JP6886831B2 - 粘着シート及びそれを用いた半導体チップ又は半導体部品の製造方法 - Google Patents
粘着シート及びそれを用いた半導体チップ又は半導体部品の製造方法 Download PDFInfo
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- JP6886831B2 JP6886831B2 JP2017023573A JP2017023573A JP6886831B2 JP 6886831 B2 JP6886831 B2 JP 6886831B2 JP 2017023573 A JP2017023573 A JP 2017023573A JP 2017023573 A JP2017023573 A JP 2017023573A JP 6886831 B2 JP6886831 B2 JP 6886831B2
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- adhesive sheet
- base film
- sensitive adhesive
- dicing
- pressure
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Images
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| JP2022038213A (ja) * | 2020-08-26 | 2022-03-10 | 日東電工株式会社 | 部材加工方法 |
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| JPH1116863A (ja) * | 1997-06-25 | 1999-01-22 | Mitsui Chem Inc | 半導体ウエハの裏面研削方法及び該方法に用いる粘着フィルム |
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| JP5032740B2 (ja) * | 2004-11-11 | 2012-09-26 | 電気化学工業株式会社 | 半導体部材の製造方法 |
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| JP5351458B2 (ja) * | 2008-07-29 | 2013-11-27 | リンテック株式会社 | ウェハ加工用接着シートおよび半導体装置の製造方法 |
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