JP6938837B2 - フレキシブルディスプレイ素子基板用ポリイミドフィルム - Google Patents
フレキシブルディスプレイ素子基板用ポリイミドフィルム Download PDFInfo
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Description
Claims (9)
- ポリイミドフィルムであって、
100〜350℃区間の熱膨張係数(A)と
350〜450℃区間の熱膨張係数(B)が、
0<B/A<2を満足し、
4,4'−パラフェニレンジアミン(pPDA)1molに対して、
3,3',4,4'−ビフェニルカルボン酸二無水物(s−BPDA)1mol未満のmol比で重合され、
無水フタル酸(PA)を添加して末端が封止されたポリイミドで製造され、
前記ポリイミドフィルムは、ポリイミド前駆体溶液を最終硬化温度450℃以上で硬化させて製膜され、
前記3,3',4,4'−ビフェニルカルボン酸二無水物(s−BPDA)及び4,4'−パラフェニレンジアミン(pPDA)のmol比が、0.98:1〜0.99:1であり、
前記無水フタル酸(PA)を含む末端封止剤が、4,4'−パラフェニレンジアミン(pPDA)1molに対して0.02〜0.025mol比で重合される、
ポリイミドフィルム。 - 100〜350℃区間の熱膨張係数(A)と
350〜450℃区間の熱膨張係数(B)が、
0<B−A<1を満足する
請求項1に記載のポリイミドフィルム。 - 前記ポリイミドフィルムは、
350℃以上の温度で熱膨張係数(CTE)が正(+)の値を有する
請求項1または2に記載のポリイミドフィルム。 - 前記ポリイミドフィルムの透過度が、70%以上である
請求項1から3のいずれか1項に記載のポリイミドフィルム。 - 1次昇温後、冷却されたポリイミドフィルムを50℃から450℃に2次昇温時に測定された熱膨張係数(CTE)は、
0以上7ppm/℃以下の値を有する
請求項1から4のいずれか1項に記載のポリイミドフィルム。 - ポリイミドフィルムであって、
100〜350℃区間の熱膨張係数(A)と
350〜450℃区間の熱膨張係数(B)が、
0<B/A<2を満足し、
1次昇温後、冷却されたポリイミドフィルムを50℃から450℃に2次昇温時に測定された熱膨張係数(CTE)は、
0以上7ppm/℃以下の値を有し、
前記ポリイミドフィルムは、ポリイミド前駆体溶液を最終硬化温度450℃以上で硬化させて製膜され、
3,3',4,4'−ビフェニルカルボン酸二無水物(s−BPDA)及び4,4'−パラフェニレンジアミン(pPDA)のmol比が、0.98:1〜0.99:1であり、
無水フタル酸(PA)を含む末端封止剤が、4,4'−パラフェニレンジアミン(pPDA)1molに対して0.02〜0.025mol比で重合される、
ポリイミドフィルム。 - 請求項1から6のいずれか1項に記載のポリイミドフィルムを製造するための方法であって、
重合溶媒に4,4'−パラフェニレンジアミン(pPDA)1molに対して、3,3',4,4'−ビフェニルカルボン酸二無水物(s−BPDA)を1mol未満に含む重合成分及び末端封止剤として無水フタル酸(PA)を添加してポリイミド前駆体を製造する段階と、
前記ポリイミド前駆体及び有機溶媒を含むポリイミド前駆体溶液を製造する段階と、
前記ポリイミド前駆体溶液を基板上に塗布する段階と、
前記塗布されたポリイミド前駆体溶液を乾燥及び加熱する段階と、
を含む
ポリイミドフィルムの製造方法。 - ポリイミドフィルムを製造するための方法であって、
重合溶媒に4,4'−パラフェニレンジアミン(pPDA)1molに対して、3,3',4,4'−ビフェニルカルボン酸二無水物(s−BPDA)を1mol未満に含む重合成分及び末端封止剤として無水フタル酸(PA)を添加してポリイミド前駆体を製造する段階と、
前記ポリイミド前駆体及び有機溶媒を含むポリイミド前駆体溶液を製造する段階と、
前記ポリイミド前駆体溶液を基板上に塗布する段階と、
前記塗布されたポリイミド前駆体溶液を乾燥及び加熱する段階と、
を含み、
前記ポリイミドフィルムは、
100〜350℃区間の熱膨張係数(A)と
350〜450℃区間の熱膨張係数(B)が、
0<B/A<2を満足し、
前記ポリイミドフィルムは、ポリイミド前駆体溶液を最終硬化温度450℃以上で硬化させて製膜され、
前記3,3',4,4'−ビフェニルカルボン酸二無水物(s−BPDA)及び4,4'−パラフェニレンジアミン(pPDA)のmol比が、0.98:1〜0.99:1であり、
前記無水フタル酸(PA)を含む末端封止剤が、4,4'−パラフェニレンジアミン(pPDA)1molに対して0.02〜0.025mol比で重合される、
ポリイミドフィルムの製造方法。 - 請求項1から請求項6のうち何れか一項に記載のポリイミドフィルムを基板として含む
フレキシブルディスプレイ素子。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2017-0112323 | 2017-09-04 | ||
KR1020170112323A KR101907320B1 (ko) | 2017-09-04 | 2017-09-04 | 플렉서블 디스플레이 소자 기판용 폴리이미드 필름 |
KR10-2017-0172005 | 2017-12-14 | ||
KR1020170172005A KR20190071195A (ko) | 2017-12-14 | 2017-12-14 | 플렉서블 디스플레이 소자 기판용 폴리이미드 필름 |
PCT/KR2018/009818 WO2019045376A1 (ko) | 2017-09-04 | 2018-08-27 | 플렉서블 디스플레이 소자 기판용 폴리이미드 필름 |
