JP6932436B2 - 切削装置 - Google Patents

切削装置 Download PDF

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Publication number
JP6932436B2
JP6932436B2 JP2017102601A JP2017102601A JP6932436B2 JP 6932436 B2 JP6932436 B2 JP 6932436B2 JP 2017102601 A JP2017102601 A JP 2017102601A JP 2017102601 A JP2017102601 A JP 2017102601A JP 6932436 B2 JP6932436 B2 JP 6932436B2
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JP
Japan
Prior art keywords
unit
cutting
light
cutting edge
edge detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017102601A
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English (en)
Japanese (ja)
Other versions
JP2018196920A (ja
Inventor
剛史 笠井
剛史 笠井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2017102601A priority Critical patent/JP6932436B2/ja
Priority to KR1020180053514A priority patent/KR102388222B1/ko
Priority to CN201810493357.6A priority patent/CN108943444B/zh
Priority to TW107117330A priority patent/TWI774771B/zh
Publication of JP2018196920A publication Critical patent/JP2018196920A/ja
Application granted granted Critical
Publication of JP6932436B2 publication Critical patent/JP6932436B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Mining & Mineral Resources (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Confectionery (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
JP2017102601A 2017-05-24 2017-05-24 切削装置 Active JP6932436B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017102601A JP6932436B2 (ja) 2017-05-24 2017-05-24 切削装置
KR1020180053514A KR102388222B1 (ko) 2017-05-24 2018-05-10 절삭 장치
CN201810493357.6A CN108943444B (zh) 2017-05-24 2018-05-22 切削装置
TW107117330A TWI774771B (zh) 2017-05-24 2018-05-22 切割裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017102601A JP6932436B2 (ja) 2017-05-24 2017-05-24 切削装置

Publications (2)

Publication Number Publication Date
JP2018196920A JP2018196920A (ja) 2018-12-13
JP6932436B2 true JP6932436B2 (ja) 2021-09-08

Family

ID=64499348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017102601A Active JP6932436B2 (ja) 2017-05-24 2017-05-24 切削装置

Country Status (4)

Country Link
JP (1) JP6932436B2 (zh)
KR (1) KR102388222B1 (zh)
CN (1) CN108943444B (zh)
TW (1) TWI774771B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7325203B2 (ja) * 2019-03-25 2023-08-14 株式会社ディスコ 加工装置
JP7325904B2 (ja) * 2019-07-26 2023-08-15 株式会社ディスコ 切削ユニットの位置検出方法、及び切削装置
CN110744731B (zh) * 2019-10-30 2021-07-27 许昌学院 一种基于光电控制的晶片切片设备
JP7354069B2 (ja) * 2020-08-26 2023-10-02 Ｔｏｗａ株式会社 切断装置、及び、切断品の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03261219A (ja) * 1990-03-09 1991-11-21 Omron Corp 光電スイッチ
JP2644642B2 (ja) * 1991-08-21 1997-08-25 株式会社東京精密 ブレード位置検出装置及びその信頼性の判定方法
JPH0947943A (ja) * 1995-08-10 1997-02-18 Disco Abrasive Syst Ltd ブレードの非接触セットアップ手段
JP4590058B2 (ja) 2000-04-12 2010-12-01 株式会社ディスコ 切削装置の切削ブレード検出機構
JP2002343745A (ja) * 2001-05-14 2002-11-29 Tokyo Seimitsu Co Ltd ダイシング装置
US6761615B2 (en) * 2001-11-01 2004-07-13 Advanced Dicing Technologies, Ltd. In-situ wear measurement apparatus for dicing saw blades
JP2007158641A (ja) * 2005-12-05 2007-06-21 Keyence Corp 光電センサ
JP5068621B2 (ja) * 2007-10-03 2012-11-07 株式会社ディスコ 切削装置
JP2009083077A (ja) * 2007-10-03 2009-04-23 Disco Abrasive Syst Ltd 切削ブレード検出機構
JP6294748B2 (ja) * 2014-04-23 2018-03-14 株式会社ディスコ 切削装置
JP6491044B2 (ja) * 2015-05-29 2019-03-27 Ｔｏｗａ株式会社 製造装置及び製造方法

Also Published As

Publication number Publication date
JP2018196920A (ja) 2018-12-13
TW201901787A (zh) 2019-01-01
CN108943444B (zh) 2021-11-19
KR20180128834A (ko) 2018-12-04
KR102388222B1 (ko) 2022-04-18
CN108943444A (zh) 2018-12-07
TWI774771B (zh) 2022-08-21

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