JP6926018B2 - 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法 - Google Patents

転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法 Download PDF

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Publication number
JP6926018B2
JP6926018B2 JP2018061743A JP2018061743A JP6926018B2 JP 6926018 B2 JP6926018 B2 JP 6926018B2 JP 2018061743 A JP2018061743 A JP 2018061743A JP 2018061743 A JP2018061743 A JP 2018061743A JP 6926018 B2 JP6926018 B2 JP 6926018B2
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Japan
Prior art keywords
transfer
chip component
substrate
board
chip
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JP2018061743A
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English (en)
Japanese (ja)
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JP2019175978A5 (enExample
JP2019175978A (ja
Inventor
靖典 橋本
靖典 橋本
昇 朝日
昇 朝日
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Toray Engineering Co Ltd
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Toray Engineering Co Ltd
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Publication date
Application filed by Toray Engineering Co Ltd filed Critical Toray Engineering Co Ltd
Priority to JP2018061743A priority Critical patent/JP6926018B2/ja
Priority to PCT/JP2019/009222 priority patent/WO2019188105A1/ja
Priority to TW108110276A priority patent/TWI758594B/zh
Publication of JP2019175978A publication Critical patent/JP2019175978A/ja
Publication of JP2019175978A5 publication Critical patent/JP2019175978A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Led Device Packages (AREA)
JP2018061743A 2018-03-28 2018-03-28 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法 Active JP6926018B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018061743A JP6926018B2 (ja) 2018-03-28 2018-03-28 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法
PCT/JP2019/009222 WO2019188105A1 (ja) 2018-03-28 2019-03-08 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法
TW108110276A TWI758594B (zh) 2018-03-28 2019-03-25 轉印基板及使用其之安裝方法、以及圖像顯示裝置之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018061743A JP6926018B2 (ja) 2018-03-28 2018-03-28 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法

Publications (3)

Publication Number Publication Date
JP2019175978A JP2019175978A (ja) 2019-10-10
JP2019175978A5 JP2019175978A5 (enExample) 2021-02-04
JP6926018B2 true JP6926018B2 (ja) 2021-08-25

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JP2018061743A Active JP6926018B2 (ja) 2018-03-28 2018-03-28 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法

Country Status (3)

Country Link
JP (1) JP6926018B2 (enExample)
TW (1) TWI758594B (enExample)
WO (1) WO2019188105A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11749585B2 (en) * 2020-02-28 2023-09-05 Intel Corporation High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package
JP2022115687A (ja) * 2021-01-28 2022-08-09 東レエンジニアリング株式会社 転写装置
JP7463153B2 (ja) * 2020-03-23 2024-04-08 東レエンジニアリング株式会社 実装方法および実装装置
WO2021193135A1 (ja) * 2020-03-23 2021-09-30 東レエンジニアリング株式会社 実装方法、実装装置、および転写装置
TWI744181B (zh) * 2021-01-28 2021-10-21 台灣愛司帝科技股份有限公司 晶片移轉模組以及晶片移轉與固晶裝置與方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008130861A (ja) * 2006-11-22 2008-06-05 Sony Corp シリコーンゴム層積層体及びその製造方法、突当て装置、実装用基板への物品の実装方法、並びに、発光ダイオード表示装置の製造方法
TWI590498B (zh) * 2013-06-03 2017-07-01 財團法人工業技術研究院 電子元件的轉移方法及電子元件陣列
TWI635591B (zh) * 2013-11-05 2018-09-11 Senju Metal Industry Co., Ltd. 焊料轉印薄片
JP2015130476A (ja) * 2013-12-04 2015-07-16 日東電工株式会社 光半導体装置用エポキシ樹脂組成物およびそれを用いて得られる光半導体装置用リードフレーム、封止型光半導体素子ならびに光半導体装置
JP6446951B2 (ja) * 2014-09-26 2019-01-09 日亜化学工業株式会社 素子の実装方法及び発光装置の製造方法
KR101990227B1 (ko) * 2014-12-05 2019-06-17 히타치가세이가부시끼가이샤 반도체용 접착제, 및, 반도체 장치 및 그 제조 방법
JP2016167544A (ja) * 2015-03-10 2016-09-15 ソニー株式会社 電子部品、電子部品実装基板及び電子部品の実装方法
JP6504263B2 (ja) * 2015-10-29 2019-04-24 日立化成株式会社 半導体用接着剤、半導体装置及びそれを製造する方法
US11186757B2 (en) * 2016-02-08 2021-11-30 Toray Industries, Inc. Resin composition, resin layer, permanent adhesive, adhesive for temporary bonding, laminated film, processed wafer, and method for manufacturing electronic component or semiconductor device
CN109075088B (zh) * 2016-05-09 2022-01-07 昭和电工材料株式会社 半导体装置的制造方法

Also Published As

Publication number Publication date
TWI758594B (zh) 2022-03-21
WO2019188105A1 (ja) 2019-10-03
TW202004933A (zh) 2020-01-16
JP2019175978A (ja) 2019-10-10

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