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JP2020509127A JP2020509127A (ja) | 2020-03-26 |
JP6938837B2 true JP6938837B2 (ja) | 2021-09-22 |
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US (1) | US11485859B2 (ja) |
EP (1) | EP3680282A4 (ja) |
JP (1) | JP6938837B2 (ja) |
CN (1) | CN110494475B (ja) |
TW (1) | TWI683839B (ja) |
WO (1) | WO2019045376A1 (ja) |
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KR102262507B1 (ko) * | 2019-02-14 | 2021-06-08 | 주식회사 엘지화학 | 폴리이미드 전구체 조성물 및 이를 이용하여 제조된 폴리이미드 필름 |
CN112500570B (zh) * | 2021-02-04 | 2021-05-25 | 武汉柔显科技股份有限公司 | 柔性显示器件及显示器用聚酰胺酸清漆、聚酰亚胺薄膜 |
KR102634467B1 (ko) * | 2021-08-20 | 2024-02-06 | 에스케이마이크로웍스 주식회사 | 폴리아마이드-이미드계 필름, 이의 제조방법, 및 이를 포함하는 커버 윈도우 및 디스플레이 장치 |
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KR101748928B1 (ko) | 2015-02-04 | 2017-07-03 | 주식회사 엘지화학 | 액정 배향막 조성물 및 액정 배향막 |
US10508175B2 (en) | 2015-03-27 | 2019-12-17 | Samsung Electronics Co., Ltd. | Composition and polyamideimide composite and polyamideimide film and electronic device |
KR102502596B1 (ko) | 2015-03-27 | 2023-02-22 | 삼성전자주식회사 | 조성물, 이로부터 제조된 복합체, 및 이를 포함하는 필름 및 전자 소자 |
US9975997B2 (en) | 2015-03-27 | 2018-05-22 | Samsung Electronics Co., Ltd. | Compositions, composites prepared therefrom, and films and electronic devices including the same |
KR20160118962A (ko) | 2015-04-03 | 2016-10-12 | 스미토모 베이클리트 컴퍼니 리미티드 | 프리프레그, 수지 기판, 금속 부착 적층판, 프린트 배선 기판, 및 반도체 장치 |
KR102096609B1 (ko) | 2016-03-31 | 2020-04-02 | 단국대학교 천안캠퍼스 산학협력단 | 직선 및 곡선의 패턴을 도포할 수 있는 다이나믹 3d 라미네이션 장치 |
KR20170069190A (ko) * | 2017-06-09 | 2017-06-20 | 코오롱인더스트리 주식회사 | 플라스틱 소재의 플렉서블 디스플레이 기판 |
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- 2018-08-27 JP JP2019546832A patent/JP6938837B2/ja active Active
- 2018-08-27 US US16/617,858 patent/US11485859B2/en active Active
- 2018-08-27 EP EP18852591.9A patent/EP3680282A4/en active Pending
- 2018-08-27 CN CN201880021220.9A patent/CN110494475B/zh active Active
- 2018-08-27 WO PCT/KR2018/009818 patent/WO2019045376A1/ko unknown
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WO2019045376A1 (ko) | 2019-03-07 |
TW201912678A (zh) | 2019-04-01 |
CN110494475A (zh) | 2019-11-22 |
JP2020509127A (ja) | 2020-03-26 |
US20200165452A1 (en) | 2020-05-28 |
US11485859B2 (en) | 2022-11-01 |
EP3680282A4 (en) | 2020-11-25 |
TWI683839B (zh) | 2020-02-01 |
CN110494475B (zh) | 2022-09-20 |
EP3680282A1 (en) | 2020-07-15 |
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