JP2021020268A - 切削ユニットの位置検出方法、及び切削装置 - Google Patents
切削ユニットの位置検出方法、及び切削装置 Download PDFInfo
- Publication number
- JP2021020268A JP2021020268A JP2019137608A JP2019137608A JP2021020268A JP 2021020268 A JP2021020268 A JP 2021020268A JP 2019137608 A JP2019137608 A JP 2019137608A JP 2019137608 A JP2019137608 A JP 2019137608A JP 2021020268 A JP2021020268 A JP 2021020268A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- unit
- cutting blade
- blade
- height position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 719
- 238000001514 detection method Methods 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 claims abstract description 54
- 230000008859 change Effects 0.000 claims abstract description 32
- 238000012545 processing Methods 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 40
- 238000006243 chemical reaction Methods 0.000 claims description 36
- 238000012937 correction Methods 0.000 claims description 25
- 238000013459 approach Methods 0.000 claims description 10
- 230000008569 process Effects 0.000 description 37
- 239000004065 semiconductor Substances 0.000 description 8
- 238000003384 imaging method Methods 0.000 description 7
- 238000003754 machining Methods 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 239000012530 fluid Substances 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 230000036962 time dependent Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/09—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool
- B23Q17/0904—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool before or after machining
- B23Q17/0919—Arrangements for measuring or adjusting cutting-tool geometry in presetting devices
- B23Q17/0923—Tool length
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/002—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring the holding action of work or tool holders
- B23Q17/003—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring the holding action of work or tool holders by measuring a position
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/10—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting speed or number of revolutions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/22—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work
- B23Q17/2283—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work for adjusting the distance between coaxially rotating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
- B23Q17/248—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves using special electromagnetic means or methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/026—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade carried by a movable arm, e.g. pivoted
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Abstract
Description
4 装置基台
6 X軸移動テーブル
8 チャックテーブル
8a 保持面
10 クランプ
12,24,30 ガイドレール
14,28,34 ボールねじ
16,28a,36 パルスモータ
18 切削ユニット
18a 切削ブレード
18b 刃先の下端
18c スピンドル
18d 切削水供給ノズル
20 排水路
22 支持構造
26,32 移動プレート
38 撮像ユニット(カメラ)
40 刃先位置検出ユニット
42 制御ユニット
44 本体
46 ブレード進入部
48 カバー
50 発光部
50a 光源
50b 発光窓
52 受光部
52a 光電変換部
52b 受光窓
54 電圧値比較部
56 基準電圧値登録部
58 切削ユニット高さ検出部
60 補正部
62 関係登録部
64 切削ユニット高さ登録部
66 電圧値の時間変化
68 基準電圧値
70,72 関係
Claims (3)
- 被加工物を保持面で保持するチャックテーブルと、
該保持面に平行な方向に沿ったスピンドルと、該スピンドルの先端に装着された切削ブレードと、を有し、該チャックテーブルに保持された該被加工物及び該切削ブレードに切削水を供給しながら該スピンドルの周りに回転する該切削ブレードで該被加工物を切削する切削ユニットと、
該保持面と直交する切り込み送り方向に該切削ユニットを切り込み送りさせる切り込み送りユニットと、
該切削ブレードの刃先の下端の高さ位置を検出する刃先位置検出ユニットと、
各構成要素を制御する制御ユニットと、を備え、
該刃先位置検出ユニットは、該切削ブレードが進入するブレード進入部と、該ブレード進入部を挟んで互いに対面する発光部及び受光部を備え、
該制御ユニットは、該発光部から発せられ該受光部で受光される光の受光量の経時変化を登録できる関係登録部を備える切削装置を使用した切削ユニットの位置検出方法であって、
該切り込み送りユニットで該刃先位置検出ユニットの該ブレード進入部に該切削ブレードを進入させ、該発光部で発せられ該受光部で受光される光が所定量遮られる高さに該切削ブレードを位置付ける切削ブレード位置付けステップと、
該切削ブレード位置付けステップの後、該切削ユニットの該切り込み送り方向での高さを維持した状態で、回転する該切削ブレードの熱膨張により経時変化する該受光量を観測し、観測開始からの時間と、該受光量の変化量と、の関係を該関係登録部に登録する関係登録ステップと、
該関係登録ステップの後、該被加工物を加工した後の該切削ブレードを該スピンドルの周りに回転させながら該刃先位置検出ユニットの該ブレード進入部に進入させ、該発光部で発せられ該受光部で受光される光が該所定量遮られる高さに該切削ブレードを位置付け、該切削ブレードの刃先の下端の高さが該所定の高さ位置となるときの該切削ユニットの高さ位置を基準高さ位置として割り出す高さ位置検出ステップと、を備え、
該高さ位置検出ステップでは、割り出された該切削ユニットの該基準高さ位置を該関係登録ステップで該関係登録部に登録された該関係により補正することを特徴とする切削ユニットの位置検出方法。 - 該関係登録ステップでは、該高さ位置検出ステップにおける該切削ブレードの回転数に対応する回転数で該切削ブレードを回転させることを特徴とする請求項1記載の切削ユニットの位置検出方法。
- 被加工物を保持面で保持するチャックテーブルと、
該保持面に平行な方向に沿ったスピンドルと、該スピンドルの先端に装着された切削ブレードと、を有し、該チャックテーブルに保持された該被加工物及び該切削ブレードに切削水を供給しながら該スピンドルの周りに回転する該切削ブレードで該被加工物を切削する切削ユニットと、
該保持面と直交する切り込み送り方向に該切削ユニットを切り込み送りさせる切り込み送りユニットと、
該切削ブレードの刃先の下端が所定の高さ位置となる際の該切削ユニットの高さ位置を基準高さ位置として検出する刃先位置検出ユニットと、
各構成要素を制御する制御ユニットと、を備え、
該刃先位置検出ユニットは、
該切削ブレードが進入するブレード進入部と、
該ブレード進入部を挟んで互いに対面する発光部及び受光部と、
該受光部で受光される光の受光量に応じた電圧値の電気信号を出力する光電変換部と、を有し、
該制御ユニットは、
該発光部から発せられ該受光部で受光される光の受光量の経時変化を該光電変換部が出力する電気信号の電圧値の経時変化として登録できる関係登録部と、
該切削ブレードの刃先の下端が該所定の高さ位置に位置付けられているときに該発光部で発せられた光が該受光部で受光される際に該光電変換部から出力される電気信号の電圧値が基準電圧値として登録される基準電圧値登録部と、
該光電変換部から出力される電気信号の電圧値が該基準電圧値登録部に登録された該基準電圧値と一致したときに該切削ブレードの刃先の下端が該所定の高さ位置に位置付けられていることを検出する電圧値比較部と、
該電圧値比較部に接続され、該切削ブレードの刃先の下端が該所定の高さ位置に位置付けられたことを該電圧値比較部が検出したときの該切削ユニットの高さを該基準高さ位置として検出する切削ユニット高さ検出部と、
該切削ユニット高さ検出部が検出した該切削ユニットの該基準高さ位置を補正する補正部と、を有し、
該関係登録部には、回転する該切削ブレードが熱膨張することで経時変化する該光電変換部が出力する該電気信号の電圧値と、時間と、の関係が登録されており、
該補正部は、該電圧値比較部が該切削ブレードの刃先の下端が該所定の高さ位置に位置付けられていることを検出した時間を参照して、該関係登録部に登録されている該関係から該切削ユニットの該基準高さ位置の補正量を決定することを特徴とする切削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019137608A JP7325904B2 (ja) | 2019-07-26 | 2019-07-26 | 切削ユニットの位置検出方法、及び切削装置 |
KR1020200073321A KR20210012901A (ko) | 2019-07-26 | 2020-06-17 | 절삭 유닛의 위치 검출 방법, 및 절삭 장치 |
CN202010708611.7A CN112297257B (zh) | 2019-07-26 | 2020-07-22 | 切削单元的位置检测方法和切削装置 |
TW109125030A TWI840594B (zh) | 2019-07-26 | 2020-07-24 | 切削單元的位置檢測方法、及切削裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019137608A JP7325904B2 (ja) | 2019-07-26 | 2019-07-26 | 切削ユニットの位置検出方法、及び切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021020268A true JP2021020268A (ja) | 2021-02-18 |
JP7325904B2 JP7325904B2 (ja) | 2023-08-15 |
Family
ID=74483563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019137608A Active JP7325904B2 (ja) | 2019-07-26 | 2019-07-26 | 切削ユニットの位置検出方法、及び切削装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7325904B2 (ja) |
KR (1) | KR20210012901A (ja) |
CN (1) | CN112297257B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116021654A (zh) * | 2023-04-02 | 2023-04-28 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | 一种晶片切割自动换刀装置及其换刀方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3101072B2 (ja) * | 1992-03-23 | 2000-10-23 | 西部電機株式会社 | Nc工作機械における刃先の経時変位補正装置 |
EP0737121B1 (en) * | 1994-10-31 | 1999-05-06 | Koninklijke Philips Electronics N.V. | Method of measuring a reference position of a tool relative to a workpiece, and machine tool for carrying out said method |
JP4590058B2 (ja) | 2000-04-12 | 2010-12-01 | 株式会社ディスコ | 切削装置の切削ブレード検出機構 |
JP2001293642A (ja) * | 2000-04-14 | 2001-10-23 | Toyoda Mach Works Ltd | 工具刃先部突出量測定方法及び工具摩耗量測定方法並びにその測定方法を用いた数値制御工作機械 |
JP2003251546A (ja) * | 2002-02-28 | 2003-09-09 | Toyoda Mach Works Ltd | 工具刃先測定方法及び装置 |
JP5452973B2 (ja) * | 2009-04-28 | 2014-03-26 | 富士機械製造株式会社 | 撮像装置及びその撮像装置を備える切削機械 |
US9263352B2 (en) | 2014-01-03 | 2016-02-16 | Asm Technology Singapore Pte Ltd | Singulation apparatus comprising an imaging device |
JP6727699B2 (ja) * | 2016-04-19 | 2020-07-22 | 株式会社ディスコ | 切削装置のセットアップ方法 |
JP6707396B2 (ja) | 2016-05-11 | 2020-06-10 | 株式会社ディスコ | 切削装置 |
JP6815824B2 (ja) | 2016-10-24 | 2021-01-20 | 株式会社ディスコ | 切削装置 |
JP6932436B2 (ja) * | 2017-05-24 | 2021-09-08 | 株式会社ディスコ | 切削装置 |
JP6983026B2 (ja) | 2017-10-06 | 2021-12-17 | 株式会社ディスコ | 切削装置 |
-
2019
- 2019-07-26 JP JP2019137608A patent/JP7325904B2/ja active Active
-
2020
- 2020-06-17 KR KR1020200073321A patent/KR20210012901A/ko unknown
- 2020-07-22 CN CN202010708611.7A patent/CN112297257B/zh active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116021654A (zh) * | 2023-04-02 | 2023-04-28 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | 一种晶片切割自动换刀装置及其换刀方法 |
Also Published As
Publication number | Publication date |
---|---|
CN112297257A (zh) | 2021-02-02 |
KR20210012901A (ko) | 2021-02-03 |
CN112297257B (zh) | 2024-03-12 |
TW202106441A (zh) | 2021-02-16 |
JP7325904B2 (ja) | 2023-08-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11171056B2 (en) | Wafer processing method | |
KR102413812B1 (ko) | 절삭 장치 | |
KR102232101B1 (ko) | 절삭 장치의 셋업 방법 | |
JP6732382B2 (ja) | 加工装置及び被加工物の加工方法 | |
JP2017135265A (ja) | パッケージウェーハの加工方法 | |
KR102388222B1 (ko) | 절삭 장치 | |
JP6125867B2 (ja) | 切削方法 | |
JP2021020268A (ja) | 切削ユニットの位置検出方法、及び切削装置 | |
JP2018147914A (ja) | 被加工物の切削方法 | |
CN110600395A (zh) | 处理装置 | |
KR102551970B1 (ko) | 절삭 장치의 셋업 방법 | |
JP7297385B2 (ja) | 切削装置、及び切削ブレードの管理方法 | |
JP2016159409A (ja) | 切削装置 | |
JP2019115962A (ja) | チャックテーブル修正方法及び切削装置 | |
JP2019046923A (ja) | ウエーハの加工方法 | |
TW202210224A (zh) | 加工裝置 | |
JP6808292B2 (ja) | 加工装置の診断方法 | |
JP5528245B2 (ja) | 切削方法 | |
JP2019016730A (ja) | 切削装置及び被加工物の分割方法 | |
TWI779194B (zh) | 工件加工方法 | |
JP6999227B2 (ja) | 切削ブレードの位置検出方法及び切削装置 | |
JP6099507B2 (ja) | 切削方法 | |
JP2022080757A (ja) | 切削ブレードの直径測定方法 | |
TW202400353A (zh) | 切割裝置以及修整方法 | |
JP2015047651A (ja) | バイト切削装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220520 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20230407 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230516 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230710 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230801 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230801 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7325904 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |