JP6898936B2 - ウエハ供給装置および部品実装装置 - Google Patents
ウエハ供給装置および部品実装装置 Download PDFInfo
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- JP6898936B2 JP6898936B2 JP2018541770A JP2018541770A JP6898936B2 JP 6898936 B2 JP6898936 B2 JP 6898936B2 JP 2018541770 A JP2018541770 A JP 2018541770A JP 2018541770 A JP2018541770 A JP 2018541770A JP 6898936 B2 JP6898936 B2 JP 6898936B2
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- 230000003028 elevating effect Effects 0.000 claims description 151
- 238000000034 method Methods 0.000 description 33
- 238000010586 diagram Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- 239000008188 pellet Substances 0.000 description 9
- 238000012546 transfer Methods 0.000 description 8
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Operations Research (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Description
Claims (4)
- 複数の部品に分割されたウエハが貼着されたシートから部品をノズルによりピックアップして対象物に実装する部品実装装置に用いられるウエハ供給装置であって、
前記ノズルがピックアップしようとする部品を前記シートの裏側から押し上げるための押上部と、
昇降部材を昇降させる第1押上部昇降装置と、
前記第1押上部昇降装置により前記昇降部材と共に昇降され、該昇降部材に対して相対的に前記押上部を昇降させる第2押上部昇降装置と、
前記押上部に作用する荷重を測定する荷重測定部と、
前記ノズルにより前記部品がピックアップされる際に、前記押上部が所定の押上位置まで押し上げられるよう前記第1押上部昇降装置を制御し、前記押上部で前記部品が押し上げられている状態で前記荷重測定部により測定される荷重が目標荷重に保持されるよう前記第2押上部昇降装置を制御するものであり、前記押上部の押し上げ量または押し上げ位置に応じて前記目標荷重を変化させる制御部と、
を備えることを特徴とするウエハ供給装置。 - 複数の部品に分割されたウエハが貼着されたシートから部品をノズルによりピックアップして対象物に実装する部品実装装置であって、
ヘッドと、
ノズルと、
前記ヘッドに対して前記ノズルを昇降させるノズル昇降装置と、
前記ノズルがピックアップしようとする部品を前記シートの裏側から押し上げるための押上部と、
昇降部材を昇降させる第1押上部昇降装置と、
前記第1押上部昇降装置により前記昇降部材と共に昇降され該昇降部材に対して相対的に前記押上部を昇降させる第2押上部昇降装置と、
前記押上部に作用する荷重を測定する荷重測定部と、
前記ノズルが所定のノズル位置まで下降すると共に前記押上部が所定の押上位置まで押し上げられるよう前記ノズル昇降装置と前記第1押上部昇降装置を制御し、前記押上部で前記部品が押し上げられている状態で前記荷重測定部により測定される荷重が目標荷重に保持されるよう前記第2押上部昇降装置を制御するものであり、前記押上部の押し上げ量または押し上げ位置に応じて前記目標荷重を変化させる制御部と、
を備えることを特徴とする部品実装装置。 - 複数の部品に分割されたウエハが貼着されたシートから部品をノズルによりピックアップして対象物に実装する部品実装装置であって、
ヘッドと、
ノズルと、
前記ヘッドに対して昇降部材を昇降させる第1ノズル昇降装置と、
前記昇降部材と共に昇降され、前記昇降部材に対して前記ノズルを相対的に昇降させる第2ノズル昇降装置と、
前記ノズルがピックアップしようとする部品を前記シートの裏側から押し上げるための押上部と、
前記押上部を昇降させる押上部昇降装置と、
前記ノズルに作用する荷重を測定する荷重測定部と、
前記ノズルが所定のノズル位置まで下降すると共に前記押上部が所定の押上位置まで押し上げられるよう前記第1ノズル昇降装置と前記押上部昇降装置を制御し、前記ノズルが前記部品に当接すると共に前記押上部で該部品が押し上げられている状態で前記荷重測定部により測定される荷重が目標荷重に保持されるよう前記第2ノズル昇降装置を制御するものであり、前記押上部の押し上げ量または押し上げ位置に応じて前記目標荷重を変化させる制御部と、
を備えることを特徴とする部品実装装置。 - 請求項3記載の部品実装装置であって、
前記制御部は、前記ノズルが前記所定のノズル位置まで下降するよう前記第1ノズル昇降装置を制御し、該ノズルが前記部品に当接して前記荷重測定部により測定される荷重が所定の荷重範囲内となるよう前記第2ノズル昇降装置を制御し、前記押上部により前記部品が押し上げられるよう前記押上部昇降装置を制御し、前記ノズルが前記部品に当接すると共に前記押上部で該部品が押し上げられている状態で前記荷重測定部により測定される荷重が前記目標荷重に保持されるよう前記第2ノズル昇降装置を制御する、
ことを特徴とする部品実装装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2016/078585 WO2018061103A1 (ja) | 2016-09-28 | 2016-09-28 | ウエハ供給装置および部品実装装置 |
