JP6947746B2 - 複合GaNナノカラムの製造方法 - Google Patents
複合GaNナノカラムの製造方法 Download PDFInfo
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- JP6947746B2 JP6947746B2 JP2018549432A JP2018549432A JP6947746B2 JP 6947746 B2 JP6947746 B2 JP 6947746B2 JP 2018549432 A JP2018549432 A JP 2018549432A JP 2018549432 A JP2018549432 A JP 2018549432A JP 6947746 B2 JP6947746 B2 JP 6947746B2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
- H10H20/818—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous within the light-emitting regions
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- C—CHEMISTRY; METALLURGY
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- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
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- C—CHEMISTRY; METALLURGY
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- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
- C30B29/62—Whiskers or needles
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- C—CHEMISTRY; METALLURGY
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- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
- C30B29/66—Crystals of complex geometrical shape, e.g. tubes, cylinders
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- H—ELECTRICITY
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- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/30—Cold cathodes, e.g. field-emissive cathode
- H01J1/308—Semiconductor cathodes, e.g. cathodes with PN junction layers
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/222—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PN heterojunction
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- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/127—The active layers comprising only Group III-V materials, e.g. GaAs or InP
- H10F71/1272—The active layers comprising only Group III-V materials, e.g. GaAs or InP comprising at least three elements, e.g. GaAlAs or InGaAsP
- H10F71/1274—The active layers comprising only Group III-V materials, e.g. GaAs or InP comprising at least three elements, e.g. GaAlAs or InGaAsP comprising nitrides, e.g. InGaN or InGaAlN
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- H10F71/127—The active layers comprising only Group III-V materials, e.g. GaAs or InP
- H10F71/1276—The active layers comprising only Group III-V materials, e.g. GaAs or InP comprising growth substrates not made of Group III-V materials
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- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/143—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies comprising quantum structures
- H10F77/1437—Quantum wires or nanorods
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- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
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- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/147—Shapes of bodies
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/821—Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/544—Solar cells from Group III-V materials
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Geometry (AREA)
- Nanotechnology (AREA)
- Led Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562267117P | 2015-12-14 | 2015-12-14 | |
| US62/267,117 | 2015-12-14 | ||
| US15/377,775 | 2016-12-13 | ||
| US15/377,775 US11322652B2 (en) | 2015-12-14 | 2016-12-13 | Methods for producing composite GaN nanocolumns and light emitting structures made from the methods |
| PCT/US2016/066729 WO2017106387A1 (en) | 2015-12-14 | 2016-12-14 | METHODS FOR PRODUCING COMPOSITE GaN NANOCOLUMNS AND LIGHT EMITTING STRUCTURES MADE FROM THE METHODS |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019502273A JP2019502273A (ja) | 2019-01-24 |
| JP2019502273A5 JP2019502273A5 (enExample) | 2020-01-30 |
| JP6947746B2 true JP6947746B2 (ja) | 2021-10-13 |
Family
ID=59020145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018549432A Expired - Fee Related JP6947746B2 (ja) | 2015-12-14 | 2016-12-14 | 複合GaNナノカラムの製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11322652B2 (enExample) |
| JP (1) | JP6947746B2 (enExample) |
| KR (1) | KR20180095608A (enExample) |
| CN (1) | CN108604538A (enExample) |
| TW (1) | TWI740865B (enExample) |
| WO (1) | WO2017106387A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11322652B2 (en) * | 2015-12-14 | 2022-05-03 | Ostendo Technologies, Inc. | Methods for producing composite GaN nanocolumns and light emitting structures made from the methods |
| CN109148654B (zh) * | 2018-08-30 | 2020-04-07 | 芜湖德豪润达光电科技有限公司 | 非极性面ⅲ族氮化物外延结构及其制备方法 |
| US10854646B2 (en) * | 2018-10-19 | 2020-12-01 | Attollo Engineering, LLC | PIN photodetector |
| DE112019006510T5 (de) * | 2019-03-12 | 2021-09-23 | Ulvac, Inc. | Vakuumabscheidungsvorrichtung |
