JP6880567B2 - 半導体封止用エポキシ樹脂組成物および半導体装置の製造方法 - Google Patents
半導体封止用エポキシ樹脂組成物および半導体装置の製造方法 Download PDFInfo
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- JP6880567B2 JP6880567B2 JP2016087987A JP2016087987A JP6880567B2 JP 6880567 B2 JP6880567 B2 JP 6880567B2 JP 2016087987 A JP2016087987 A JP 2016087987A JP 2016087987 A JP2016087987 A JP 2016087987A JP 6880567 B2 JP6880567 B2 JP 6880567B2
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JP2016087987A JP6880567B2 (ja) | 2016-04-26 | 2016-04-26 | 半導体封止用エポキシ樹脂組成物および半導体装置の製造方法 |
TW106111628A TWI796293B (zh) | 2016-04-26 | 2017-04-07 | 半導體密封用環氧樹脂組成物及半導體裝置之製造方法 |
KR1020170050474A KR102408026B1 (ko) | 2016-04-26 | 2017-04-19 | 반도체 봉지용 에폭시 수지 조성물 및 반도체 장치의 제조 방법 |
CN201710280186.4A CN107400334A (zh) | 2016-04-26 | 2017-04-25 | 半导体密封用环氧树脂组合物和半导体装置的制造方法 |
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JP2018024832A (ja) * | 2016-07-29 | 2018-02-15 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物および半導体装置 |
CN111433284B (zh) * | 2017-12-06 | 2021-01-05 | 住友电木株式会社 | 环氧树脂组合物和电子装置 |
JP2019099726A (ja) * | 2017-12-06 | 2019-06-24 | 住友ベークライト株式会社 | エポキシ樹脂および電子装置 |
WO2019229961A1 (ja) * | 2018-05-31 | 2019-12-05 | 日立化成株式会社 | コンパウンド、成形体、及び電子部品 |
JP7158184B2 (ja) * | 2018-06-28 | 2022-10-21 | 日東電工株式会社 | 封止用シートおよび電子素子装置の製造方法 |
WO2020026818A1 (ja) * | 2018-07-31 | 2020-02-06 | 京セラ株式会社 | フレーク状封止用樹脂組成物、および半導体装置 |
CN113265211A (zh) * | 2021-05-13 | 2021-08-17 | 苏州震坤科技有限公司 | 减少封装分层的封装树脂及其封装方法 |
KR102571498B1 (ko) | 2021-09-28 | 2023-08-28 | 주식회사 케이씨씨 | 몰딩용 에폭시 수지 조성물 |
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JP3594489B2 (ja) | 1998-07-03 | 2004-12-02 | 京セラケミカル株式会社 | 樹脂封止型電子部品の製造方法 |
JP2002080696A (ja) * | 2000-06-28 | 2002-03-19 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP4047613B2 (ja) * | 2002-03-29 | 2008-02-13 | 住友ベークライト株式会社 | 液状封止樹脂及びそれを用いた半導体装置 |
JP4336499B2 (ja) | 2003-01-09 | 2009-09-30 | Towa株式会社 | 電子部品の樹脂封止成形方法及び装置 |
JP4474113B2 (ja) * | 2003-04-07 | 2010-06-02 | 日立化成工業株式会社 | 封止用固形エポキシ樹脂成形材料及び半導体装置 |
CN100462402C (zh) * | 2004-04-30 | 2009-02-18 | 日东电工株式会社 | 半导体封装用环氧树脂组合物、半导体器件及其制造方法 |
JP4421939B2 (ja) * | 2004-05-13 | 2010-02-24 | 日東電工株式会社 | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
JP2006216899A (ja) | 2005-02-07 | 2006-08-17 | Kyocera Chemical Corp | コンプレッション成形用成形材料及び樹脂封止型半導体装置 |
JP6135991B2 (ja) * | 2012-10-11 | 2017-05-31 | パナソニックIpマネジメント株式会社 | 封止用エポキシ樹脂無機複合シート |
JP2014210880A (ja) * | 2013-04-19 | 2014-11-13 | 日東電工株式会社 | 熱硬化性樹脂組成物及び半導体装置の製造方法 |
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JP7230936B2 (ja) | 2021-01-06 | 2023-03-01 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物および半導体装置の製造方法 |
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KR102408026B1 (ko) | 2022-06-14 |
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KR20170122120A (ko) | 2017-11-03 |
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