JP6940589B2 - 堆積装置 - Google Patents
堆積装置 Download PDFInfo
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- JP6940589B2 JP6940589B2 JP2019505240A JP2019505240A JP6940589B2 JP 6940589 B2 JP6940589 B2 JP 6940589B2 JP 2019505240 A JP2019505240 A JP 2019505240A JP 2019505240 A JP2019505240 A JP 2019505240A JP 6940589 B2 JP6940589 B2 JP 6940589B2
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- 238000004062 sedimentation Methods 0.000 title 1
- 239000007789 gas Substances 0.000 claims description 122
- 239000000758 substrate Substances 0.000 claims description 91
- 239000000463 material Substances 0.000 claims description 87
- 238000001704 evaporation Methods 0.000 claims description 55
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 46
- 230000008020 evaporation Effects 0.000 claims description 34
- 229910052782 aluminium Inorganic materials 0.000 claims description 33
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 22
- 238000000151 deposition Methods 0.000 claims description 10
- 230000008859 change Effects 0.000 claims description 7
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims 10
- 229910001882 dioxygen Inorganic materials 0.000 claims 10
- 238000011144 upstream manufacturing Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 description 85
- 230000004888 barrier function Effects 0.000 description 16
- 230000003287 optical effect Effects 0.000 description 12
- 238000000576 coating method Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 230000001276 controlling effect Effects 0.000 description 8
- 238000006073 displacement reaction Methods 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 239000011364 vaporized material Substances 0.000 description 7
- 239000011888 foil Substances 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000005137 deposition process Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 238000002207 thermal evaporation Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 1
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 1
- 239000005025 cast polypropylene Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000005026 oriented polypropylene Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000004092 self-diagnosis Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/146—By vapour deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
- C23C14/0063—Reactive sputtering characterised by means for introducing or removing gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
- C23C14/0084—Producing gradient compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/027—Graded interfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/081—Oxides of aluminium, magnesium or beryllium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
Description
ガス供給パイプは、蒸発した材料の蒸気の中へと方向付けられるガス供給をもたらすための複数の排出口を含む。さらに、蒸発装置は、複数の排出口の位置が、蒸発した材料の蒸気の中へと方向付けられるガス供給の位置を変更するために、調節可能であるように構成されている。
Claims (10)
- 処理ドラム(170)によって支持されたフレキシブル基板(160)上に材料を堆積するための蒸発装置(100)、及び前記蒸発装置(100)の上流側に配置され且つ前記フレキシブル基板上にパターン化されたオイル層をプリントするように構成されたオイルプリンティングモジュール(101)を備えている蒸発システム(400)であって、
前記蒸発装置(100)が、
前記フレキシブル基板(160)上に堆積されるべき蒸発したアルミニウムの蒸気(151)を生成するための、第1の方向に沿って第1のライン(120)で整列した蒸発るつぼの第1の組(110)、及び
前記蒸発るつぼの第1の組(110)のうちの蒸発るつぼと前記処理ドラム(170)との間に配置され、前記第1の方向に延在する単一のガス供給パイプ(130)を備え、
前記ガス供給パイプ(130)が、前記蒸発したアルミニウムの蒸気の中へと方向付けられる酸素ガス供給をもたらすための複数の排出口(133)を備え、
前記複数の排出口の位置が、前記蒸発したアルミニウムの蒸気の中へと方向付けられる前記酸素ガス供給の位置を変更するために、調節可能であり、
前記酸素ガス供給の前記位置が、前記ガス供給パイプの初期位置に対して、前記第1の方向に対して垂直な平面内で前記ガス供給パイプを再配置することにより、また前記ガス供給パイプの長手方向軸を中心に前記ガス供給パイプを回転することにより、調節可能である、
蒸発システム(400)。 - 前記蒸発るつぼの第1の組(110)の前記第1のライン(120)が、前記蒸発るつぼの第1の組(110)における蒸発るつぼのうちの少なくとも2つの中心を通して画定され、前記酸素ガス供給の前記位置が、前記第1の方向と異なる第2の方向に調節可能であり、前記第2の方向が前記第1のライン(120)に対して垂直である、請求項1に記載の蒸発システム(400)。
- 前記蒸発したアルミニウムの蒸気(151)の中へと方向付けられた前記酸素ガス供給の前記位置を調節するために前記ガス供給パイプ(130)の前記位置を調節するように構成された位置決めデバイス(135)をさらに備えている、請求項1又は2に記載の蒸発システム(400)。
- 前記酸素ガス供給の前記位置が、±80mmの位置決め範囲内の、前記第1の方向に対して垂直な前記平面内で調節可能である、請求項1から3のいずれか一項に記載の蒸発システム(400)。
- 前記フレキシブル基板(160)上に堆積されるべき蒸発したアルミニウムのさらなる蒸気(152)を生成するために、前記第1の方向に沿って第2のライン(190)で整列した蒸発るつぼの第2の組(180)をさらに備え、前記蒸発るつぼの第2の組(180)の前記第2のライン(190)が、前記蒸発るつぼの第2の組(180)における蒸発るつぼのうちの少なくとも2つの中心を通して画定され、前記第1のライン(120)及び前記第2のライン(190)が、前記第1の方向に対して実質的に垂直方向で、互いに対して変位している、請求項1から4のいずれか一項に記載の蒸発システム(400)。
- 前記第1のライン(120)及び前記第2のライン(190)が、20mmから90mmの間の範囲内で互いに対して変位している、請求項5に記載の蒸発システム(400)。
- 前記蒸発るつぼの第1の組(110)及び前記蒸発るつぼの第2の組(180)が、互い違いに配置されている、請求項5又は6に記載の蒸発システム(400)。
- アルミニウム及び酸化アルミニウムを有する勾配層を製造するための方法(200)であって、
処理ドラム(170)によって支持されたフレキシブル基板上にパターン化されたオイル層をプリントすることと、
パターン化された前記オイル層を蒸発させるために、また、前記オイル層がない前記フレキシブル基板(160)の領域上にアルミニウムの層を堆積するために、蒸発したアルミニウムの蒸気(151)が生成されるように、第1の方向に沿って第1のライン(120)で整列した蒸発るつぼの第1の組(110)からアルミニウムを蒸発させること(210)と、
前記フレキシブル基板上に酸化アルミニウムを堆積するために、単一のガス供給パイプ(130)の複数の排出口(133)を通して、前記蒸発したアルミニウムの蒸気(151)の中へと方向付けられる酸素ガス供給をもたらすこと(220)と、
前記ガス供給パイプの初期位置に対して、前記第1の方向に対して垂直な平面内で前記ガス供給パイプを再配置することにより、また前記ガス供給パイプの長手方向軸を中心に前記ガス供給パイプを回転することにより、前記蒸発したアルミニウムの蒸気(151)の中へと方向付けられる前記酸素ガス供給の位置を調節することによって、前記勾配層の酸化アルミニウムの勾配を調節すること(230)と
を含む方法。 - 前記フレキシブル基板上に堆積されるべき蒸発したアルミニウムのさらなる蒸気(152)を生成するために、前記第1の方向に沿って第2のライン(190)で整列した蒸発るつぼ(180)の第2の組からアルミニウムを蒸発させること(240)をさらに含む、請求項8のいずれか一項に記載の方法(200)。
- 前記勾配層の酸化アルミニウムの前記勾配を調節すること(230)が、前記処理ドラムの回転軸と前記蒸発るつぼの第1の組のうちの蒸発るつぼとの間の中央領域における蒸発したアルミニウムの前記蒸気の中へと方向付けられる前記酸素ガス供給を位置決めすることによって、酸化アルミニウムの含有量を増大させることを含み、又は、前記勾配層の酸化アルミニウムの前記勾配を調節すること(230)が、前記処理ドラムと前記蒸発るつぼの第1の組のうちの蒸発るつぼとの間の、側縁領域における前記蒸発したアルミニウムの蒸気の中へと方向付けられる前記酸素ガス供給を位置決めすることによって、酸化アルミニウムの含有量を減少させることを含む、請求項8又は9に記載の方法(200)。
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Application Number | Priority Date | Filing Date | Title |
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PCT/EP2016/068327 WO2018024313A1 (en) | 2016-08-01 | 2016-08-01 | Deposition apparatus |
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JP2019523349A JP2019523349A (ja) | 2019-08-22 |
JP6940589B2 true JP6940589B2 (ja) | 2021-09-29 |
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US (1) | US11058010B2 (ja) |
EP (1) | EP3491161B1 (ja) |
JP (1) | JP6940589B2 (ja) |
CN (1) | CN109563607A (ja) |
TW (1) | TWI649443B (ja) |
WO (1) | WO2018024313A1 (ja) |
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WO2019240802A1 (en) * | 2018-06-14 | 2019-12-19 | Applied Materials, Inc. | Evaporator for depositing material on a substrate, method of forming an evaporator, and evaporation apparatus for depositing material on a flexible substrate |
CN112703271A (zh) | 2018-09-03 | 2021-04-23 | 应用材料公司 | 用于薄膜沉积的直接液体注射系统 |
US20220220602A1 (en) | 2019-05-31 | 2022-07-14 | Toyobo Co., Ltd. | Transparent gas barrier film and method for producing same |
US20210126247A1 (en) * | 2019-10-28 | 2021-04-29 | Applied Materials, Inc. | Dielectric coated lithium metal anode |
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JP2716295B2 (ja) * | 1991-09-13 | 1998-02-18 | 健 増本 | 傾斜機能薄膜 |
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2016
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JP2019523349A (ja) | 2019-08-22 |
WO2018024313A1 (en) | 2018-02-08 |
EP3491161B1 (en) | 2023-06-07 |
EP3491161A1 (en) | 2019-06-05 |
TWI649443B (zh) | 2019-02-01 |
CN109563607A (zh) | 2019-04-02 |
US11058010B2 (en) | 2021-07-06 |
TW201809331A (zh) | 2018-03-16 |
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