JP6947746B2 - 複合GaNナノカラムの製造方法 - Google Patents

複合GaNナノカラムの製造方法 Download PDF

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JP6947746B2
JP6947746B2 JP2018549432A JP2018549432A JP6947746B2 JP 6947746 B2 JP6947746 B2 JP 6947746B2 JP 2018549432 A JP2018549432 A JP 2018549432A JP 2018549432 A JP2018549432 A JP 2018549432A JP 6947746 B2 JP6947746 B2 JP 6947746B2
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nanocolumn
gan
growth
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substrate
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JP2019502273A (ja
JP2019502273A5 (enExample
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ヴォルコヴァ,アンナ
イヴァンツォフ,ウラジミール
シルキン,アレクサンダー
ハスケル,ベンジャミン
エル−ゴロウリー,フセイン
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オステンド・テクノロジーズ・インコーポレーテッド
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    • H10H20/817Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
    • H10H20/818Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous within the light-emitting regions
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    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
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    • C30B29/66Crystals of complex geometrical shape, e.g. tubes, cylinders
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    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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    • H10F71/1272The active layers comprising only Group III-V materials, e.g. GaAs or InP comprising at least three elements, e.g. GaAlAs or InGaAsP
    • H10F71/1274The active layers comprising only Group III-V materials, e.g. GaAs or InP comprising at least three elements, e.g. GaAlAs or InGaAsP comprising nitrides, e.g. InGaN or InGaAlN
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JP2018549432A 2015-12-14 2016-12-14 複合GaNナノカラムの製造方法 Expired - Fee Related JP6947746B2 (ja)

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US201562267117P 2015-12-14 2015-12-14
US62/267,117 2015-12-14
US15/377,775 2016-12-13
US15/377,775 US11322652B2 (en) 2015-12-14 2016-12-13 Methods for producing composite GaN nanocolumns and light emitting structures made from the methods
PCT/US2016/066729 WO2017106387A1 (en) 2015-12-14 2016-12-14 METHODS FOR PRODUCING COMPOSITE GaN NANOCOLUMNS AND LIGHT EMITTING STRUCTURES MADE FROM THE METHODS

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JP2019502273A5 JP2019502273A5 (enExample) 2020-01-30
JP6947746B2 true JP6947746B2 (ja) 2021-10-13

