JP6886831B2 - 粘着シート及びそれを用いた半導体チップ又は半導体部品の製造方法 - Google Patents

粘着シート及びそれを用いた半導体チップ又は半導体部品の製造方法 Download PDF

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JP6886831B2
JP6886831B2 JP2017023573A JP2017023573A JP6886831B2 JP 6886831 B2 JP6886831 B2 JP 6886831B2 JP 2017023573 A JP2017023573 A JP 2017023573A JP 2017023573 A JP2017023573 A JP 2017023573A JP 6886831 B2 JP6886831 B2 JP 6886831B2
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adhesive sheet
base film
sensitive adhesive
dicing
pressure
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Japanese (ja)
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JP2018129491A (ja
JP2018129491A5 (https=
Inventor
九津見　正信
正信 九津見
秀 田中
秀 田中
一樹 飯塚
一樹 飯塚
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Denka Co Ltd
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Denka Co Ltd
Denki Kagaku Kogyo KK
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  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesive Tapes (AREA)
JP2017023573A 2017-02-10 2017-02-10 粘着シート及びそれを用いた半導体チップ又は半導体部品の製造方法 Active JP6886831B2 (ja)

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JP2017023573A JP6886831B2 (ja) 2017-02-10 2017-02-10 粘着シート及びそれを用いた半導体チップ又は半導体部品の製造方法

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JP2017023573A JP6886831B2 (ja) 2017-02-10 2017-02-10 粘着シート及びそれを用いた半導体チップ又は半導体部品の製造方法

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JP2018129491A JP2018129491A (ja) 2018-08-16
JP2018129491A5 JP2018129491A5 (https=) 2020-02-27
JP6886831B2 true JP6886831B2 (ja) 2021-06-16

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102176416B1 (ko) * 2019-04-24 2020-11-10 스카이다이아몬드 주식회사 형광 박판 다이싱 방법
CN111334217B (zh) * 2020-05-18 2020-08-04 苏州世华新材料科技股份有限公司 一种分区固化高填充ab胶，制备方法及其应用
JP2022038213A (ja) * 2020-08-26 2022-03-10 日東電工株式会社 部材加工方法
JP2023048104A (ja) * 2021-09-27 2023-04-06 リンテック株式会社 半導体加工用粘着シート及び半導体装置の製造方法
JP2025126750A (ja) * 2024-02-19 2025-08-29 デンカ株式会社 ダイシングテープ及びウェハ加工方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0665548A (ja) * 1992-08-25 1994-03-08 Mitsui Toatsu Chem Inc 半導体ウエハ表面保護用粘着テープの製造方法
JPH1116863A (ja) * 1997-06-25 1999-01-22 Mitsui Chem Inc 半導体ウエハの裏面研削方法及び該方法に用いる粘着フィルム
JP4369280B2 (ja) * 2004-04-12 2009-11-18 グンゼ株式会社 ダイシングシ−ト用基体フイルム
JP5032740B2 (ja) * 2004-11-11 2012-09-26 電気化学工業株式会社 半導体部材の製造方法
JP4429883B2 (ja) * 2004-11-30 2010-03-10 キヤノンマシナリー株式会社 ペレットピックアップ方法及びピックアップ装置
JP5351458B2 (ja) * 2008-07-29 2013-11-27 リンテック株式会社 ウェハ加工用接着シートおよび半導体装置の製造方法
KR102430472B1 (ko) * 2014-12-25 2022-08-05 덴카 주식회사 레이저 다이싱용 점착 시트 및 반도체 장치의 제조 방법

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