| US11637219B2 (en) | 2019-04-12 | 2023-04-25 | Google Llc | Monolithic integration of different light emitting structures on a same substrate |
| CN110993755B (zh) * | 2019-12-18 | 2021-09-21 | 天津工业大学 | 电注入三维GaN核壳结构Nano-LED及制造方法 |
| WO2024084634A1 (ja) * | 2022-10-19 | 2024-04-25 | 京セラ株式会社 | 半導体基板、半導体基板の製造方法および製造装置 |
| CN116705889B (zh) * | 2023-06-28 | 2024-02-27 | 北京科技大学 | 梯度应变调控的范德华异质结型光电探测器及其制备方法 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003089695A1 (en) * | 2002-04-15 | 2003-10-30 | The Regents Of The University Of California | Non-polar a-plane gallium nitride thin films grown by metalorganic chemical vapor deposition |
| KR20060127743A (ko) * | 2005-06-06 | 2006-12-13 | 스미토모덴키고교가부시키가이샤 | 질화물 반도체 기판과 그 제조 방법 |
| JP2007048869A (ja) * | 2005-08-09 | 2007-02-22 | Sony Corp | GaN系半導体発光素子の製造方法 |
| CN101443887B (zh) * | 2006-03-10 | 2011-04-20 | Stc.Unm公司 | Gan纳米线的脉冲式生长及在族ⅲ氮化物半导体衬底材料中的应用和器件 |
| AU2007313096B2 (en) | 2006-03-10 | 2011-11-10 | Unm Rainforest Innovations | Pulsed growth of GaN nanowires and applications in group III nitride semiconductor substrate materials and devices |
| JP5082752B2 (ja) * | 2006-12-21 | 2012-11-28 | 日亜化学工業株式会社 | 半導体発光素子用基板の製造方法及びそれを用いた半導体発光素子 |
| US8964020B2 (en) * | 2007-04-25 | 2015-02-24 | Stc.Unm | Solid-state microscope for selectively imaging a sample |
| US8652947B2 (en) | 2007-09-26 | 2014-02-18 | Wang Nang Wang | Non-polar III-V nitride semiconductor and growth method |
| US7745315B1 (en) | 2007-10-03 | 2010-06-29 | Sandia Corporation | Highly aligned vertical GaN nanowires using submonolayer metal catalysts |
| US8188513B2 (en) * | 2007-10-04 | 2012-05-29 | Stc.Unm | Nanowire and larger GaN based HEMTS |
| CN101685774B (zh) * | 2008-09-24 | 2012-06-13 | 北京邮电大学 | 一种基于界面纳米结构的异质外延生长工艺 |
| US8338818B1 (en) * | 2008-12-19 | 2012-12-25 | Stc.Unm | Nanowires, nanowire networks and methods for their formation and use |
| KR20100093872A (ko) * | 2009-02-17 | 2010-08-26 | 삼성엘이디 주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
| CN103098216A (zh) * | 2010-06-24 | 2013-05-08 | Glo公司 | 具有用于定向纳米线生长的缓冲层的衬底 |
| US8409892B2 (en) * | 2011-04-14 | 2013-04-02 | Opto Tech Corporation | Method of selective photo-enhanced wet oxidation for nitride layer regrowth on substrates |
| US9080980B2 (en) * | 2011-07-27 | 2015-07-14 | Hewlett-Packard Development Company, L.P. | Surface enhanced raman spectroscopy employing a nanorod in a surface indentation |
| CN103531447B (zh) * | 2012-07-06 | 2016-03-16 | 中国科学院金属研究所 | 一种降低氮化镓纳米线阵列晶体缺陷密度的方法 |
| WO2014066379A1 (en) * | 2012-10-26 | 2014-05-01 | Glo Ab | Nanowire sized opto-electronic structure and method for modifying selected portions of same |
| US11502219B2 (en) | 2013-03-14 | 2022-11-15 | The Royal Institution For The Advancement Of Learning/Mcgill University | Methods and devices for solid state nanowire devices |
| KR102070209B1 (ko) * | 2013-07-01 | 2020-01-28 | 엘지전자 주식회사 | 성장기판 및 그를 포함하는 발광소자 |
| US9171843B2 (en) | 2013-08-02 | 2015-10-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and fabricating the same |
| US9053890B2 (en) * | 2013-08-02 | 2015-06-09 | University Health Network | Nanostructure field emission cathode structure and method for making |
| TWI621278B (zh) | 2013-12-17 | 2018-04-11 | 瑞典商Glo公司 | 具有應變改質表面活性區域之第三族氮化物奈米線led及其製造方法 |
| KR102140741B1 (ko) * | 2014-02-18 | 2020-08-03 | 엘지전자 주식회사 | 무분극 이종 기판 및 그 제조방법, 이를 이용한 질화물 반도체 발광 소자 |
| FR3019188B1 (fr) * | 2014-03-27 | 2017-11-24 | Commissariat Energie Atomique | Procede de croissance d'un element allonge a partir d'un germe forme dans un creux d'une couche ou d'un plot de nucleation |
| US9773889B2 (en) * | 2014-07-18 | 2017-09-26 | Taiwan Semiconductor Manufacturing Company Limited | Method of semiconductor arrangement formation |
| US11322652B2 (en) * | 2015-12-14 | 2022-05-03 | Ostendo Technologies, Inc. | Methods for producing composite GaN nanocolumns and light emitting structures made from the methods |
-
2016
- 2016-12-13 US US15/377,775 patent/US11322652B2/en active Active
- 2016-12-14 CN CN201680081684.XA patent/CN108604538A/zh active Pending
- 2016-12-14 KR KR1020187020188A patent/KR20180095608A/ko not_active Ceased
- 2016-12-14 WO PCT/US2016/066729 patent/WO2017106387A1/en not_active Ceased
- 2016-12-14 TW TW105141477A patent/TWI740865B/zh not_active IP Right Cessation
- 2016-12-14 JP JP2018549432A patent/JP6947746B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW201737317A (zh) | 2017-10-16 |
| TWI740865B (zh) | 2021-10-01 |
| US11322652B2 (en) | 2022-05-03 |
| KR20180095608A (ko) | 2018-08-27 |
| JP2019502273A (ja) | 2019-01-24 |
| WO2017106387A1 (en) | 2017-06-22 |
| CN108604538A (zh) | 2018-09-28 |
| US20170170363A1 (en) | 2017-06-15 |
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