JP6929579B2 - ワーク処理装置 - Google Patents
ワーク処理装置 Download PDFInfo
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- JP6929579B2 JP6929579B2 JP2020144146A JP2020144146A JP6929579B2 JP 6929579 B2 JP6929579 B2 JP 6929579B2 JP 2020144146 A JP2020144146 A JP 2020144146A JP 2020144146 A JP2020144146 A JP 2020144146A JP 6929579 B2 JP6929579 B2 JP 6929579B2
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- 239000002002 slurry Substances 0.000 claims description 162
- 238000004140 cleaning Methods 0.000 claims description 87
- 239000007788 liquid Substances 0.000 claims description 45
- 238000005422 blasting Methods 0.000 claims description 35
- 238000000926 separation method Methods 0.000 claims description 22
- 239000006061 abrasive grain Substances 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 6
- 230000032258 transport Effects 0.000 description 25
- 239000000758 substrate Substances 0.000 description 8
- 238000011084 recovery Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Description
1 羽根車
2 ショットブラスト部
3 スラリ収納タンク部
4 スラリ搬送部
5 スラリ回収部
6 スラリ濃度分離部
7 ワーク搬送部
8 ワーク洗浄部
9 洗浄液収納タンク部
10 洗浄部
11 熱交換部
50 スラリ
50’ 高濃度スラリ
50” 低濃度スラリ
50a 液体
50b 砥粒
60 洗浄液
Claims (3)
- ワーク搬送部で搬送されるワークに、ショットブラスト部において液体と砥粒との混合物であるスラリを衝突させるワーク処理装置であって、前記ショットブラスト部は羽根車の回転により前記スラリを投射する構造であり、更に、前記スラリを収納するスラリ収納タンク部と、このスラリ収納タンク部から前記ショットブラスト部までスラリを搬送するスラリ搬送部と、前記ショットブラスト部で使用された使用済みのスラリを前記スラリ収納タンク部へ回収するスラリ回収部と、前記ショットブラスト部でのワークに対するショットブラスト後に該ワークを洗浄するワーク洗浄部を有し、前記スラリ搬送部には、高濃度スラリと低濃度スラリとに分離するスラリ濃度分離部が設けられ、このスラリ濃度分離部において分離された前記高濃度スラリは前記ショットブラスト部へ、また、前記低濃度スラリは前記ワーク洗浄部へ搬送されるように構成されていることを特徴とするワーク処理装置。
- 請求項1記載のワーク処理装置において、前記ワーク洗浄部よりも搬送下流側位置には、このワーク洗浄部で洗浄されたワークを洗浄液収納タンク部に収納された洗浄液で洗浄する洗浄部を有し、前記スラリ収納タンク部と前記洗浄液収納タンク部との間には熱交換部が設けられ、この熱交換部を介して前記スラリ収納タンク部に収納されたスラリの熱により前記洗浄液収納タンク部に収納された前記洗浄液が加温されるように構成されていることを特徴とするワーク処理装置。
- 請求項1,2いずれか1項に記載のワーク処理装置において、前記スラリ濃度分離部は、遠心分離法により高濃度スラリと低濃度スラリとに分離することを特徴とするワーク処理装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112020004778.4T DE112020004778T5 (de) | 2019-10-04 | 2020-09-08 | Werkstück-Bearbeitungsvorrichtung |
PCT/JP2020/033965 WO2021065381A1 (ja) | 2019-10-04 | 2020-09-08 | ワーク処理装置 |
CN202080030608.2A CN113767462A (zh) | 2019-10-04 | 2020-09-08 | 工件处理装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019183628 | 2019-10-04 | ||
JP2019183628 | 2019-10-04 |
Publications (2)
Publication Number | Publication Date |
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JP2021059001A JP2021059001A (ja) | 2021-04-15 |
JP6929579B2 true JP6929579B2 (ja) | 2021-09-01 |
Family
ID=75379480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2020144146A Active JP6929579B2 (ja) | 2019-10-04 | 2020-08-28 | ワーク処理装置 |
Country Status (2)
Country | Link |
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JP (1) | JP6929579B2 (ja) |
CN (1) | CN113767462A (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5942850U (ja) * | 1982-09-10 | 1984-03-21 | 新日本製鐵株式会社 | 湿式ブラスト脱スケ−ル装置のスラリ−供給装置 |
JP2003326460A (ja) * | 2002-05-02 | 2003-11-18 | Fuji Kikai:Kk | ローターによる湿式ブラスト装置 |
JP2007021601A (ja) * | 2005-07-13 | 2007-02-01 | Nissanki:Kk | ショットブラスト装置 |
JP4969839B2 (ja) * | 2005-11-30 | 2012-07-04 | マコー株式会社 | ウエットブラスト処理装置 |
JP5523507B2 (ja) * | 2012-06-16 | 2014-06-18 | マコー株式会社 | ワーク表面処理装置 |
CN103465174B (zh) * | 2013-09-30 | 2015-08-19 | 杭州浙达精益机电技术股份有限公司 | 型钢的多角度抛丸除鳞装置 |
JP7287037B2 (ja) * | 2019-03-20 | 2023-06-06 | 株式会社プロテリアル | R-t-b系焼結磁石の表面処理方法および製造方法 |
-
2020
- 2020-08-28 JP JP2020144146A patent/JP6929579B2/ja active Active
- 2020-09-08 CN CN202080030608.2A patent/CN113767462A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2021059001A (ja) | 2021-04-15 |
CN113767462A (zh) | 2021-12-07 |
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