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US (1) US11322652B2 (enExample)
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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11322652B2 (en) * 2015-12-14 2022-05-03 Ostendo Technologies, Inc. Methods for producing composite GaN nanocolumns and light emitting structures made from the methods
CN109148654B (zh) * 2018-08-30 2020-04-07 芜湖德豪润达光电科技有限公司 非极性面ⅲ族氮化物外延结构及其制备方法
US10854646B2 (en) * 2018-10-19 2020-12-01 Attollo Engineering, LLC PIN photodetector
DE112019006510T5 (de) * 2019-03-12 2021-09-23 Ulvac, Inc. Vakuumabscheidungsvorrichtung
US11637219B2 (en) 2019-04-12 2023-04-25 Google Llc Monolithic integration of different light emitting structures on a same substrate
CN110993755B (zh) * 2019-12-18 2021-09-21 天津工业大学 电注入三维GaN核壳结构Nano-LED及制造方法
WO2024084634A1 (ja) * 2022-10-19 2024-04-25 京セラ株式会社 半導体基板、半導体基板の製造方法および製造装置
CN116705889B (zh) * 2023-06-28 2024-02-27 北京科技大学 梯度应变调控的范德华异质结型光电探测器及其制备方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003089695A1 (en) * 2002-04-15 2003-10-30 The Regents Of The University Of California Non-polar a-plane gallium nitride thin films grown by metalorganic chemical vapor deposition
KR20060127743A (ko) * 2005-06-06 2006-12-13 스미토모덴키고교가부시키가이샤 질화물 반도체 기판과 그 제조 방법
JP2007048869A (ja) * 2005-08-09 2007-02-22 Sony Corp GaN系半導体発光素子の製造方法
CN101443887B (zh) * 2006-03-10 2011-04-20 Stc.Unm公司 Gan纳米线的脉冲式生长及在族ⅲ氮化物半导体衬底材料中的应用和器件
AU2007313096B2 (en) 2006-03-10 2011-11-10 Unm Rainforest Innovations Pulsed growth of GaN nanowires and applications in group III nitride semiconductor substrate materials and devices
JP5082752B2 (ja) * 2006-12-21 2012-11-28 日亜化学工業株式会社 半導体発光素子用基板の製造方法及びそれを用いた半導体発光素子
US8964020B2 (en) * 2007-04-25 2015-02-24 Stc.Unm Solid-state microscope for selectively imaging a sample
US8652947B2 (en) 2007-09-26 2014-02-18 Wang Nang Wang Non-polar III-V nitride semiconductor and growth method
US7745315B1 (en) 2007-10-03 2010-06-29 Sandia Corporation Highly aligned vertical GaN nanowires using submonolayer metal catalysts
US8188513B2 (en) * 2007-10-04 2012-05-29 Stc.Unm Nanowire and larger GaN based HEMTS
CN101685774B (zh) * 2008-09-24 2012-06-13 北京邮电大学 一种基于界面纳米结构的异质外延生长工艺
US8338818B1 (en) * 2008-12-19 2012-12-25 Stc.Unm Nanowires, nanowire networks and methods for their formation and use
KR20100093872A (ko) * 2009-02-17 2010-08-26 삼성엘이디 주식회사 질화물 반도체 발광소자 및 그 제조방법
CN103098216A (zh) * 2010-06-24 2013-05-08 Glo公司 具有用于定向纳米线生长的缓冲层的衬底
US8409892B2 (en) * 2011-04-14 2013-04-02 Opto Tech Corporation Method of selective photo-enhanced wet oxidation for nitride layer regrowth on substrates
US9080980B2 (en) * 2011-07-27 2015-07-14 Hewlett-Packard Development Company, L.P. Surface enhanced raman spectroscopy employing a nanorod in a surface indentation
CN103531447B (zh) * 2012-07-06 2016-03-16 中国科学院金属研究所 一种降低氮化镓纳米线阵列晶体缺陷密度的方法
WO2014066379A1 (en) * 2012-10-26 2014-05-01 Glo Ab Nanowire sized opto-electronic structure and method for modifying selected portions of same
US11502219B2 (en) 2013-03-14 2022-11-15 The Royal Institution For The Advancement Of Learning/Mcgill University Methods and devices for solid state nanowire devices
KR102070209B1 (ko) * 2013-07-01 2020-01-28 엘지전자 주식회사 성장기판 및 그를 포함하는 발광소자
US9171843B2 (en) 2013-08-02 2015-10-27 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and fabricating the same
US9053890B2 (en) * 2013-08-02 2015-06-09 University Health Network Nanostructure field emission cathode structure and method for making
TWI621278B (zh) 2013-12-17 2018-04-11 瑞典商Glo公司 具有應變改質表面活性區域之第三族氮化物奈米線led及其製造方法
KR102140741B1 (ko) * 2014-02-18 2020-08-03 엘지전자 주식회사 무분극 이종 기판 및 그 제조방법, 이를 이용한 질화물 반도체 발광 소자
FR3019188B1 (fr) * 2014-03-27 2017-11-24 Commissariat Energie Atomique Procede de croissance d'un element allonge a partir d'un germe forme dans un creux d'une couche ou d'un plot de nucleation
US9773889B2 (en) * 2014-07-18 2017-09-26 Taiwan Semiconductor Manufacturing Company Limited Method of semiconductor arrangement formation
US11322652B2 (en) * 2015-12-14 2022-05-03 Ostendo Technologies, Inc. Methods for producing composite GaN nanocolumns and light emitting structures made from the methods

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TW201737317A (zh) 2017-10-16
TWI740865B (zh) 2021-10-01
US11322652B2 (en) 2022-05-03
KR20180095608A (ko) 2018-08-27
JP2019502273A (ja) 2019-01-24
WO2017106387A1 (en) 2017-06-22
CN108604538A (zh) 2018-09-28
US20170170363A1 (en) 2017-06-15

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