JP6880567B2 - 半導体封止用エポキシ樹脂組成物および半導体装置の製造方法 - Google Patents

半導体封止用エポキシ樹脂組成物および半導体装置の製造方法 Download PDF

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JP6880567B2
JP6880567B2 JP2016087987A JP2016087987A JP6880567B2 JP 6880567 B2 JP6880567 B2 JP 6880567B2 JP 2016087987 A JP2016087987 A JP 2016087987A JP 2016087987 A JP2016087987 A JP 2016087987A JP 6880567 B2 JP6880567 B2 JP 6880567B2
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epoxy resin
resin composition
semiconductor
encapsulating
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JP2017197620A (ja
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田中　祐介
祐介 田中
隆秀 松永
隆秀 松永
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2016087987A priority Critical patent/JP6880567B2/ja
Priority to TW106111628A priority patent/TWI796293B/zh
Priority to KR1020170050474A priority patent/KR102408026B1/ko
Priority to CN201710280186.4A priority patent/CN107400334A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C08L2203/162—Applications used for films sealable films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2016087987A 2016-04-26 2016-04-26 半導体封止用エポキシ樹脂組成物および半導体装置の製造方法 Active JP6880567B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016087987A JP6880567B2 (ja) 2016-04-26 2016-04-26 半導体封止用エポキシ樹脂組成物および半導体装置の製造方法
TW106111628A TWI796293B (zh) 2016-04-26 2017-04-07 半導體密封用環氧樹脂組成物及半導體裝置之製造方法
KR1020170050474A KR102408026B1 (ko) 2016-04-26 2017-04-19 반도체 봉지용 에폭시 수지 조성물 및 반도체 장치의 제조 방법
CN201710280186.4A CN107400334A (zh) 2016-04-26 2017-04-25 半导体密封用环氧树脂组合物和半导体装置的制造方法

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JP2016087987A JP6880567B2 (ja) 2016-04-26 2016-04-26 半導体封止用エポキシ樹脂組成物および半導体装置の製造方法

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JP6880567B2 true JP6880567B2 (ja) 2021-06-02

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KR (1) KR102408026B1 (zh)
CN (1) CN107400334A (zh)
TW (1) TWI796293B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021059741A (ja) * 2021-01-06 2021-04-15 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および半導体装置の製造方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018024832A (ja) * 2016-07-29 2018-02-15 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
CN111433284B (zh) * 2017-12-06 2021-01-05 住友电木株式会社 环氧树脂组合物和电子装置
JP2019099726A (ja) * 2017-12-06 2019-06-24 住友ベークライト株式会社 エポキシ樹脂および電子装置
WO2019229961A1 (ja) * 2018-05-31 2019-12-05 日立化成株式会社 コンパウンド、成形体、及び電子部品
JP7158184B2 (ja) * 2018-06-28 2022-10-21 日東電工株式会社 封止用シートおよび電子素子装置の製造方法
WO2020026818A1 (ja) * 2018-07-31 2020-02-06 京セラ株式会社 フレーク状封止用樹脂組成物、および半導体装置
CN113265211A (zh) * 2021-05-13 2021-08-17 苏州震坤科技有限公司 减少封装分层的封装树脂及其封装方法
KR102571498B1 (ko) 2021-09-28 2023-08-28 주식회사 케이씨씨 몰딩용 에폭시 수지 조성물

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
JP3594489B2 (ja) 1998-07-03 2004-12-02 京セラケミカル株式会社 樹脂封止型電子部品の製造方法
JP2002080696A (ja) * 2000-06-28 2002-03-19 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP4047613B2 (ja) * 2002-03-29 2008-02-13 住友ベークライト株式会社 液状封止樹脂及びそれを用いた半導体装置
JP4336499B2 (ja) 2003-01-09 2009-09-30 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP4474113B2 (ja) * 2003-04-07 2010-06-02 日立化成工業株式会社 封止用固形エポキシ樹脂成形材料及び半導体装置
CN100462402C (zh) * 2004-04-30 2009-02-18 日东电工株式会社 半导体封装用环氧树脂组合物、半导体器件及其制造方法
JP4421939B2 (ja) * 2004-05-13 2010-02-24 日東電工株式会社 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置
JP2006216899A (ja) 2005-02-07 2006-08-17 Kyocera Chemical Corp コンプレッション成形用成形材料及び樹脂封止型半導体装置
JP6135991B2 (ja) * 2012-10-11 2017-05-31 パナソニックＩｐマネジメント株式会社 封止用エポキシ樹脂無機複合シート
JP2014210880A (ja) * 2013-04-19 2014-11-13 日東電工株式会社 熱硬化性樹脂組成物及び半導体装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021059741A (ja) * 2021-01-06 2021-04-15 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および半導体装置の製造方法
JP7230936B2 (ja) 2021-01-06 2023-03-01 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および半導体装置の製造方法

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Publication number Publication date
TW201809126A (zh) 2018-03-16
KR102408026B1 (ko) 2022-06-14
JP2017197620A (ja) 2017-11-02
KR20170122120A (ko) 2017-11-03
TWI796293B (zh) 2023-03-21
CN107400334A (zh) 2017-11-28

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