Publications (2)
Publication Number | Publication Date |
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JPWO2018061103A1 JPWO2018061103A1 (ja) | 2019-07-11 |
JP6898936B2 true JP6898936B2 (ja) | 2021-07-07 |
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Application Number | Title | Priority Date | Filing Date |
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JP2018541770A Active JP6898936B2 (ja) | 2016-09-28 | 2016-09-28 | ウエハ供給装置および部品実装装置 |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP3522207B1 (ja) |
JP (1) | JP6898936B2 (ja) |
WO (1) | WO2018061103A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7237655B2 (ja) * | 2019-03-01 | 2023-03-13 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
JP7421412B2 (ja) | 2020-05-01 | 2024-01-24 | 株式会社Fuji | 吸着装置の状態判定装置 |
CN112802793A (zh) * | 2021-02-09 | 2021-05-14 | 深圳市卓兴半导体科技有限公司 | 运行机构和晶片吸附装置 |
US20240076142A1 (en) * | 2021-03-16 | 2024-03-07 | Shinkawa Ltd. | Conveyance device, conveyance method, and non-transitory computer readable medium |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2658915B2 (ja) * | 1994-11-04 | 1997-09-30 | 日本電気株式会社 | 半導体チップ移載装置 |
JPH0969553A (ja) * | 1995-08-30 | 1997-03-11 | Toshiba Corp | 半導体装置の製造装置および製造方法 |
JPH10150093A (ja) * | 1996-11-20 | 1998-06-02 | Hitachi Ltd | ピックアップ装置 |
JP4136733B2 (ja) * | 2003-03-11 | 2008-08-20 | 芝浦メカトロニクス株式会社 | ペレットボンディング方法及びペレットボンディング装置 |
JP4644481B2 (ja) * | 2004-12-24 | 2011-03-02 | Juki株式会社 | 電子部品圧着搭載装置 |
JP2008141068A (ja) * | 2006-12-04 | 2008-06-19 | Shibaura Mechatronics Corp | 半導体チップのピックアップ装置及びピックアップ方法 |
JP5080861B2 (ja) * | 2007-05-29 | 2012-11-21 | 大崎エンジニアリング株式会社 | ピックアップ装置およびピックアップ方法 |
JP5702157B2 (ja) * | 2011-01-11 | 2015-04-15 | Juki株式会社 | 電子部品実装装置 |
JP6103745B2 (ja) * | 2012-05-29 | 2017-03-29 | 富士機械製造株式会社 | 突き上げ高さ計測システム |
EP2925110B1 (en) * | 2012-11-21 | 2019-08-14 | FUJI Corporation | Electronic-circuit-component-mounting head |
JP6312807B2 (ja) * | 2014-03-17 | 2018-04-18 | 株式会社Fuji | 部品装着ヘッド |
JP2016131230A (ja) * | 2015-01-15 | 2016-07-21 | パイオニア株式会社 | 突上げ装置及び突上げ方法 |
JP3205044U (ja) * | 2016-04-20 | 2016-06-30 | リンテック株式会社 | ピックアップ装置 |
-
2016
- 2016-09-28 JP JP2018541770A patent/JP6898936B2/ja active Active
- 2016-09-28 EP EP16917656.7A patent/EP3522207B1/en active Active
- 2016-09-28 WO PCT/JP2016/078585 patent/WO2018061103A1/ja unknown
Also Published As
Publication number | Publication date |
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WO2018061103A1 (ja) | 2018-04-05 |
EP3522207A4 (en) | 2019-10-02 |
EP3522207B1 (en) | 2020-09-16 |
JPWO2018061103A1 (ja) | 2019-07-11 |
EP3522207A1 (en) | 2019-08-07 |
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