれを用いたプリント配線板 | |
JP2015086293A (ja) | プリプレグ及び多層プリント配線板 | |
JP2006203142A (ja) | 半導体パッケージ用多層プリント配線板 | |
JP2017019970A (ja) | 樹脂組成物 | |
JP2003206360A (ja) | プリプレグ及びそれを用いたプリント配線板 | |
KR100644749B1 (ko) | 동박적층판 및 다층 인쇄회로 기판 | |
JP5140959B2 (ja) | 樹脂組成物、プリプレグ及びそれを用いたプリント配線板 | |
JP2019090059A (ja) | 熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200115 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210224 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210426 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210824 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210917 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6956388 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |