CN113767462A - 工件处理装置 - Google Patents

工件处理装置 Download PDF

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Publication number
CN113767462A
CN113767462A CN202080030608.2A CN202080030608A CN113767462A CN 113767462 A CN113767462 A CN 113767462A CN 202080030608 A CN202080030608 A CN 202080030608A CN 113767462 A CN113767462 A CN 113767462A
Authority
CN
China
Prior art keywords
slurry
workpiece
section
cleaning
concentration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080030608.2A
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English (en)
Chinese (zh)
Inventor
村山一成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Macoho Co Ltd
Original Assignee
Macoho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macoho Co Ltd filed Critical Macoho Co Ltd
Priority claimed from PCT/JP2020/033965 external-priority patent/WO2021065381A1/ja
Publication of CN113767462A publication Critical patent/CN113767462A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
CN202080030608.2A 2019-10-04 2020-09-08 工件处理装置 Pending CN113767462A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019183628 2019-10-04
JP2019-183628 2019-10-04
JP2020-144146 2020-08-28
JP2020144146A JP6929579B2 (ja) 2019-10-04 2020-08-28 ワーク処理装置
PCT/JP2020/033965 WO2021065381A1 (ja) 2019-10-04 2020-09-08 ワーク処理装置

Publications (1)

Publication Number Publication Date
CN113767462A true CN113767462A (zh) 2021-12-07

Family

ID=75379480

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080030608.2A Pending CN113767462A (zh) 2019-10-04 2020-09-08 工件处理装置

Country Status (2)

Country Link
JP (1) JP6929579B2 (ja)
CN (1) CN113767462A (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007152441A (ja) * 2005-11-30 2007-06-21 Macoho Co Ltd ウエットブラスト処理装置
CN103465174A (zh) * 2013-09-30 2013-12-25 杭州浙大精益机电技术工程有限公司 型钢的多角度抛丸除鳞装置
JP2014000623A (ja) * 2012-06-16 2014-01-09 Macoho Co Ltd ワーク表面処理装置
JP2019104106A (ja) * 2019-03-20 2019-06-27 日立金属株式会社 Ｒ−ｔ−ｂ系焼結磁石の表面処理方法および製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5942850U (ja) * 1982-09-10 1984-03-21 新日本製鐵株式会社 湿式ブラスト脱スケ−ル装置のスラリ−供給装置
JP2003326460A (ja) * 2002-05-02 2003-11-18 Fuji Kikai:Kk ローターによる湿式ブラスト装置
JP2007021601A (ja) * 2005-07-13 2007-02-01 Nissanki:Kk ショットブラスト装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007152441A (ja) * 2005-11-30 2007-06-21 Macoho Co Ltd ウエットブラスト処理装置
JP2014000623A (ja) * 2012-06-16 2014-01-09 Macoho Co Ltd ワーク表面処理装置
CN103465174A (zh) * 2013-09-30 2013-12-25 杭州浙大精益机电技术工程有限公司 型钢的多角度抛丸除鳞装置
JP2019104106A (ja) * 2019-03-20 2019-06-27 日立金属株式会社 Ｒ−ｔ−ｂ系焼結磁石の表面処理方法および製造方法

Also Published As

Publication number Publication date
JP6929579B2 (ja) 2021-09-01
JP2021059001A (ja) 2021-04-15

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